Download or read book Integration of Microwave and Millimeter Wave Systems in a Precision Multichip module Deposited Process written by John Edward Post and published by . This book was released on 2005 with total page 206 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Multi Chip Module MCM Design for Millimeter wave Applications written by Ghulam Mehdi and published by . This book was released on 2018-10 with total page 123 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the advancement in the era of monolithic microwave integrated circuits (MMIC) technology, the trend for realization of radio systems is shifting towards millimeter-wave (mmW) frequencies. The obvious advantages at mmW bands are higher bandwidth, fine spatial resolution and producibility of miniaturized radio systems with high level integration. The wide spectrum of applications at mmW frequencies encompasses various applications such as satellite communication, radar systems, remote sensing, communication data links etc. The MMIC technology enables the fabrication of miniaturized, low-cost, high-performance and highly reliable mmW radio systems. However, due to the scale downsizing of the circuits proportional to the wavelength, the design of mmW multi-chips module (MCM) is challenging. One of the emerging applications in mmW bands is passive imager for security screening purposes. Such imagers are deployed for detection of the concealed hazardous objects on human body and contraband items. The 2-D synthetic aperture interferometric technique is being extensively employed in passive imaging systems due to its distinct features such as larger field of view (FOV) and high imaging rate. In the first part of this book, design and development of Ka-band MCM receivers at 34 GHz is presented. The receiver employs single-stage heterodyne architecture at 2 GHz intermediate frequency (IF). The complete MCM is realized on a single substrate except for the IF and power distribution section. This facilitates seamless integration, ease of manufacturing and results in a cost effective solution for mass production of such receivers. Further, a two-layer planar technology is adopted for compact realization. Experimental results of the front-end module fabricated with laser structuring are presented as well. Presence of Foreign object debris (FOD) at airport runways is an immense threat to flight safety. Such objects may cause potential damage to the aircraft especially during the critical phases like take off and landing. In the second part of the book, a capability demonstration model for a Ka-band FOD detection sensor employing multi-layer system-on-substrate (SoS) approach is presented. The concept of multi-layer system-on-substrate is introduced. The frequency modulated continuous-wave (FMCW) front-end transceiver and the integrated transmit and receive antennas are realized in multi-layer configuration. The front-end transceiver is mainly designed employing substrate integrated waveguide (SIW) circuits on low-cost 12 mil thick R4003C substrate. The front-end transceiver comprises of MMICs and passive structures such as SIW band-pass filters, SIW Wilkinson power divider and SIW-to-microstrip transitions. In order to couple two SIW substrate layers with different thicknesses, a coaxial bead is introduced for low-loss coupling between the two channels. Further, the design of a planar travelling-wave type slot array antenna in SIW technology is presented. Unlike conventional coaxial matched loads used in one of the reported SIW traveling-wave linear slot array, a resistive match is introduced for termination of such antenna in SIW technology. A virtually grounded thin film resistor (TFR) is employed for array termination. An 8x8 array is designed with antenna feed network. Two-layer topology is adopted for compact realization and this mitigates the unwanted radiations from the feed network. The whole integrated antenna is simulated in Ansoft HFSS®. The proposed approach considerably reduces the cost and weight of the antenna while the conformability of the antenna is retained as well. The antenna can be integrated with rest of the planar hardware of a millimeter-wave system. The proposed antenna can be used for a variety of mmW broadband commercial applications. The simulation results of the proposed antenna and front-end components are presented.
Download or read book Dissertation Abstracts International written by and published by . This book was released on 2005 with total page 794 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microwave and Millimeter Wave System Integration with Additive Manufacturing written by Michael Thomas Craton and published by . This book was released on 2020 with total page 203 pages. Available in PDF, EPUB and Kindle. Book excerpt: This dissertation demonstrates a collection of strategies to package and heterogeneously integrate microwave and millimeter wave (mm-wave) electronics using additive manufacturing (AM). These strategies not only facilitate heterogeneous integration and higher functional density of a system-in-package (SiP)/system-on-package (SoP), but furthermore allow for structures and performance that is difficult or impossible to match with conventional manufacturing strategies. These strategies are implemented using aerosol jet printing, but may be applicable to other sorts of additive manufacturing technologies such as ink-jet printing. The processes developed in order to facilitate these procedures are described, including the use of multi-material aerosol jet printing (MMAJP) for the manufacture of composites and functionally graded materials for use in mm-wave circuits, and a chip-first approach to microwave and mm-wave circuit packaging. These processes enable the production of application specific SiP/SoP electronics for use in radar, communications, imaging, sensing, as well as the supporting circuitry such as filters and antennas which may be difficult or expensive to implement with semiconductor processes. Included are demonstrations of the integration of some of these strategies in complete packages. Characterization of materials used including conductors and dielectrics are presented, as well as simulations and measurements of package sub-components, and complete packages. Finally, the future of this research is discussed.
Download or read book Selected Advances in Nanoelectronic Devices written by Mojtaba Joodaki and published by Springer Science & Business Media. This book was released on 2012-08-15 with total page 289 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanoelectronics, as a true successor of microelectronics, is certainly a major technology boomer in the 21st century. This has been shown by its several applications and also by its enormous potential to influence all areas of electronics, computers, information technology, aerospace defense, and consumer goods. Although the current semiconductor technology is projected to reach its physical limit in about a decade, nanoscience and nanotechnology promise breakthroughs for the future. The present books provides an in-depth review of the latest advances in the technology of nanoelectronic devices and their developments over the past decades. Moreover, it introduces new concepts for the realization of future nanoelectronic devices. The main focus of the book is on three fundamental branches of semiconductor products or applications: logic, memory, and RF and communication. By pointing out to the key technical challenges, important aspects and characteristics of various designs are used to illustrate mechanisms that overcome the technical barriers. Furthermore, by comparing advantages and disadvantages of different designs, the most promising solutions are indicated for each application.
Download or read book Microwave Journal written by and published by . This book was released on 2009 with total page 668 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Conference Proceedings written by and published by . This book was released on 1998 with total page 850 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1995 with total page 380 pages. Available in PDF, EPUB and Kindle. Book excerpt: Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.
Download or read book Science Abstracts written by and published by . This book was released on 1995 with total page 1874 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Packaging written by and published by . This book was released on 2007-10 with total page 44 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Download or read book International Aerospace Abstracts written by and published by . This book was released on 1999 with total page 1016 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Chemical Abstracts written by and published by . This book was released on 2002 with total page 2540 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Antenna in Package Technology and Applications written by Duixian Liu and published by John Wiley & Sons. This book was released on 2020-03-31 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Download or read book Foundations for Microstrip Circuit Design written by Terry C. Edwards and published by John Wiley & Sons. This book was released on 2016-02-01 with total page 688 pages. Available in PDF, EPUB and Kindle. Book excerpt: Building on the success of the previous three editions, Foundations for Microstrip Circuit Design offers extensive new, updated and revised material based upon the latest research. Strongly design-oriented, this fourth edition provides the reader with a fundamental understanding of this fast expanding field making it a definitive source for professional engineers and researchers and an indispensable reference for senior students in electronic engineering. Topics new to this edition: microwave substrates, multilayer transmission line structures, modern EM tools and techniques, microstrip and planar transmision line design, transmission line theory, substrates for planar transmission lines, Vias, wirebonds, 3D integrated interposer structures, computer-aided design, microstrip and power-dependent effects, circuit models, microwave network analysis, microstrip passive elements, and slotline design fundamentals.
Download or read book Physics Briefs written by and published by . This book was released on 1991 with total page 1454 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electrical Electronics Abstracts written by and published by . This book was released on 1997 with total page 2304 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Novel Technologies for Microwave and Millimeter Wave Applications written by Jean-Fu Kiang and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 617 pages. Available in PDF, EPUB and Kindle. Book excerpt: Novel Technologies for Microwave and Millimeter-Wave Applications provides an overview of current research status in selected field, to facilitate a learning process from concepts to practices, from component design to system architecture, and from small scale to large scale. Each chapter focuses on a topic and is organized to be self-sufficient. Contents in each chapter include concise description of relevant background information, major issues, current trend and future challenges. Useful references are also listed for further reading. Novel Technologies for Microwave and Millimeter-Wave Applications is suitable as a textbook for senior or graduate courses in microwave engineering.
