Download or read book IEEE Annual International Reliability Physics 1991 written by IEEE Electron Devices Society and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1991-04 with total page 390 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book IEEE Annual International Reliability Physics 1991 written by IEEE, Electron Devices Society and Reliability Society Staff and published by . This book was released on 1991 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability Physics 29th Annual Proceedings 1991 written by Reliability Physics and published by . This book was released on with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability Physics 1992 written by Calif.) International Reliability Physics Symposium (30th : 1992 : San Diego and published by . This book was released on 1992 with total page 404 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 29th Annual Proceedings Reliability Physics 1991 written by and published by . This book was released on 1991 with total page 367 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 29th Annual Proceedings Reliability Physics 1991 written by and published by . This book was released on 1991 with total page 367 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability Physics written by and published by . This book was released on 1991 with total page 367 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability Physics and Engineering written by J. W. McPherson and published by Springer Science & Business Media. This book was released on 2013-06-03 with total page 406 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Reliability Physics and Engineering" provides critically important information for designing and building reliable cost-effective products. The textbook contains numerous example problems with solutions. Included at the end of each chapter are exercise problems and answers. "Reliability Physics and Engineering" is a useful resource for students, engineers, and materials scientists.
Download or read book IEEE Annual International Reliability Physics written by IEEE Reliability Society and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1992-03 with total page 375 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability Assessments written by Franklin Richard Nash, Ph.D. and published by CRC Press. This book was released on 2017-07-12 with total page 784 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides engineers and scientists with a single source introduction to the concepts, models, and case studies for making credible reliability assessments. It satisfies the need for thorough discussions of several fundamental subjects. Section I contains a comprehensive overview of assessing and assuring reliability that is followed by discussions of: • Concept of randomness and its relationship to chaos • Uses and limitations of the binomial and Poisson distributions • Relationship of the chi-square method and Poisson curves • Derivations and applications of the exponential, Weibull, and lognormal models • Examination of the human mortality bathtub curve as a template for components Section II introduces the case study modeling of failure data and is followed by analyses of: • 5 sets of ideal Weibull, lognormal, and normal failure data • 83 sets of actual (real) failure data The intent of the modeling was to find the best descriptions of the failures using statistical life models, principally the Weibull, lognormal, and normal models, for characterizing the failure probability distributions of the times-, cycles-, and miles-to-failure during laboratory or field testing. The statistical model providing the preferred characterization was determined empirically by choosing the two-parameter model that gave the best straight-line fit in the failure probability plots using a combination of visual inspection and three statistical goodness-of-fit (GoF) tests. This book offers practical insight in dealing with single item reliability and illustrates the use of reliability methods to solve industry problems.
Download or read book Reliability and Failure of Electronic Materials and Devices written by Milton Ohring and published by Academic Press. This book was released on 2014-10-14 with total page 759 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Download or read book Reliability Physics 1991 written by and published by IEEE. This book was released on 1991 with total page 367 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book CRC Handbook of Thermal Engineering written by Raj P. Chhabra and published by CRC Press. This book was released on 2017-11-08 with total page 1649 pages. Available in PDF, EPUB and Kindle. Book excerpt: The CRC Handbook of Thermal Engineering, Second Edition, is a fully updated version of this respected reference work, with chapters written by leading experts. Its first part covers basic concepts, equations and principles of thermodynamics, heat transfer, and fluid dynamics. Following that is detailed coverage of major application areas, such as bioengineering, energy-efficient building systems, traditional and renewable energy sources, food processing, and aerospace heat transfer topics. The latest numerical and computational tools, microscale and nanoscale engineering, and new complex-structured materials are also presented. Designed for easy reference, this new edition is a must-have volume for engineers and researchers around the globe.
Download or read book Influence of Temperature on Microelectronics and System Reliability written by Pradeep Lall and published by CRC Press. This book was released on 2020-07-09 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
Download or read book Future Energy Conferences and Symposia written by and published by . This book was released on 1989 with total page 838 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Springer Handbook of Electronic and Photonic Materials written by Safa Kasap and published by Springer Science & Business Media. This book was released on 2007-08-01 with total page 1409 pages. Available in PDF, EPUB and Kindle. Book excerpt: Contributions from well known and respected researchers throughout the world Thorough coverage of electronic and opto-electronic materials that today's electrical engineers, material scientists and physicists need Interdisciplinary approach encompasses research in disciplines such as materials science, electrical engineering, chemical engineering, mechanical engineering, physics and chemistry
Download or read book Nanotechnology written by Gregory L. Timp and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 696 pages. Available in PDF, EPUB and Kindle. Book excerpt: A survey of the machinery and science of the nanometer scale. Its twenty-two contributing authors, drawn from many different disciplines including atomic physics, microelectronics, polymer chemistry, and biophysics, delineate the course of current research and articulate a vision for the development of the nanometer frontiers in electronics, mechanics, chemistry, magnetics, materials, and biology. They reveal a world thirty years hence where motors are smaller than the diameter of a human hair; where single-celled organisms are programmed to fabricate materials with nanometer precision; where single atoms are used for computation, and where quantum chaos is the norm. Aimed at the level of at least a junior- or senior- level undergraduate in biology, chemistry, physics, or engineering.
