Download or read book Distribution System Loss Evaluation Manual written by and published by . This book was released on 1988 with total page 158 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Seventh E C Photovoltaic Solar Energy Conference written by Adolf Goetzberger and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 1303 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of the International Conference held at Seville, Spain, October 27-31, 1986.
Download or read book National Union Catalog written by and published by . This book was released on 1982 with total page 1030 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes entries for maps and atlases.
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Download or read book International Conference on Electricity Distribution 1 5 June 1981 written by Institution of Electrical Engineers and published by . This book was released on 1981 with total page 371 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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Download or read book Synthesis of Power Distribution to Manage Signal Integrity in Mixed Signal ICs written by Balsha R. Stanisic and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 221 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the early days of VLSI, the design of the power distribution for an integrated cir cuit was rather simple. Power distribution --the design of the geometric topology for the network of wires that connect the various power supplies, the widths of the indi vidual segments for each of these wires, the number and location of the power I/O pins around the periphery of the chip --was simple because the chips were simpler. Few available wiring layers forced floorplans that allowed simple, planar (non-over lapping) power networks. Lower speeds and circuit density made the choice of the wire widths easier: we made them just fat enough to avoid resistive voltage drops due to switching currents in the supply network. And we just didn't need enormous num bers of power and ground pins on the package for the chips to work. It's not so simple any more. Increased integration has forced us to focus on reliability concerns such as metal elec tromigration, which affects wire sizing decisions in the power network. Extra metal layers have allowed more flexibility in the topological layout of the power networks.
