Download or read book Electrical Performance of Electronic Packaging written by and published by . This book was released on 2003 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Power Integrity Modeling and Design for Semiconductors and Systems written by Madhavan Swaminathan and published by Pearson Education. This book was released on 2007-11-19 with total page 599 pages. Available in PDF, EPUB and Kindle. Book excerpt: The First Comprehensive, Example-Rich Guide to Power Integrity Modeling Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art. Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications. The authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.
Download or read book Functional Micro and Nanosystems written by Karl-Heinz Hoffmann and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 138 pages. Available in PDF, EPUB and Kindle. Book excerpt: The 4th caesarium brought together world known experts reporting the state-of-the-art of Functional Micro-and Nanosystems. Its purpose was to identify and open up new research directions in this rapidly evolving new area and to discuss the potential with respect to applications in automotive, biochemical and information technology. Thin film technologies are an attractive approach to incorporate functional properties into micro- or nano-systems. The continuing development towards smaller structures is driven by the use of higher driving frequencies and thus smaller wavelengths, the growing integration of different functions, the higher degree of parallelism, and size requirements for the detection of bio-molecules. Hence this new technology opens up new possibilities in terms of high frequency wireless data transmission over long distances, sensors showing high spatial and time resolution and new devices to process biological, optical and electrical signals.
Download or read book S Parameters for Signal Integrity written by Peter J. Pupalaikis and published by Cambridge University Press. This book was released on 2020-02-06 with total page 667 pages. Available in PDF, EPUB and Kindle. Book excerpt: Master the usage of s-parameters in signal integrity applications and gain full understanding of your simulation and measurement environment with this rigorous and practical guide. Solve specific signal integrity problems including calculation of the s-parameters of a network, linear simulation of circuits, de-embedding, and virtual probing, all with expert guidance. Learn about the interconnectedness of s-parameters, frequency responses, filters, and waveforms. This invaluable resource for signal integrity engineers is supplemented with the open-source software SignalIntegrity, a Python package for scripting solutions to signal integrity problems.
Download or read book SiGe HBTs and MMICs written by Kok-Yan Lee and published by . This book was released on 2005 with total page 320 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book ARFTG Conference Digest written by and published by . This book was released on 2003 with total page 320 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Circuits and Applications Using Silicon Heterostructure Devices written by John D. Cressler and published by CRC Press. This book was released on 2018-10-03 with total page 360 pages. Available in PDF, EPUB and Kindle. Book excerpt: No matter how you slice it, semiconductor devices power the communications revolution. Skeptical? Imagine for a moment that you could flip a switch and instantly remove all the integrated circuits from planet Earth. A moment’s reflection would convince you that there is not a single field of human endeavor that would not come to a grinding halt, be it commerce, agriculture, education, medicine, or entertainment. Life, as we have come to expect it, would simply cease to exist. Drawn from the comprehensive and well-reviewed Silicon Heterostructure Handbook, this volume covers SiGe circuit applications in the real world. Edited by John D. Cressler, with contributions from leading experts in the field, this book presents a broad overview of the merits of SiGe for emerging communications systems. Coverage spans new techniques for improved LNA design, RF to millimeter-wave IC design, SiGe MMICs, SiGe Millimeter-Wave ICs, and wireless building blocks using SiGe HBTs. The book provides a glimpse into the future, as envisioned by industry leaders.
Download or read book Silicon Heterostructure Handbook written by John D. Cressler and published by CRC Press. This book was released on 2018-10-03 with total page 1248 pages. Available in PDF, EPUB and Kindle. Book excerpt: An extraordinary combination of material science, manufacturing processes, and innovative thinking spurred the development of SiGe heterojunction devices that offer a wide array of functions, unprecedented levels of performance, and low manufacturing costs. While there are many books on specific aspects of Si heterostructures, the Silicon Heterostructure Handbook: Materials, Fabrication, Devices, Circuits, and Applications of SiGe and Si Strained-Layer Epitaxy is the first book to bring all aspects together in a single source. Featuring broad, comprehensive, and in-depth discussion, this handbook distills the current state of the field in areas ranging from materials to fabrication, devices, CAD, circuits, and applications. The editor includes "snapshots" of the industrial state-of-the-art for devices and circuits, presenting a novel perspective for comparing the present status with future directions in the field. With each chapter contributed by expert authors from leading industrial and research institutions worldwide, the book is unequalled not only in breadth of scope, but also in depth of coverage, timeliness of results, and authority of references. It also includes a foreword by Dr. Bernard S. Meyerson, a pioneer in SiGe technology. Containing nearly 1000 figures along with valuable appendices, the Silicon Heterostructure Handbook authoritatively surveys materials, fabrication, device physics, transistor optimization, optoelectronics components, measurement, compact modeling, circuit design, and device simulation.
Download or read book Proceedings written by and published by . This book was released on 1997 with total page 1330 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 2003 with total page 870 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Robust Electronic Design Reference Book no special title written by John R. Barnes and published by Springer Science & Business Media. This book was released on 2004 with total page 1356 pages. Available in PDF, EPUB and Kindle. Book excerpt: If you design electronics for a living, you need Robust Electronic Design Reference Book. Written by a working engineer, who has put over 115 electronic products into production at Sycor, IBM, and Lexmark, Robust Electronic Design Reference covers all the various aspects of designing and developing electronic devices and systems that: -Work. -Are safe and reliable. -Can be manufactured, tested, repaired, and serviced. -May be sold and used worldwide. -Can be adapted or enhanced to meet new and changing requirements.
Download or read book PCB Design for Real World EMI Control written by Bruce R. Archambeault and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 251 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proper design of printed circuit boards can make the difference between a product passing emissions requirements during the first cycle or not. Traditional EMC design practices have been simply rule-based, that is, a list of rules-of-thumb are presented to the board designers to implement. When a particular rule-of-thumb is difficult to implement, it is often ignored. After the product is built, it will often fail emission requirements and various time consuming and costly add-ons are then required. Proper EMC design does not require advanced degrees from universities, nor does it require strenuous mathematics. It does require a basic understanding of the underlying principles of the potential causes of EMC emissions. With this basic understanding, circuit board designers can make trade-off decisions during the design phase to ensure optimum EMC design. Consideration of these potential sources will allow the design to pass the emissions requirements the first time in the test laboratory. A number of other books have been published on EMC. Most are general books on EMC and do not focus on printed circuit board is intended to help EMC engineers and design design. This book engineers understand the potential sources of emissions and how to reduce, control, or eliminate these sources. This book is intended to be a 'hands-on' book, that is, designers should be able to apply the concepts in this book directly to their designs in the real-world.
Download or read book Forthcoming Books written by Rose Arny and published by . This book was released on 2002 with total page 1752 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Publications in Engineering written by and published by . This book was released on 2000 with total page 672 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book BMAS written by and published by . This book was released on 2004 with total page 158 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Frequency domain Characterization of Power Distribution Networks written by Dr. Istvan Novak and published by Artech House Publishers. This book was released on 2007 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power distribution networks (PDNs) are key components in today's high-performance electronic circuitry. They ensure that circuits have a constant, stable supply of power. The complexities of designing PDNs have been dramatically reduced by frequency-domain analysis. This book examines step-by-step how electrical engineers can use frequency-domain techniques to accurately simulate, measure, and model PDNs. It guides engineers through the ins and outs of these techniques to ensure they develop the right PDN for any type of circuit. Circuit engineers gain valuable insight from the book's best practices for measuring, simulating, and modeling. Practical examples illustrate every phase in PDN development from material characterization and component design to modeling the entire network.
Download or read book The International Journal of Microcircuits and Electronic Packaging written by and published by . This book was released on 2000 with total page 90 pages. Available in PDF, EPUB and Kindle. Book excerpt:
