Download or read book Interconnect Technologies for Integrated Circuits and Flexible Electronics written by Yash Agrawal and published by Springer Nature. This book was released on 2023-10-17 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.
Download or read book Interconnect Technologies for Integrated Circuits and Flexible Electronics written by Yash Agrawal and published by Springer. This book was released on 2023-10-07 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.
Download or read book Electronic Equipment Packaging Technology written by Gerald L. Ginsberg and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 285 pages. Available in PDF, EPUB and Kindle. Book excerpt: The last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role that electronic equipment plays in almost all product markets. Even though electronic equipment is used in a broad base of applications, many future applications have yet to be conceived. This versatility of electron ics has been brought about primarily by the significant advances that have been made in integrated circuit technology. The electronic product user is rarely aware of the integrated circuits within the equipment. However, the user is often very aware of the size, weight, mod ularity, maintainability, aesthetics, and human interface features of the product. In fact, these are aspects of the products that often are instrumental in deter mining its success or failure in the marketplace. Optimizing these and other product features is the primary role of Electronic Equipment Packaging Technology. As the electronics industry continues to pro vide products that operate faster than their predecessors in a smaller space with a reduced cost per function, the role of electronic packaging technology will assume an even greater role in the development of cost-effective products.
Download or read book 2009 International Conference on Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors written by Yue Kuo and published by The Electrochemical Society. This book was released on 2009-07 with total page 350 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue of ECS Transactions includes 33 papers that were presented at the Second International Conference on Semiconductor Technology for Ultra Large Integrated Circuits and Thin Film Transistors (ULSIC vs. TFT II), held in the Xi¿an Garden Hotel, Xian, China, July 5-10, 2009. This symposium was sponsored by the Engineering Conferences International.
Download or read book Multidisciplinary Know How for Smart Textiles Developers written by Tünde Kirstein and published by Elsevier. This book was released on 2013-04-04 with total page 540 pages. Available in PDF, EPUB and Kindle. Book excerpt: Smart-textiles developers draw on diverse fields of knowledge to produce unique materials with enhanced properties and vast potential. Several disciplines outside the traditional textile area are involved in the construction of these smart textiles, and each individual field has its own language, specific terms and approaches. Multidisciplinary know-how for smart-textiles developers provides a filtered knowledge of these areas of expertise, explaining key expressions and demonstrating their relevance to the smart-textiles field.Following an introduction to the new enabling technologies, commercialisation and market trends that make up the future of smart-textiles development, part one reviews materials employed in the production of smart textiles. Types and processing of electro-conductive and semiconducting materials, optical fibres for smart photonic textiles, conductive nanofibres and nanocoatings, polymer-based resistive sensors, and soft capacitance fibres for touch-sensitive smart textiles are all discussed. Part two then investigates such technologies as the embedding of electronic functions, the integration of thin-film electronics, and the development of organic and large-area electronic (OLAE) technologies for smart textiles. Joining technologies are also discussed, alongside kinetic, thermoelectric and solar energy harvesting technologies, and signal processing technologies for activity-aware smart textiles. Finally, product development and applications are the focus of part three, which investigates strategies for technology management, innovation and improved sustainability, before the book concludes by exploring medical, automotive and architectural applications of smart textiles.With its distinguished editor and international team of expert contributors, Multidisciplinary know-how for smart-textiles developers is a key tool for readers working in industries including design, fashion, textiles, through to electronics, computing and material science. It also provides a useful guide to the subject for academics working across a wide range of fields. - Reviews materials used in the production of smart textiles - Examines the technologies used in smart textiles, such as optical fibres and polymer based resistive sensors - Investigates strategies for technology management, innovation and improved development
Download or read book Integrated Interconnect Technologies for 3D Nanoelectronic Systems written by Muhannad S. Bakir and published by Artech House. This book was released on 2008-11-30 with total page 551 pages. Available in PDF, EPUB and Kindle. Book excerpt: This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
Download or read book Proceedings of the Symposium on Polymeric Materials for Electronic Packaging and High Technology Applications written by John R. Susko and published by . This book was released on 1988 with total page 228 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Encyclopedia of Packaging Materials Processes and Mechanics written by Avram Bar-Cohen and published by World Scientific. This book was released on 2019 with total page 1079 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories. The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications"--Publisher's website
Download or read book Embedded and Fan Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces written by Beth Keser and published by John Wiley & Sons. This book was released on 2021-12-06 with total page 324 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.
Download or read book Handbook of Emerging Materials for Semiconductor Industry written by Young Suh Song and published by Springer Nature. This book was released on with total page 930 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Intelligent Textiles and Clothing written by H Mattila and published by Woodhead Publishing. This book was released on 2006-07-28 with total page 525 pages. Available in PDF, EPUB and Kindle. Book excerpt: The use of intelligent textiles in clothing is an exciting new field with wide-ranging applications. Intelligent textiles and clothing summarises some of the main types of intelligent textiles and their uses.Part one of the book reviews phase change materials (PCM), their role in such areas as thermal regulation and ways they can be integrated into outdoor and other types of clothing. The second part of the book discusses shape memory materials (SMM) and their applications in medical textiles, clothing and composite materials. Part three deals with chromic (colour change) and conductive materials and their use in such areas as sensors within clothing. The final part of the book looks at current and potential applications, including work wear and medical applications.With its distinguished editor and international team of contributors, Intelligent textiles and clothing is an essential guide for textile manufacturers in such areas as specialist clothing (for example, protective, sports and outdoor clothing) as well as medical textiles. - Summarises the main types of intelligent textiles and their uses - Reviews phase change materials and their role in clothing - Discusses shape memory materials and their applications
Download or read book Flexible and Stretchable Electronic Composites written by Deepalekshmi Ponnamma and published by Springer. This book was released on 2015-10-16 with total page 391 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is the first comprehensive collection of electronic aspects of different kinds of elastomer composites, including combinations of synthetic, natural and thermoplastic elastomers with different conducting fillers like metal nanoparticles, carbon nanotubes, or graphenes, and many more. It covers elastomer composites, which are useful in electronic applications, including chemical and physical as well as material science aspects. The presented elastomer composites have great potential for solving emerging new material application requirements, for example as flexible and wearable electronics. The book is structured and organized by the rubber/elastomer type: each chapter describes a different elastomer matrix and its composites. While introducing to important fundamentals, it is application-oriented, discussing the current issues and challenges in the field of elastomer composites. This book will thus appeal to researchers and scientists, to engineers and technologists, but also to graduate students, working on elastomer composites, or on electronics engineering with the composites, providing the readers with a sound introduction to the field and solutions to both fundamental and applied problems.
Download or read book Linear Integrated Circuits written by Robin Shannon and published by Scientific e-Resources. This book was released on 2019-03-18 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: An analog chip is a set of miniature electronic analog circuits formed on a single piece of semiconductor material. The voltage and current at specified points in the circuits of analog chips vary continuously in time. In contrast, digital chips only use and create voltages or currents at discrete levels, with no intermediate values. In addition to Transistors, analog chips often have a larger number of passive elements than digital chips typically do. Inductors tend to be avoided because of their large size and a transistor and capacitor together can do the work of an inductor. The book broadly deals with: Direct and capacitor coupled Opamp amplifiers; Frequency response and compensation to improve the performance of Opamp circuits; Voltage and current sources, instrumentation amplifiers and precision rectifiers, limiting and clamping circuits; Log and antilog amplifiers, etc. The book covers the syllabus prescribed for B.E. Care is taken to develop the subject logically so that the book could also be used by B.Sc. and diploma students. Neatly drawn diagrams, stepwise illustrations, and graded numerical examples, are included in every chapter to support the contents.
Download or read book Wireless Interface Technologies for 3D IC and Module Integration written by Tadahiro Kuroda and published by Cambridge University Press. This book was released on 2021-09-30 with total page 337 pages. Available in PDF, EPUB and Kindle. Book excerpt: Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.
Download or read book Flexible Electronics written by Fouad Sabry and published by One Billion Knowledgeable. This book was released on 2022-08-31 with total page 413 pages. Available in PDF, EPUB and Kindle. Book excerpt: What Is Flexible Electronics Mounting electronic components on flexible plastic substrates, such as polyimide, PEEK, or transparent conductive polyester film, is the method used in the technology known as flexible electronics, which is also known as flex circuits. This method is used to assemble electronic circuits. In addition to this method, silver circuits may be screen printed on polyester to create flex circuits. It is possible to build flexible electronic assemblies using the same components that are used to produce rigid printed circuit boards. This gives the board the ability to adapt to any desired shape and to bend while it is in use. How You Will Benefit (I) Insights, and validations about the following topics: Chapter 1: Flexible electronics Chapter 2: Organic electronics Chapter 3: Printed circuit board Chapter 4: BoPET Chapter 5: Roll-to-roll processing Chapter 6: Lamination Chapter 7: FR-4 Chapter 8: Polyimide Chapter 9: Thin film Chapter 10: Membrane switch Chapter 11: Diffusion barrier Chapter 12: Flexible flat cable Chapter 13: Power electronic substrate Chapter 14: Tape-automated bonding Chapter 15: Printed electronics Chapter 16: IPC (electronics) Chapter 17: Thermal copper pillar bump Chapter 18: Integrated passive devices Chapter 19: Film capacitor Chapter 20: Stéphanie P. Lacour Chapter 21: Glossary of microelectronics manufacturing terms (II) Answering the public top questions about flexible electronics. (III) Real world examples for the usage of flexible electronics in many fields. (IV) 17 appendices to explain, briefly, 266 emerging technologies in each industry to have 360-degree full understanding of flexible electronics' technologies. Who This Book Is For Professionals, undergraduate and graduate students, enthusiasts, hobbyists, and those who want to go beyond basic knowledge or information for any kind of flexible electronics.
Download or read book Springer Handbook of Electronic and Photonic Materials written by Safa Kasap and published by Springer. This book was released on 2017-10-04 with total page 1536 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second, updated edition of this essential reference book provides a wealth of detail on a wide range of electronic and photonic materials, starting from fundamentals and building up to advanced topics and applications. Its extensive coverage, with clear illustrations and applications, carefully selected chapter sequencing and logical flow, makes it very different from other electronic materials handbooks. It has been written by professionals in the field and instructors who teach the subject at a university or in corporate laboratories. The Springer Handbook of Electronic and Photonic Materials, second edition, includes practical applications used as examples, details of experimental techniques, useful tables that summarize equations, and, most importantly, properties of various materials, as well as an extensive glossary. Along with significant updates to the content and the references, the second edition includes a number of new chapters such as those covering novel materials and selected applications. This handbook is a valuable resource for graduate students, researchers and practicing professionals working in the area of electronic, optoelectronic and photonic materials.
Download or read book Area Array Interconnection Handbook written by Karl J. Puttlitz and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 1250 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
