Download or read book Integrated Polysilicon Surface and Drie Bulk Silicon Micromachined Devices written by Jer-Liang Yeh and published by . This book was released on 2000 with total page 274 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Encyclopedia of Microfluidics and Nanofluidics written by Dongqing Li and published by Springer Science & Business Media. This book was released on 2008-08-06 with total page 2242 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering all aspects of transport phenomena on the nano- and micro-scale, this encyclopedia features over 750 entries in three alphabetically-arranged volumes including the most up-to-date research, insights, and applied techniques across all areas. Coverage includes electrical double-layers, optofluidics, DNC lab-on-a-chip, nanosensors, and more.
Download or read book Tribological Issues of Polysilicon Surface micromachining written by and published by . This book was released on 1997 with total page 16 pages. Available in PDF, EPUB and Kindle. Book excerpt: Polysilicon surface-micromachining is a Micro-Electro-Mechanical Systems (MEMS) manufacturing technology where the infrastructure for manufacturing silicon integrated circuits is used to fabricate micro-miniature mechanical devices. This presentation describes a multi-level mechanical polysilicon surface-micromachining technology and includes a discussion of the issues which affect device manufacture and performance. The multi-level technology was developed and is employed primarily to fabricate microactuated mechanisms. The intricate and complex motion offered by these devices is naturally accompanied by various forms of fraction and wear in addition to the classical stiction phenomena associated with micromechanical device fabrication and usage.
Download or read book Microelectromechanical Systems written by Committee on Advanced Materials and Fabrication Methods for Microelectromechanical Systems and published by National Academies Press. This book was released on 1997-12-15 with total page 76 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectromenchanical systems (MEMS) is a revolutionary field that adapts for new uses a technology already optimized to accomplish a specific set of objectives. The silicon-based integrated circuits process is so highly refined it can produce millions of electrical elements on a single chip and define their critical dimensions to tolerances of 100-billionths of a meter. The MEMS revolution harnesses the integrated circuitry know-how to build working microsystems from micromechanical and microelectronic elements. MEMS is a multidisciplinary field involving challenges and opportunites for electrical, mechanical, chemical, and biomedical engineering as well as physics, biology, and chemistry. As MEMS begin to permeate more and more industrial procedures, society as a whole will be strongly affected because MEMS provide a new design technology that could rival--perhaps surpass--the societal impact of integrated circuits.
Download or read book Multi level Polysilicon Surface micromachining Technology written by and published by . This book was released on 1996 with total page 10 pages. Available in PDF, EPUB and Kindle. Book excerpt: Polysilicon surface micromachining is a technology for manufacturing Micro-Electro-Mechanical Systems (MEMS) which has, as its basis, the manufacturing methods and tool sets used to manufacture the integrated electronic circuit. This paper describes a three-level mechanical-polysilicon surface-micromachining technology and includes a discussion of the advantages of this level of process complexity along with issues which affect device fabrication and performance. Historically, the primary obstacles to multi-level polysilicon fabrication were related to the severe wafer topography generated by the repetition of film depositions and etching. The introduction of Chemical Mechanical Polishing (CMP) to surface micromachining has largely removed these issues and opened significant avenues for device complexity. Several examples of three-level devices with the benefits of CMP are presented. Of primary hindrance to the widespread use of polysilicon surface micromachining, and in particular microactuation mechanisms, are issues related to the device surfaces. The closing discussion examines the potential of several latter and post-fabrication processes to circumvent or to directly alleviate the surface problems.
Download or read book Silicon based Vacuum Microelectronic Devices Fabricated by Surface Micromachining written by Qi Mei and published by . This book was released on 1996 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Silicon Micromachining written by Miko Elwenspoek and published by Cambridge University Press. This book was released on 2004-08-19 with total page 424 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive overview of the key techniques used in the fabrication of micron-scale structures in silicon; for graduate students and researchers.
Download or read book Macrodesign for Microdevices written by and published by . This book was released on 1997 with total page 13 pages. Available in PDF, EPUB and Kindle. Book excerpt: The intent of this tutorial is to overview the technology of multi-level polysilicon surface micromachining, to present examples of devices which fully utilize this level of complexity, and to discuss what they believe to be significant issues which are not fully resolved. Following this intent, the tutorial consists of four sections. The first is an introduction and description of multi-level polysilicon surface micromachining and its potential benefits. Specifically, the inclusion of a third deposited layer of mechanical polysilicon greatly extends the degree of complexity available for micromechanism design. The second section introduces wafer planarization by CMP as a process tool for surface micromachining. The third section presents examples of actuated geared micromechanisms which require the multi-level fabrication process. Demonstration of actuation mechanisms coupled to external devices are illustrated. Finally, polysilicon surface micromachining fabrication technology has reached a level where many device designs, for the most part, can be embodied in the technology to produce a mechanical construct which provides the desired function. When designed properly, the fabricated mechanical element, if free to operate, will produce the desired function. However, one set of issues which can hinder or prevent operation are related to the post-fabricated device surfaces. These surface issues; namely, stiction, friction, and wear, are emphasized in the final section as a major hindrance to realizing the full potential of surface micromachined devices.
Download or read book Transducers 01 Eurosensors XV written by Ernst Obermeier and published by Springer. This book was released on 2016-05-12 with total page 1763 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Conference is the premier international meeting for the presentation of original work addressing all aspects of the theory, design, fabrication, assembly, packaging, testing and application of solid-state sensors, actuators, MEMS, and microsystems.
Download or read book Handbook of Silicon Based MEMS Materials and Technologies written by Markku Tilli and published by Elsevier. This book was released on 2009-12-08 with total page 670 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications. Key topics covered include: Silicon as MEMS material Material properties and measurement techniques Analytical methods used in materials characterization Modeling in MEMS Measuring MEMS Micromachining technologies in MEMS Encapsulation of MEMS components Emerging process technologies, including ALD and porous silicon Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities. Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland. Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland. Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland. Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan. Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs Discusses properties, preparation, and growth of silicon crystals and wafers Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures
Download or read book MOEMS written by M. Edward Motamedi and published by SPIE Press. This book was released on 2005 with total page 640 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces the exciting and fast-moving field of MOEMS to graduate students, scientists, and engineers by providing a foundation of both micro-optics and MEMS that will enable them to conduct future research in the field. Born from the relatively new fields of MEMS and micro-optics, MOEMS are proving to be an attractive and low-cost solution to a range of device problems requiring high optical functionality and high optical performance. MOEMS solutions include optical devices for telecommunication, sensing, and mobile systems such as v-grooves, gratings, shutters, scanners, filters, micromirrors, switches, alignment aids, lens arrays, and hermetic wafer-scale optical packaging. An international team of leading researchers contributed to this book, and it presents examples and problems employing cutting-edge MOEM devices. It will inspire researchers to further advance the design, fabrication, and analysis of MOEM systems.
Download or read book Three Dimensional Integration and Packaging Using Silicon Micromachining written by Alexandros D. Margomenos and published by . This book was released on 2003 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Measurement Technology for Micro Nanometer Devices written by Wendong Zhang and published by John Wiley & Sons. This book was released on 2017-01-17 with total page 341 pages. Available in PDF, EPUB and Kindle. Book excerpt: A fully comprehensive examination of state-of-the-art technologies for measurement at the small scale • Highlights the advanced research work from industry and academia in micro-nano devices test technology • Written at both introductory and advanced levels, provides the fundamentals and theories • Focuses on the measurement techniques for characterizing MEMS/NEMS devices
Download or read book Microelectronics Failure Analysis written by EDFAS Desk Reference Committee and published by ASM International. This book was released on 2011 with total page 673 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes bibliographical references and index.
Download or read book Integrated Mold written by and published by . This book was released on 1996 with total page 7 pages. Available in PDF, EPUB and Kindle. Book excerpt: We detail a new monolithically integrated silicon mold/surface-micromachining process which makes possible the fabrication of stiff, high-aspect-ratio micromachined structures integrated with finely detailed, compliant structures. An important example, which we use here as our process demonstration vehicle, is that of an accelerometer with a large proof mass and compliant suspension. The proof mass is formed by etching a mold into the silicon substrate, lining the mold with oxide, filling it with mechanical polysilicon, and then planarizing back to the level of the substrate. The resulting molded structure is recessed into the substrate, forming a planar surface ideal for subsequent processing. We then add surface-micromachined springs and sense contacts. The principal advantage of this new monolithically integrated mold/surface-micromachining process is that it decouples the design of the different sections of the device: In the case of a sensitive accelerometer, it allows us to optimize independently the proof mass, which needs to be as large, stiff, and heavy as possible, and the suspension, which needs to be as delicate and compliant as possible. The fact that the high-aspect-ratio section of the device is embedded in the substrate enables the monolithic integration of high-aspect-ratio parts with surface-micromachined mechanical parts, and, in the future, also electronics. We anticipate that such an integrated mold/surface micromachining/electronics process will offer versatile high-aspect-ratio micromachined structures that can be batch-fabricated and monolithically integrated into complex microelectromechanical systems.
Download or read book A Polysilicon Sensor Array Made by a Combined Surface and Bulk Micromachining written by Rafael Blatt and published by . This book was released on 1995 with total page 302 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of the International Conference on Smart Materials Structures and Systems written by and published by Allied Publishers. This book was released on 1999 with total page 762 pages. Available in PDF, EPUB and Kindle. Book excerpt:
