Download or read book Investigation of Electromigration Mechanisms in Silver Thin Films written by Christopher Joseph Waskiewicz and published by . This book was released on 1992 with total page 60 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Masters Theses in the Pure and Applied Sciences written by Wade H. Shafer and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 426 pages. Available in PDF, EPUB and Kindle. Book excerpt: Masters Theses in the Pure and Applied Sciences was first conceived, published, and disseminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS)* at Purdue University in 1957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dis semination phases of the activity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thought that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all concerned if the printing and distribution of the volumes were handled by an international publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Corporation of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 38 (thesis year 1993) a total of 13,787 thesis titles from 22 Canadian and 164 United States universities. We are sure that this broader base for these titles reported will greatly enhance the value of this impor tant annual reference work. While Volume 38 reports theses submitted in 1993, on occasion, certain uni versities do report theses submitted in previous years but not reported at the time.

Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on with total page 994 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Fundamentals of Electromigration Aware Integrated Circuit Design written by Jens Lienig and published by Springer. This book was released on 2018-02-23 with total page 171 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.

Download or read book A One Semester Course in Modeling of VSLI Interconnections written by Ashok Goel and published by Momentum Press. This book was released on 2014-12-29 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt: Quantitative understanding of the parasitic capacitances and inductances, and the resultant propagation delays and crosstalk phenomena associated with the metallic interconnections on the very large scale integrated (VLSI) circuits has become extremely important for the optimum design of the state-of-the-art integrated circuits. More than 65 percent of the delays on the integrated circuit chip occur in the interconnections and not in the transistors on the chip. Mathematical techniques to model the parasitic capacitances, inductances, propagation delays, crosstalk noise, and electromigration-induced failure associated with the interconnections in the realistic high-density environment on a chip will be discussed. A One-Semester Course in Modeling of VLSI Interconnections also includes an overview of the future interconnection technologies for the nanotechnology circuits.

Download or read book Study of the Early Stage of Electromigration in Gold Thin Films written by Shanyan Bai and published by . This book was released on 1998 with total page 418 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book The Journal of Physics and Chemistry of Solids written by and published by . This book was released on 1972 with total page 614 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1974 with total page 760 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Electromigration in Thin Films and Electronic Devices written by Choong-Un Kim and published by . This book was released on 2011 with total page 329 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Energy Research Abstracts written by and published by . This book was released on 1985 with total page 912 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Nuclear Science Abstracts written by and published by . This book was released on 1975-03 with total page 988 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Physics Briefs written by and published by . This book was released on 1993 with total page 1058 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book A Study of Electromigration in Thin Gold Films written by William Lee Harrod and published by . This book was released on 1975 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book An Investigation of the Electrical Conduction Mechanism in the Ultra Thin Films of Gold Platinum written by A. Barr and published by . This book was released on 1973 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Microcircuit Reliability Bibliography written by and published by . This book was released on 1978 with total page 412 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book The Nature and Behavior of Grain Boundaries written by Anning Hu and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 441 pages. Available in PDF, EPUB and Kindle. Book excerpt: In view of the dramatically increased interest in the study of grain boundaries during the past few years, the Physical Metal lurgy Committee of The Institute of Metals Division of The Metal lurgical Society, AIME, sponsored a four-session symposium on the NATURE AND BEHAVIOR OF GRAIN BOUNDARIES, at the TMS-AIME Fall Meeting in Detroit, Michigan, October 18-19, 1971. The main ob jectives of this symposium were to examine the more recent develop ments, theoretical and experimental, in our understanding of grain boundaries, and to stimulate further studies in these and related areas. This volume contains most of the papers presented at the Symposium. It is regrettable that space limitations allow the inclusion of only four of the unsolicited papers, in addition to thirteen invited papers. The papers are grouped into three sections according to their major content: STRUCTURE OF GRAIN BOUNDARIES, ENERGETICS OF GRAIN BOUNDARIES, and GRAIN BOUNDARY MOTION AND RELATED PHENOMENA. Grain boundaries, or crystal interfaces, have been of both academic and practical interest for many years. An early seminar on "Metal Interfaces" was documented in 1952 by ASM. The Fourth Metallurgical Colloquium held in France, 1960, had a broad coverage on "Properties of Grain Boundaries". More recently the Australian Institute of Metals sponsored a conference on interfaces, with the proceedings being published by Butterworths in 1969.

Download or read book Electromigration in Aluminum Gold and Silver Thin Films written by Hans Joachim Geier and published by . This book was released on 1974 with total page 180 pages. Available in PDF, EPUB and Kindle. Book excerpt: