Download or read book Introducing Technology Computer Aided Design TCAD written by Chinmay K. Maiti and published by CRC Press. This book was released on 2017-03-16 with total page 438 pages. Available in PDF, EPUB and Kindle. Book excerpt: This might be the first book that deals mostly with the 3D technology computer-aided design (TCAD) simulations of major state-of-the-art stress- and strain-engineered advanced semiconductor devices: MOSFETs, BJTs, HBTs, nonclassical MOS devices, finFETs, silicon-germanium hetero-FETs, solar cells, power devices, and memory devices. The book focuses on how to set up 3D TCAD simulation tools, from mask layout to process and device simulation, including design for manufacturing (DFM), and from device modeling to SPICE parameter extraction. The book also offers an innovative and new approach to teaching the fundamentals of semiconductor process and device design using advanced TCAD simulations of various semiconductor structures. The simulation examples chosen are from the most popular devices in use today and provide useful technology and device physics insights. To extend the role of TCAD in today’s advanced technology era, process compact modeling and DFM issues have been included for design–technology interface generation. Unique in approach, this book provides an integrated view of silicon technology and beyond—with emphasis on TCAD simulations. It is the first book to provide a web-based online laboratory for semiconductor device characterization and SPICE parameter extraction. It describes not only the manufacturing practice associated with the technologies used but also the underlying scientific basis for those technologies. Written from an engineering standpoint, this book provides the process design and simulation background needed to understand new and future technology development, process modeling, and design of nanoscale transistors. The book also advances the understanding and knowledge of modern IC design via TCAD, improves the quality in micro- and nanoelectronics R&D, and supports the training of semiconductor specialists. It is intended as a textbook or reference for graduate students in the field of semiconductor fabrication and as a reference for engineers involved in VLSI technology development who have to solve device and process problems. CAD specialists will also find this book useful since it discusses the organization of the simulation system, in addition to presenting many case studies where the user applies TCAD tools in different situations.

Download or read book Technology Computer Aided Design written by Chandan Kumar Sarkar and published by CRC Press. This book was released on 2018-09-03 with total page 462 pages. Available in PDF, EPUB and Kindle. Book excerpt: Responding to recent developments and a growing VLSI circuit manufacturing market, Technology Computer Aided Design: Simulation for VLSI MOSFET examines advanced MOSFET processes and devices through TCAD numerical simulations. The book provides a balanced summary of TCAD and MOSFET basic concepts, equations, physics, and new technologies related to TCAD and MOSFET. A firm grasp of these concepts allows for the design of better models, thus streamlining the design process, saving time and money. This book places emphasis on the importance of modeling and simulations of VLSI MOS transistors and TCAD software. Providing background concepts involved in the TCAD simulation of MOSFET devices, it presents concepts in a simplified manner, frequently using comparisons to everyday-life experiences. The book then explains concepts in depth, with required mathematics and program code. This book also details the classical semiconductor physics for understanding the principle of operations for VLSI MOS transistors, illustrates recent developments in the area of MOSFET and other electronic devices, and analyzes the evolution of the role of modeling and simulation of MOSFET. It also provides exposure to the two most commercially popular TCAD simulation tools Silvaco and Sentaurus. • Emphasizes the need for TCAD simulation to be included within VLSI design flow for nano-scale integrated circuits • Introduces the advantages of TCAD simulations for device and process technology characterization • Presents the fundamental physics and mathematics incorporated in the TCAD tools • Includes popular commercial TCAD simulation tools (Silvaco and Sentaurus) • Provides characterization of performances of VLSI MOSFETs through TCAD tools • Offers familiarization to compact modeling for VLSI circuit simulation R&D cost and time for electronic product development is drastically reduced by taking advantage of TCAD tools, making it indispensable for modern VLSI device technologies. They provide a means to characterize the MOS transistors and improve the VLSI circuit simulation procedure. The comprehensive information and systematic approach to design, characterization, fabrication, and computation of VLSI MOS transistor through TCAD tools presented in this book provides a thorough foundation for the development of models that simplify the design verification process and make it cost effective.

Download or read book Integrated Power Devices and TCAD Simulation written by Yue Fu and published by CRC Press. This book was released on 2017-12-19 with total page 366 pages. Available in PDF, EPUB and Kindle. Book excerpt: From power electronics to power integrated circuits (PICs), smart power technologies, devices, and beyond, Integrated Power Devices and TCAD Simulation provides a complete picture of the power management and semiconductor industry. An essential reference for power device engineering students and professionals, the book not only describes the physics inside integrated power semiconductor devices such lateral double-diffused metal oxide semiconductor field-effect transistors (LDMOSFETs), lateral insulated-gate bipolar transistors (LIGBTs), and super junction LDMOSFETs but also delivers a simple introduction to power management systems. Instead of abstract theoretical treatments and daunting equations, the text uses technology computer-aided design (TCAD) simulation examples to explain the design of integrated power semiconductor devices. It also explores next generation power devices such as gallium nitride power high electron mobility transistors (GaN power HEMTs). Including a virtual process flow for smart PIC technology as well as a hard-to-find technology development organization chart, Integrated Power Devices and TCAD Simulation gives students and junior engineers a head start in the field of power semiconductor devices while helping to fill the gap between power device engineering and power management systems.

Download or read book 3D TCAD Simulation for Semiconductor Processes Devices and Optoelectronics written by Simon Li and published by Springer Science & Business Media. This book was released on 2011-10-01 with total page 303 pages. Available in PDF, EPUB and Kindle. Book excerpt: Technology computer-aided design, or TCAD, is critical to today’s semiconductor technology and anybody working in this industry needs to know something about TCAD. This book is about how to use computer software to manufacture and test virtually semiconductor devices in 3D. It brings to life the topic of semiconductor device physics, with a hands-on, tutorial approach that de-emphasizes abstract physics and equations and emphasizes real practice and extensive illustrations. Coverage includes a comprehensive library of devices, representing the state of the art technology, such as SuperJunction LDMOS, GaN LED devices, etc.

Download or read book 3D TCAD Simulation for CMOS Nanoeletronic Devices written by Yung-Chun Wu and published by Springer. This book was released on 2017-06-19 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book demonstrates how to use the Synopsys Sentaurus TCAD 2014 version for the design and simulation of 3D CMOS (complementary metal–oxide–semiconductor) semiconductor nanoelectronic devices, while also providing selected source codes (Technology Computer-Aided Design, TCAD). Instead of the built-in examples of Sentaurus TCAD 2014, the practical cases presented here, based on years of teaching and research experience, are used to interpret and analyze simulation results of the physical and electrical properties of designed 3D CMOSFET (metal–oxide–semiconductor field-effect transistor) nanoelectronic devices. The book also addresses in detail the fundamental theory of advanced semiconductor device design for the further simulation and analysis of electric and physical properties of semiconductor devices. The design and simulation technologies for nano-semiconductor devices explored here are more practical in nature and representative of the semiconductor industry, and as such can promote the development of pioneering semiconductor devices, semiconductor device physics, and more practically-oriented approaches to teaching and learning semiconductor engineering. The book can be used for graduate and senior undergraduate students alike, while also offering a reference guide for engineers and experts in the semiconductor industry. Readers are expected to have some preliminary knowledge of the field.

Download or read book Modeling And Electrothermal Simulation Of Sic Power Devices Using Silvaco Atlas written by Pushpakaran Bejoy N and published by World Scientific. This book was released on 2019-03-25 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt: The primary goal of this book is to provide a sound understanding of wide bandgap Silicon Carbide (SiC) power semiconductor device simulation using Silvaco© ATLAS Technology Computer Aided Design (TCAD) software. Physics-based TCAD modeling of SiC power devices can be extremely challenging due to the wide bandgap of the semiconductor material. The material presented in this book aims to shorten the learning curve required to start successful SiC device simulation by providing a detailed explanation of simulation code and the impact of various modeling and simulation parameters on the simulation results. Non-isothermal simulation to predict heat dissipation and lattice temperature rise in a SiC device structure under switching condition has been explained in detail. Key pointers including runtime error messages, code debugging, implications of using certain models and parameter values, and other factors beneficial to device simulation are provided based on the authors' experience while simulating SiC device structures. This book is useful for students, researchers, and semiconductor professionals working in the area of SiC semiconductor technology. Readers will be provided with the source code of several fully functional simulation programs that illustrate the use of Silvaco© ATLAS to simulate SiC power device structure, as well as supplementary material for download.

Download or read book Semiconductor Optoelectronic Devices written by Joachim Piprek and published by Elsevier. This book was released on 2013-10-22 with total page 296 pages. Available in PDF, EPUB and Kindle. Book excerpt: Optoelectronics has become an important part of our lives. Wherever light is used to transmit information, tiny semiconductor devices are needed to transfer electrical current into optical signals and vice versa. Examples include light emitting diodes in radios and other appliances, photodetectors in elevator doors and digital cameras, and laser diodes that transmit phone calls through glass fibers. Such optoelectronic devices take advantage of sophisticated interactions between electrons and light. Nanometer scale semiconductor structures are often at the heart of modern optoelectronic devices. Their shrinking size and increasing complexity make computer simulation an important tool to design better devices that meet ever rising perfomance requirements. The current need to apply advanced design software in optoelectronics follows the trend observed in the 1980's with simulation software for silicon devices. Today, software for technology computer-aided design (TCAD) and electronic design automation (EDA) represents a fundamental part of the silicon industry. In optoelectronics, advanced commercial device software has emerged recently and it is expected to play an increasingly important role in the near future. This book will enable students, device engineers, and researchers to more effectively use advanced design software in optoelectronics. Provides fundamental knowledge in semiconductor physics and in electromagnetics, while helping to understand and use advanced device simulation software Demonstrates the combination of measurements and simulations in order to obtain realistic results and provides data on all required material parameters Gives deep insight into the physics of state-of-the-art devices and helps to design and analyze of modern optoelectronic devices

Download or read book Technology CAD Systems written by Franz Fasching and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 313 pages. Available in PDF, EPUB and Kindle. Book excerpt: As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in today's business. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a "virtual fab" S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with "robust", "proven" tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools.

Download or read book Stress and Strain Engineering at Nanoscale in Semiconductor Devices written by Chinmay K. Maiti and published by CRC Press. This book was released on 2021-06-29 with total page 275 pages. Available in PDF, EPUB and Kindle. Book excerpt: Anticipating a limit to the continuous miniaturization (More-Moore), intense research efforts are being made to co-integrate various functionalities (More-than-Moore) in a single chip. Currently, strain engineering is the main technique used to enhance the performance of advanced semiconductor devices. Written from an engineering applications standpoint, this book encompasses broad areas of semiconductor devices involving the design, simulation, and analysis of Si, heterostructure silicongermanium (SiGe), and III-N compound semiconductor devices. The book provides the background and physical insight needed to understand the new and future developments in the technology CAD (TCAD) design at the nanoscale. Features Covers stressstrain engineering in semiconductor devices, such as FinFETs and III-V Nitride-based devices Includes comprehensive mobility model for strained substrates in global and local strain techniques and their implementation in device simulations Explains the development of strain/stress relationships and their effects on the band structures of strained substrates Uses design of experiments to find the optimum process conditions Illustrates the use of TCAD for modeling strain-engineered FinFETs for DC and AC performance predictions This book is for graduate students and researchers studying solid-state devices and materials, microelectronics, systems and controls, power electronics, nanomaterials, and electronic materials and devices.

Download or read book FinFET Devices for VLSI Circuits and Systems written by Samar K. Saha and published by CRC Press. This book was released on 2020-07-15 with total page 260 pages. Available in PDF, EPUB and Kindle. Book excerpt: To surmount the continuous scaling challenges of MOSFET devices, FinFETs have emerged as the real alternative for use as the next generation device for IC fabrication technology. The objective of this book is to provide the basic theory and operating principles of FinFET devices and technology, an overview of FinFET device architecture and manufacturing processes, and detailed formulation of FinFET electrostatic and dynamic device characteristics for IC design and manufacturing. Thus, this book caters to practicing engineers transitioning to FinFET technology and prepares the next generation of device engineers and academic experts on mainstream device technology at the nanometer-nodes.

Download or read book Nanoelectronics Physics Materials and Devices written by Angsuman Sarkar and published by Elsevier. This book was released on 2023-01-03 with total page 550 pages. Available in PDF, EPUB and Kindle. Book excerpt: Approx.528 pages Approx.528 pages

Download or read book Advanced Field Effect Transistors written by Dharmendra Singh Yadav and published by CRC Press. This book was released on 2023-12-22 with total page 306 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Field-Effect Transistors: Theory and Applications offers a fresh perspective on the design and analysis of advanced field-effect transistor (FET) devices and their applications. The text emphasizes both fundamental and new paradigms that are essential for upcoming advancement in the field of transistors beyond complementary metal–oxide–semiconductors (CMOS). This book uses lucid, intuitive language to gradually increase the comprehension of readers about the key concepts of FETs, including their theory and applications. In order to improve readers’ learning opportunities, Advanced Field-Effect Transistors: Theory and Applications presents a wide range of crucial topics: Design and challenges in tunneling FETs Various modeling approaches for FETs Study of organic thin-film transistors Biosensing applications of FETs Implementation of memory and logic gates with FETs The advent of low-power semiconductor devices and related implications for upcoming technology nodes provide valuable insight into low-power devices and their applicability in wireless, biosensing, and circuit aspects. As a result, researchers are constantly looking for new semiconductor devices to meet consumer demand. This book gives more details about all aspects of the low-power technology, including ongoing and prospective circumstances with fundamentals of FET devices as well as sophisticated low-power applications.

Download or read book Fabless Semiconductor Manufacturing written by Chinmay K. Maiti and published by CRC Press. This book was released on 2022-11-17 with total page 340 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book deals with 3D nanodevices such as nanowire and nanosheet transistors at 7 nm and smaller technology nodes. It discusses technology computer-aided design (TCAD) simulations of stress- and strain-engineered advanced semiconductor devices, including III-nitride and RF FDSOI CMOS, for flexible and stretchable electronics. The book focuses on how to set up 3D TCAD simulation tools, from mask layout to process and device simulation, including fabless intelligent manufacturing. The simulation examples chosen are from the most popular devices in use today and provide useful technology and device physics insights. In order to extend the role of TCAD in the More-than-Moore era, the design issues related to strain engineering for flexible and stretchable electronics have been introduced for the first time.

Download or read book Miniaturized Transistors written by Lado Filipovic and published by MDPI. This book was released on 2019-06-24 with total page 202 pages. Available in PDF, EPUB and Kindle. Book excerpt: What is the future of CMOS? Sustaining increased transistor densities along the path of Moore's Law has become increasingly challenging with limited power budgets, interconnect bandwidths, and fabrication capabilities. In the last decade alone, transistors have undergone significant design makeovers; from planar transistors of ten years ago, technological advancements have accelerated to today's FinFETs, which hardly resemble their bulky ancestors. FinFETs could potentially take us to the 5-nm node, but what comes after it? From gate-all-around devices to single electron transistors and two-dimensional semiconductors, a torrent of research is being carried out in order to design the next transistor generation, engineer the optimal materials, improve the fabrication technology, and properly model future devices. We invite insight from investigators and scientists in the field to showcase their work in this Special Issue with research papers, short communications, and review articles that focus on trends in micro- and nanotechnology from fundamental research to applications.

Download or read book Sub Micron Semiconductor Devices written by Ashish Raman and published by CRC Press. This book was released on 2022-05-10 with total page 555 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive reference text discusses novel semiconductor devices, including nanostructure field-effect transistors, photodiodes, high electron mobility transistors, and oxide-based devices. The text covers submicron semiconductor devices, device modeling, novel materials for devices, novel semiconductor devices, optimization techniques, and their application in detail. It covers such important topics as negative capacitance devices, surface-plasmon resonance devices, Fermi-level pinning, external stimuli-based optimization techniques, optoelectronic devices, and architecture-based optimization techniques. The book: Covers novel semiconductor devices with submicron dimensions Discusses comprehensive device optimization techniques Examines conceptualization and modeling of semiconductor devices Covers circuit and sensor-based application of the novel devices Discusses novel materials for next-generation devices This text will be useful for graduate students and professionals in fields including electrical engineering, electronics and communication engineering, materials science, and nanoscience.

Download or read book Advanced Nanoscale MOSFET Architectures written by Kalyan Biswas and published by John Wiley & Sons. This book was released on 2024-05-29 with total page 340 pages. Available in PDF, EPUB and Kindle. Book excerpt: Comprehensive reference on the fundamental principles and basic physics dictating metal–oxide–semiconductor field-effect transistor (MOSFET) operation Advanced Nanoscale MOSFET Architectures provides an in-depth review of modern metal–oxide–semiconductor field-effect transistor (MOSFET) device technologies and advancements, with information on their operation, various architectures, fabrication, materials, modeling and simulation methods, circuit applications, and other aspects related to nanoscale MOSFET technology. The text begins with an introduction to the foundational technology before moving on to describe challenges associated with the scaling of nanoscale devices. Other topics covered include device physics and operation, strain engineering for highly scaled MOSFETs, tunnel FET, graphene based field effect transistors, and more. The text also compares silicon bulk and devices, nanosheet transistors and introduces low-power circuit design using advanced MOSFETs. Additional topics covered include: High-k gate dielectrics and metal gate electrodes for multi-gate MOSFETs, covering gate stack processing and metal gate modification Strain engineering in 3D complementary metal-oxide semiconductors (CMOS) and its scaling impact, and strain engineering in silicon–germanium (SiGe) FinFET and its challenges and future perspectives TCAD simulation of multi-gate MOSFET, covering model calibration and device performance for analog and RF applications Description of the design of an analog amplifier circuit using digital CMOS technology of SCL for ultra-low power VLSI applications Advanced Nanoscale MOSFET Architectures helps readers understand device physics and design of new structures and material compositions, making it an important resource for the researchers and professionals who are carrying out research in the field, along with students in related programs of study.

Download or read book Principles of Computer aided Design and Manufacturing written by Farid M. L. Amirouche and published by Prentice Hall. This book was released on 2004 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Principles of Computer-Aided Design and Manufacturingis the product of many years of experience teaching courses in computer-aided design (CAD). My first book, published in 1991, was a challenge—the technology was evolving and both the hardware and software were changing rapidly. Since then we have come a long way in the CAD/CAM area, and the prospects are even better for future intelligent systems that will enable engineers to design engineering products more efficiently. From design to development, we are attaining some great achievements that will engineer products that are more competitive and ready to meet the market needs. In essence, CAD will provide the engineer more time for the creative aspects in terms of concept formulation and interpretation of the results derived from the analysis. The tools of CAD/CAM are now more standardized and most of our students today come equipped with the basic engineering graphics knowledge needed to learn advanced engineering tools. Having gone through the experience of teaching this course and at the same time trying to adapt to the changing needs in the laboratory, I have written this book under the premise of providing the students the fundamentals needed to advance their understanding of design, analysis, and product development in manufacturing. The latter is achieved through selection of appropriate topics and analytical methods in all aspects of design that are pertinent to CAD with the hope that students will embrace them with conviction. These topics are written in a clear and concise form, and are followed by examples to guide the students and engineers through a wonderful learning experience. The thrust behind learning and teaching CAD is the ability to reach a level of confidence that will enable oneself to interact with ease with the existing CAD systems to solve engineering problems. My philosophy is to teach through examples; hence, every topic covered is followed by examples to demonstrate the concepts. The basic engineering concepts learned in this book are independent of any specific software. We are at a stage now in which CAD/CAM does not necessary have to be self-contained. Rather, students should be able to use other tools to link or provide additional information as necessary to the CAD system. Where some topics could be supplemented, I have taken the liberty in this textbook of allowing the students to perform their exercises using MATLAB for the sake of understanding that CAD is a multidiscipline in nature and some parts of the design or analysis can be programmed in other languages. This is becoming a common practice as vendors are making it simpler and easier to transport files from different systems, and in some cases even be able to integrate different analysis tools to provide the students and engineers the ability to interact with their software to meet their engineering needs. This is certainly true in the variational design and parametric designs areas in which engineering equations are the engine behind the geometrical formulation and design of certain products. This textbook is written to satisfy the CAD requirements courses even though finite element coverage expands beyond the introduction of truss analysis. It is difficult to cover all topics in one semester. Topics should be selected to meet the course needs and the laboratory requirements that go with it. For example, at the University of Illinois at Chicago, we have a required laboratory part of the course where students are given different projects on weekly basis to become proficient in the use of CAD software such as ProE or IDEAS. The last lab projects are more involved and usually require some forms of analysis and animation. My intention is to provide additional topics in finite elements that will allow the instructor to focus not only on simple trusses but also be able to teach heat conduction, basic principles in FEM, and even vibration to broaden the scope of analysis. The idea is one that allows our senior students to be exposed to FEM by combining most of what they have learned and show how it can be done with the help of this powerful technique of FEM. This has been very successful with our undergraduate students and first-year graduate students because they are able to use this textbook to learn the basic concepts required in analysis to be able to use finite element tools such as ANSYS, IDEAS, and CATIA, among others. The book is divided into 15 chapters and provides a unique balance of topics that cover design, 3D transformation and geometry manipulation, surface creations, solid modeling, optimization, finite elements, robotics and robot economics, and CAM implementation. Chapter 1 provides a historical perspective of CAD and discusses virtual reality as it is used in our current engineering environment (the latter is a topic that will need to be explored further down the road). Chapter 2 addresses the different stages in design and provides concrete examples showing how these steps can be accomplished. The unique feature of this chapter is the parametric and variational design concept. In this textbook I have made an effort to enlighten the students with the need for these techniques to be taken seriously as they might become standard in the near future. The blending of man and machine is an effective tool when CAD systems are allowed to participate in the design and manufacturing process by aiding in the problem formulation, synthesis, conceptualization, and, of course, analysis. Once the students have had some exposure to CAD in general, Chapter 2 could be covered at any part of the course. I urge the instructors and readers to take the time and go over these examples and to create their own examples to appreciate the benefits of these tools. Chapter 3 discusses 2D and 3D transformations and geometry manipulation, and provides an in-depth analysis of images in 2D and 3D, and includes isometric views. Chapter 4 explains the fundamentals underlying splines, parametric and nonparametric curves, and Bezier curves and surfaces. A number of examples are included to assist the students in understanding how the concepts are implemented. Depending on how advanced the students are, selected topics can be skipped or simply assigned as additional material for the class. Chapter 5 introduces the concept of solid modeling and the various construction techniques and representation schemes in modeling. The students will apply some of these concepts in their lab work working with the making of solid models in CAD. Chapter 6 covers various techniques of optimization and introduces the students to the basic concepts of how to formulate an objective function, define the appropriate constraints, and choose the analytical tools to solve the problem. This chapter also focuses on popular techniques in optimization so that senior students and first-year graduate students will have some familiarity with their use. Chapters 7 through 10 form a unique combination of teaching the finite element method to our junior and senior students without the burden of heavy calculus. It is one of the major strengths of this textbook. If a curriculum is more focused on analysis, all chapters can be covered; otherwise, the instructor is given the choice of covering FEM by selecting the appropriate topics) for the class. This would include stress analysis, heat conduction, dynamic analysis, and vibration, or simply teaching the basic formulation of FEM as described in Chapter 7. The examples solved in these chapters represent real applications and will encourage the students to develop a good appetite for FEM. Computer-aided manufacturing is introduced in Chapters 11 through 15. I have opted to focus on key topics of interest to the students such as robotics and economic impact, group technology, and computer-integrated manufacturing. These are some of the features that need to be understood in the integration of CAD and CAM. Principles of Computer-Aided Design and Manufacturingis written for junior and senior level students and first-year graduate students who have had little exposure to computer-aided design. This textbook assumes that the students have some experience with programming and understand basic concepts in CAD found in a freshman course of graphics. This textbook is suitable for students who have had all their undergraduate requirements in their major. The latter is an incentive whereby students will fully appreciate the benefits of design techniques such as parametric and variational design and develop a deep understanding of how FEM works and how it is applied to various engineering applications. I am indebted to the reviewers for their useful comments and suggestions, which helped shape the content and focus of this book: Dr. Heana Costea, California State University at Northridge; Derek M. Yip-Hoi, University of Michigan at Ann Arbor; and Gregory Kremer, Ohio State University. I would also like to thank Dr. M. Ayub, visiting professor in the Civil Engineering Department at University of Chicago at Illinois, for taking the time to edit several chapters and provide his insight for the book and M. Arif, associate professor in the Civil Engineering Department at University of Chicago at Illinois, for his encouragement and support. The comments and suggestions of the reviewers were instrumental in my final revision and in selecting additional topics that were missing from the original proposal. They kindly helped review my original manuscript and assisted me in looking at their course focus and syllabus to get a better picture of how the CAD course is taught at their respective institutions. Finally, I am indebted to all my students who have assisted me in the preparation of necessary materials for this book; without their help, this wouldn't have been possible. In particular, I would like to thank Carlos Lopez for his efforts on the parametric and variational designs section of the book. I also like to thank Francisco Romero, Nagarajan Chandra, Pedro Gonzalez, and David McNeil for their genuine effort in assisting with some of the graphics of the book. I would like to thank Nikhil Khulka and Ivan Zivkovic for being there when I needed them the most to meet the publisher deadlines and organize the chapters and figures selected for the book. I also would like to thank Surya Pratar for helping with indexing of this book. Finally, let me take this opportunity to thank the editorial staff, Dorothy Marrero, David George, and Lynda Castillo at Prentice Hall, for their patience during the course of the production of the book. I had the pleasure of working closely with Kevin Bradley at Sunflower Publishing Services, who oversaw the complete publication of the book. He was kind and very responsive to all my questions. He worked intelligently to make sure I was happy with the changes and the editing of my book. At the end I would like to thank my family, Ginger, Larby, and Anissa, for their unconditional love and support and for their understanding in the sacrifices we make in achieving our objectives. In particular, I would like to thank my mom and dad for giving me hope, guidance, and values to treasure for years to come. FARID AMIROUCHE The Department of Mechanical & Industrial Engineering University of Illinois, Chicago