Download or read book IEEE No 266 1969 written by and published by . This book was released on 1969 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book IEEE Standards written by Institute of Electrical and Electronics Engineers and published by . This book was released on 1970 with total page 20 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Catalog of Copyright Entries Third Series written by Library of Congress. Copyright Office and published by Copyright Office, Library of Congress. This book was released on 1972 with total page 1510 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Applied Solid State Science written by Raymond Wolfe and published by Academic Press. This book was released on 2013-10-22 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt: Applied Solid State Science: Advances in Materials and Device Research, Volume 3 covers reviews that are directly related to the two devices which are the epitome of applied solid state science - the transistor and the laser. The book discusses the physics of multilayer-gate IGFET memories; the application of the transient charge technique in drift velocity; and trapping in semiconductors and in materials used in xerography, nuclear particle detectors, and space-charge-limited devices; as well as thin film transistors. The text describes the manipulation of laser beams in solids and discusses the diffraction of light by sound waves and the uses of this interaction. The electrooptical and nonlinear optical properties of crystals are also considered, with emphasis on ferroelectric crystals of the oxygen octahedra class. Solid state physicists, materials scientists, electrical engineers, and graduate students studying the subjects being discussed will find the book invaluable.
Download or read book Advances in Electronics and Electron Physics written by and published by Academic Press. This book was released on 1972-01-31 with total page 357 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Electronics and Electron Physics
Download or read book Superconducting Devices Materials written by and published by . This book was released on 1968 with total page 476 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Multichip Module Technologies and Alternatives The Basics written by Daryl Ann Doane and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 895 pages. Available in PDF, EPUB and Kindle. Book excerpt: Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.
Download or read book Error correcting Codes written by William Wesley Peterson and published by MIT Press. This book was released on 1972 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt: The coding problem; Introduction to algebra; Linear codes; Error correction capabilities of linear codes; Important linear block codes; Polynomial rings and galois fields; Linear switching circuits; Cyclic codes; Bose-chaudhuri-hocquenghem codes; Arithmetic codes.
Download or read book Lon Implantation in Semiconductors written by James Mayer and published by Elsevier. This book was released on 2012-12-02 with total page 297 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ion Implantation in Semiconductors: Silicon and Germanium covers the developments in the major basic aspects in ion implantation in silicon and germanium. These aspects include dopant distribution and location, radiant damage, and electrical characteristics. This book is composed of six chapters and begins with a discussion on the factors affecting the electrical characteristics of implanted layers in silicon and germanium, such as range distributions of dopant species, lattice disorder, and location of dopant species on substitutional and interstitial sites in the lattice. The next chapters examine the basic principles of range distributions of implanted atoms and the problem of lattice disorder and radiation damage, which are vital in most implantation work. These topics are followed by an outline of the so-called channeling effect technique and its application in lattice location determination of implanted atoms. A chapter describes the dopant behavior in the layers where the majority of the implanted atoms are located, emphasizing the use of Hall-effect and sheet-resistivity measurements to determine the carrier concentration and mobility. The final chapter considers the primary characteristics of ion-implanted layers in semiconductors. This chapter also presents several rules of thumb, which allow first approximations to be made. This book is an ideal source for semiconductor specialists, researchers, and manufacturers.
Download or read book Proceedings of the Fourth International Joint Conference on Pattern Recognition November 7 10 1978 Kyoto Japan written by and published by . This book was released on 1978 with total page 1202 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Physics of Thin Films written by Maurice H. Francombe and published by Elsevier. This book was released on 2013-10-22 with total page 385 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physics of Thin Films: Advances in Research and Development, Volume 6 reviews the rapid progress that has been made in research and development concerning the physics of thin films, with emphasis on metallic films. Topics covered include anodic oxide films, thin metal films and wires, and multilayer magnetic films. This volume is comprised of five chapters and begins with a discussion on the dielectric properties and the technique of plasma anodization which are relevant to the applications of anodic oxide films in electronic devices. Conduction, polarization, and dielectric breakdown effects are also considered. The next chapter examines studies on size-dependent electrical conduction in thin metal films and wires, paying particular attention to both classical and quantum size effects and some of the anisotropic characteristics of epitaxial metal films. The reader is then introduced to the optical properties of metal films and interactions in multilayer magnetic films. This text concludes with a chapter that looks at diffusion in metallic films and presents experimental results for phase-forming systems, miscible systems, and lateral diffusion. This monograph will be of value to students and practitioners of physics, especially those interested in thin films.
Download or read book Current Catalog written by National Library of Medicine (U.S.) and published by . This book was released on 1970 with total page 1040 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes subject section, name section, and 1968-1970, technical reports.
Download or read book Journal of Research of the National Bureau of Standards written by United States. National Bureau of Standards and published by . This book was released on 1976 with total page 1224 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Power Quality in Power Systems and Electrical Machines written by Ewald F. Fuchs and published by Academic Press. This book was released on 2011-08-29 with total page 659 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Quality in Power Systems and Electrical Machines, Second Edition helps readers understand the causes and effects of power quality problems and provides techniques to mitigate these problems. Power quality is a measure of deviations in supply systems and their components, and affects all connected electrical and electronic equipment, including computers, TV monitors, and lighting. In this book analytical and measuring techniques are applied to power quality problems as they occur in central power stations and distributed generation such as alternative power systems. Provides theoretical and practical insight into power quality problems; most books available are either geared to theory or practice only Problems and solutions at the end of each chapter dealing with practical applications Includes application examples implemented in SPICE, Mathematica, and MATLAB
Download or read book Advances in Cryogenic Engineering written by K. Timmerhaus and published by Springer Science & Business Media. This book was released on 2013-11-21 with total page 538 pages. Available in PDF, EPUB and Kindle. Book excerpt: The year 1973 marked the first time that Atlanta, one of the cultural centers of the South, has hosted the Cryogenic Engineering Conference since its beginning in 1954. The Cryogenic Engineering Conference gratefully acknowledges the hospital ity of the Georgia Institute of Technology and the assistance of W. T. Ziegler and his staff in making the visit to Atlanta a pleasant and memorable one. Several significant changes were initiated at the 1973 Cryogenic Engineering Conference. These included a Conference theme on the subject of "Energy and the Environment," a new Conference format, and the beginning of a new Conference frequency of biennial meetings. While retaining the traditional topics of previous meetings, the 1973 Cryogenic Engineering Conference focused on the role of cryo genic engineering in the generation, distribution, and conversion of energy, and the related environmental effects. In these areas, much of the current interest stems from the environmental effects of LNG and liquid hydrogen as compared with other competing energy forms. These rapidly expanding areas may provide the impetus to cryogenic engineering in the 1970's that the space program provided in the 1960's. The Conference format was altered by the use of numerous invited papers highlighting the theme. These presentations were concentrated in plenary sessions initiating each day's activities, and in seminars designed to summarize the various aspects of the theme.
Download or read book Solder Joint Reliability written by John H. Lau and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 649 pages. Available in PDF, EPUB and Kindle. Book excerpt: Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
Download or read book Proceedings written by and published by . This book was released on 1974 with total page 802 pages. Available in PDF, EPUB and Kindle. Book excerpt:
