Download or read book Interconnect Simulation with Asymptotic Waveform Evaluation written by J. Eric Bracken and published by . This book was released on 1992 with total page 25 pages. Available in PDF, EPUB and Kindle. Book excerpt: However, the basic algorithm must be extended so that distributed and nonlinear elements may be included in the simulation. This paper desribes extensions to the AWE technique that make it applicable to the analysis of general interconnect problems."

Download or read book Asymptotic Waveform Evaluation written by Eli Chiprout and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 207 pages. Available in PDF, EPUB and Kindle. Book excerpt: The intense drive for signal integrity has been at the forefront ofrapid and new developments in CAD algorithms. Thousands ofengineers, intent on achieving the best design possible, use SPICE on a daily basis for analog simulation and general circuit analysis. But the strained demand for high data speeds, coupled with miniaturizationon an unprecedented scale, has highlighted the previously negligible effects of interconnects; effects which are not always handled appro priately by the present levels of SPICE. Signals at these higher speeds may be degraded by long interconnect lengths compared to the increasingly shorter sig nal rise times. Interconnect structures can be diverse (pins, connectors, leads, microstrips, striplines, etc. ) and present at any of the hierarchical packaging levels: integrated circuits, printed circuit boards, multi-chip modules or sys tem backplanes. Analysis of these effects in any CAD package has become a necessity. Asymptotic waveform evaluation (AWE) and other moment matching tech niques have recently proven useful in the analysis of interconnect structures and various networks containing large linear structures with nonlinear termi nations. Previously, all that was available to the designer was a full SPICE simulation or a quick but uncertain timing estimation. Moment matching, used in linear systems analysis as a method of model reduction, describes a method to extract a small set of dominant poles from a large network. The information is obtained from the Taylor series coefficients (moments) of that system.

Download or read book Time Domain Simulation of High speed Interconnect Circuits Using Asymptotic Waveform Evaluation written by Bradley Oakes Marsh and published by . This book was released on 1994 with total page 120 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Analysis of MCMs Using Asymptotic Waveform Evaluation AWE written by M. M. Alaybeyi and published by . This book was released on 1992 with total page 4 pages. Available in PDF, EPUB and Kindle. Book excerpt: Abstract: "Finer feature sizes, increasing system complexity, and higher signal speeds have combined to make interconnect the dominant determinant of electronic circuit and system performance. These trends will continue into the forseeable future, and new technologies that may be introduced will only add to them. Key components to interconnect analysis are efficient simulation of interconnect models, and macro-modeling to make the models fit efficiently into existing simulation strategies. Asymptotic Waveform Evaluation (AWE) is an elegant and efficient solution to this problem. This paper illustrates the applicability of AWE to the analysis of MCM interconnect structures -- from chip level through packaging, through thick or thin film interconnect and back again."

Download or read book Interconnect Simulation with Asymtotic Waveform Evaluation written by J. Eric Bracken and published by . This book was released on 1994 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book IC Interconnect Analysis written by Mustafa Celik and published by Springer Science & Business Media. This book was released on 2007-05-08 with total page 316 pages. Available in PDF, EPUB and Kindle. Book excerpt: As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components. Once viewed as merely parasitics in terms of their relevance to the overall circuit behavior, the interconnect can now have a dominant impact on the IC area and performance. Beginning in the late 1980's there was significant research toward better modeling and characterization of the resistance, capacitance and ultimately the inductance of on-chip interconnect. IC Interconnect Analysis covers the state-of-the-art methods for modeling and analyzing IC interconnect based on the past fifteen years of research. This is done at a level suitable for most practitioners who work in the semiconductor and electronic design automation fields, but also includes significant depth for the research professionals who will ultimately extend this work into other areas and applications. IC Interconnect Analysis begins with an in-depth coverage of delay metrics, including the ubiquitous Elmore delay and its many variations. This is followed by an outline of moment matching methods, calculating moments efficiently, and Krylov subspace methods for model order reduction. The final two chapters describe how to interface these reduced-order models to circuit simulators and gate-level timing analyzers respectively. IC Interconnect Analysis is written for CAD tool developers, IC designers and graduate students.

Download or read book Signal Propagation on Interconnects written by Hartmut Grabinski and published by Springer Science & Business Media. This book was released on 2013-11-11 with total page 150 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book comprises a selection of the most representative contributions to the 1st IEEE Workshop on Signal Propagation on Interconnects that was held at Travemunde, Germany, in May 1997. It represents, therefore, a survey of the actual problems currently concerning researchers and professionals in the field of signal propagation on interconnects. Signal Propagation on Interconnects contains chapters which cover a wide area of important research results dealing with simulation and measurement of noise and radiated emissions on boards, describing ground bounce effects as well as inductance calculations in multilayer packages. There is also reference and coverage of timing simulation techniques on chip as well as on board level. Signal Propagation on Interconnects is intended to give developers and researchers in the field of chip and package design a review of the state of the art regarding the influence of interconnect effects on the electrical performance of electronic circuits. In addition, the book illustrates ways to overcome performance problems related to the parasitic influences of interconnects. It is an invaluable text for circuit design engineers, developers and researchers in the field of signal integrity.

Download or read book Design Automation Languages and Simulations written by Wai-Kai Chen and published by CRC Press. This book was released on 2003-03-26 with total page 314 pages. Available in PDF, EPUB and Kindle. Book excerpt: As the complexity of electronic systems continues to increase, the micro-electronic industry depends upon automation and simulations to adapt quickly to market changes and new technologies. Compiled from chapters contributed to CRC's best-selling VLSI Handbook, this volume of the Principles and Applications in Engineering series covers a broad rang

Download or read book Modeling and Simulation of High Speed VLSI Interconnects written by Michel S. Nakhla and published by Springer Science & Business Media. This book was released on 2011-06-28 with total page 104 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area. Modeling and Simulation of High Speed VLSI Interconnects serves as an excellent reference, providing insight into some of the most important issues in the field.

Download or read book The VLSI Handbook written by Wai-Kai Chen and published by CRC Press. This book was released on 2019-07-17 with total page 1788 pages. Available in PDF, EPUB and Kindle. Book excerpt: Over the years, the fundamentals of VLSI technology have evolved to include a wide range of topics and a broad range of practices. To encompass such a vast amount of knowledge, The VLSI Handbook focuses on the key concepts, models, and equations that enable the electrical engineer to analyze, design, and predict the behavior of very large-scale integrated circuits. It provides the most up-to-date information on IC technology you can find. Using frequent examples, the Handbook stresses the fundamental theory behind professional applications. Focusing not only on the traditional design methods, it contains all relevant sources of information and tools to assist you in performing your job. This includes software, databases, standards, seminars, conferences and more. The VLSI Handbook answers all your needs in one comprehensive volume at a level that will enlighten and refresh the knowledge of experienced engineers and educate the novice. This one-source reference keeps you current on new techniques and procedures and serves as a review for standard practice. It will be your first choice when looking for a solution.

Download or read book Analysis of Multiconductor Transmission Lines written by Clayton R. Paul and published by John Wiley & Sons. This book was released on 2007-10-26 with total page 821 pages. Available in PDF, EPUB and Kindle. Book excerpt: The essential textbook for electrical engineering students and professionals-now in a valuable new edition The increasing use of high-speed digital technology requires that all electrical engineers have a working knowledge of transmission lines. However, because of the introduction of computer engineering courses into already-crowded four-year undergraduate programs, the transmission line courses in many electrical engineering programs have been relegated to a senior technical elective, if offered at all. Now, Analysis of Multiconductor Transmission Lines, Second Edition has been significantly updated and reorganized to fill the need for a structured course on transmission lines in a senior undergraduate- or graduate-level electrical engineering program. In this new edition, each broad analysis topic, e.g., per-unit-length parameters, frequency-domain analysis, time-domain analysis, and incident field excitation, now has a chapter concerning two-conductor lines followed immediately by a chapter on MTLs for that topic. This enables instructors to emphasize two-conductor lines or MTLs or both. In addition to the reorganization of the material, this Second Edition now contains important advancements in analysis methods that have developed since the previous edition, such as methods for achieving signal integrity (SI) in high-speed digital interconnects, the finite-difference, time-domain (FDTD) solution methods, and the time-domain to frequency-domain transformation (TDFD) method. Furthermore, the content of Chapters 8 and 9 on digital signal propagation and signal integrity application has been considerably expanded upon to reflect all of the vital information current and future designers of high-speed digital systems need to know. Complete with an accompanying FTP site, appendices with descriptions of numerous FORTRAN computer codes that implement all the techniques in the text, and a brief but thorough tutorial on the SPICE/PSPICE circuit analysis program, Analysis of Multiconductor Transmission Lines, Second Edition is an indispensable textbook for students and a valuable resource for industry professionals.

Download or read book Computational Methods In Large Scale Simulation written by Heow-pueh Lee and published by World Scientific. This book was released on 2005-10-26 with total page 395 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume documents the research carried out by visiting scientists attached to the Institute for Mathematical Sciences (IMS) at the National University of Singapore and the Institute of High Performance Computing (IHPC) under the program “Advances and Mathematical Issues in Large Scale Simulation.” From 2002 to 2003, researchers from various countries gathered to initiate interesting and innovative work on various themes related to multiscale simulation and fast algorithms.Today, modeling and simulation are used extensively to solve complex problems and to reduce the use of experimentation during the design and analysis stage. It is important to know the various issues that have to be considered in the successful development of computational methodologies for such work.This volume is a compilation of the research by various visiting scientists in the area of modeling and multiscale simulation. Each article covers a major project and documents how computational methodology, mathematical modeling, high performance computing and simulation are combined in a multiscale scheme to solve a variety of complex problems. Some of these include the design, synthesis, processing, characterization and manufacture of nanomaterials and nanostructures, new algorithms for computational work, and grid computing.Through the included examples, readers can realize the vast potential of computational modeling and large scale simulation for the solution of problems in a variety of disciplines and applications.

Download or read book EDA for IC Implementation Circuit Design and Process Technology written by Luciano Lavagno and published by CRC Press. This book was released on 2018-10-03 with total page 608 pages. Available in PDF, EPUB and Kindle. Book excerpt: Presenting a comprehensive overview of the design automation algorithms, tools, and methodologies used to design integrated circuits, the Electronic Design Automation for Integrated Circuits Handbook is available in two volumes. The second volume, EDA for IC Implementation, Circuit Design, and Process Technology, thoroughly examines real-time logic to GDSII (a file format used to transfer data of semiconductor physical layout), analog/mixed signal design, physical verification, and technology CAD (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability at the nanoscale, power supply network design and analysis, design modeling, and much more. Save on the complete set.

Download or read book Interconnects in VLSI Design written by Hartmut Grabinski and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 234 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement to the first book "Signal Propagation on Interconnects", Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.

Download or read book High Speed VLSI Interconnections written by Ashok K. Goel and published by John Wiley & Sons. This book was released on 2007-10-19 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.

Download or read book Transient Simulation of Passive and Active VLSI Devices Using Asymptotic Waveform Evaluation written by Shigetaka Kumashiro and published by . This book was released on 1992 with total page 110 pages. Available in PDF, EPUB and Kindle. Book excerpt: Several key techniques to be used in the model abstraction phase have been developed. AWE formulations for simplified Maxwell's equations and semiconductor equations have been derived and successfully applied to the modeling of both 3-D interconnect structures and active devices. A temporal integration scheme for transient device simulation has been improved by taking advantage of the AWE response. Error control methods to be used in an event driven transient device simulation have been developed and their performances have been verified through several examples. The existence of 'linearity based temporal and spatial latencies' has been confirmed by means of a computational example."

Download or read book The Finite Element Method in Electromagnetics written by Jian-Ming Jin and published by John Wiley & Sons. This book was released on 2015-02-18 with total page 728 pages. Available in PDF, EPUB and Kindle. Book excerpt: A new edition of the leading textbook on the finite element method, incorporating major advancements and further applications in the field of electromagnetics The finite element method (FEM) is a powerful simulation technique used to solve boundary-value problems in a variety of engineering circumstances. It has been widely used for analysis of electromagnetic fields in antennas, radar scattering, RF and microwave engineering, high-speed/high-frequency circuits, wireless communication, electromagnetic compatibility, photonics, remote sensing, biomedical engineering, and space exploration. The Finite Element Method in Electromagnetics, Third Edition explains the method’s processes and techniques in careful, meticulous prose and covers not only essential finite element method theory, but also its latest developments and applications—giving engineers a methodical way to quickly master this very powerful numerical technique for solving practical, often complicated, electromagnetic problems. Featuring over thirty percent new material, the third edition of this essential and comprehensive text now includes: A wider range of applications, including antennas, phased arrays, electric machines, high-frequency circuits, and crystal photonics The finite element analysis of wave propagation, scattering, and radiation in periodic structures The time-domain finite element method for analysis of wideband antennas and transient electromagnetic phenomena Novel domain decomposition techniques for parallel computation and efficient simulation of large-scale problems, such as phased-array antennas and photonic crystals Along with a great many examples, The Finite Element Method in Electromagnetics is an ideal book for engineering students as well as for professionals in the field.