Download or read book Improvement Study of Solder Bumped Flip Chip Technologies written by and published by . This book was released on with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Xvii, 116 leaves : ill. ; 30 cm.
Download or read book Improvement Study of Solder Bumped Flip Chip Technologies written by Xiaochen Fu and published by . This book was released on 2005 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability Study and Technology Development of Solder bumped Flip Chip on Low cost Substrate written by Guo Wei Xiao and published by . This book was released on 2001 with total page 374 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Flip Chip Hybrid Bonding Fan In and Fan Out Technology written by John H. Lau and published by Springer Nature. This book was released on with total page 515 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Flip Chip Technologies written by John H. Lau and published by McGraw-Hill Professional Publishing. This book was released on 1996 with total page 600 pages. Available in PDF, EPUB and Kindle. Book excerpt: A guide to flip chip technologies, for professionals in flip chip and MCM research and development, and for engineers and technical managers choosing design and manufacturing processes for electronic packaging and interconnect systems. Discusses economic, design, material, quality, and reliability issues of flip chip technologies, and details aspects of classical solder-bumped flip chip interconnect technologies; the next generations of flip chip technologies; and known-good-die testing for multiple module applications. Annotation copyright by Book News, Inc., Portland, OR
Download or read book Solder bump Flip chip Technology written by Caroline Campbell Phillips and published by . This book was released on 1990 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Low Cost Flip Chip Technologies written by John H. Lau and published by McGraw-Hill Professional Publishing. This book was released on 2000 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Of the Standard NuBGA Packages -- Thinner Substrate and Nonuniform Heat Spreader NuBGA -- Thermal Performance of the New NuBGA Package -- Temperature Distribution -- Thermal Resistance -- Cooling Power -- Wind Tunnel Experimental Analysis -- Solder Joint Reliability of the New NuBGA Package -- Electrical Performance of the New NuBGA Package -- Capacitance -- Inductance -- Summary of the New NuBGA Package -- Solder-Bumped Flip Chip in PBGA Packages -- Intel's OLGA Package Technology -- OLGA Package Design -- OLGA Wafer Bumping -- OLGA Substrate Technology -- OLGA Package Assembly -- OLGA Package Reliability -- Mitsubishi's FC-BGA Package -- Wafer Bumping -- Mitsubishi's SBU Substrate -- PC-BGA Assembly Process -- Thermal Management -- Electrical Performance -- Qualification Tests and Results -- IBM's FC-PBGA Package -- CFD Analysis for Thermal Boundary Conditions -- Nonlinear Finite Element Stress Analysis -- Simulation Results -- Solder Joint Thermal Fatigue Life Prediction -- Motorola's FC-PBGA Packages -- Thermal Management of FC-PBGA Assemblies with E3 Bumps -- Solder Joint Reliability of FC-PBGA Assemblies with C4 Bumps -- Failure Analysis of Flip Chip on Low-Cost Substrates -- Failure Analysis of FCOB with Imperfect Underfills -- Test Chip -- Test Board -- Flip Chip Assembly -- Preconditions, Reflows, and Qualification Tests -- Failure Modes and Discussions -- Die Cracking -- Interfacial Shear Strength -- Interfacial Shear Strength Between Solder Mask and Underfill.
Download or read book Solder Joint Reliability of Bga Csp Flip Chip and Fine Pitch Smt Assemblies written by John H. Lau and published by McGraw-Hill Professional Publishing. This book was released on 1997 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt: This new volume by interconnection expert on solder joints, Johns H. Lau, deals with BGA, CSP, Flip Chips, and other new technologies that underlie the electronics industry's need for smaller, faster products. Naturally, as ever-smaller products are created, the reliability of the solder joints that bind them becomes increasingly crucial. Balancing concepts and practical applications, the authors explain the fundamentals of solder joint reliability and present creative, robust packaging techniques for cost-effective interconnection.
Download or read book Investigation of Electromigration Reliability of Solder Joint in Flip chip Packages written by Min Ding and published by . This book was released on 2007 with total page 165 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electromigration related damage in solder bumps is one of the emerging issues resulting from the fast scaling-down of features in semiconductor packages. Although the electromigration phenomenon has been intensively studied on silicon level interconnect lines since the late 1960s, it is far less understood in solder bumps. Electromigration in solder joints can be quite different from that of the interconnects due to the differences in material systems and structures. This study addressed the solder joint electromigration and contained three major objectives.
Download or read book Study of Failure Mechanisms in Flip Chip Solder Joints and Microbumps Under Electromigration Using Kelvin Bump Structures and Finite Element Analysis written by Yuan-Wei Chang and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Solder Bumping for Flip chip Applications written by and published by . This book was released on with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: HKUST Call Number: Thesis ELEC 1999 Hung.
Download or read book Reliability of Solder Joints in Flip Chip Technology written by Cheng-Yi Liu and published by . This book was released on 2000 with total page 204 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Flip Chip Hybridization Using Indium Bump Technology at ARL written by Kimberley A. Olver and published by . This book was released on 2007 with total page 8 pages. Available in PDF, EPUB and Kindle. Book excerpt: Flip chip hybridization bonding is a microelectronics packaging technique which directly connects an active device to a substrate face down, eliminating the need for peripheral wirebonds. Solder material is used as the conductive link between the two parts. Soldier bumps are directly deposited onto the active regions of the device and substrate. The main type of solder bump used at the Army Research Laboratory is the indium solder bump. Indium bump technology has been a part of the electronic interconnect process field for many years. This report discusses the techniques of flip chip hybrid bonding using indium bumps.
Download or read book Reflow Soldering Processes written by Ning-Cheng Lee and published by Newnes. This book was released on 2002-01-11 with total page 282 pages. Available in PDF, EPUB and Kindle. Book excerpt: Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
Download or read book Heterogeneous Integrations written by John H. Lau and published by Springer. This book was released on 2019-04-03 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Download or read book Advances in Information Technology Research and Application 2012 Edition written by and published by ScholarlyEditions. This book was released on 2012-12-26 with total page 5246 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Information Technology Research and Application / 2012 Edition is a ScholarlyEditions™ eBook that delivers timely, authoritative, and comprehensive information about Information Technology. The editors have built Advances in Information Technology Research and Application / 2012 Edition on the vast information databases of ScholarlyNews.™ You can expect the information about Information Technology in this eBook to be deeper than what you can access anywhere else, as well as consistently reliable, authoritative, informed, and relevant. The content of Advances in Information Technology Research and Application / 2012 Edition has been produced by the world’s leading scientists, engineers, analysts, research institutions, and companies. All of the content is from peer-reviewed sources, and all of it is written, assembled, and edited by the editors at ScholarlyEditions™ and available exclusively from us. You now have a source you can cite with authority, confidence, and credibility. More information is available at http://www.ScholarlyEditions.com/.
Download or read book NEC Research Development written by and published by . This book was released on 2003 with total page 414 pages. Available in PDF, EPUB and Kindle. Book excerpt:
