Download or read book Hybrid Numerical Electromagnetic Modeling Techniques for Analyzing Printed Circuit Board Geometries written by Chunlei Guo and published by . This book was released on 2005 with total page 156 pages. Available in PDF, EPUB and Kindle. Book excerpt: "This dissertation discusses three topics relevant to the improvement of hybrid numerical electromagnetic techniques. These techniques can be applied to a variety of problems, but the primary focus of this work is modeling printed circuit boards. The first topic describes an approach to transform the FEM matrix equation into equivalent circuits and applies this approach to the modeling of power bus structures. The equivalent circuits can then be analyzed using SPICE programs. The remaining topics discussed in this dissertation relate to hybrid FEM/MoM methods that combine the finite element method (FEM) and the method of moments (MoM) to model inhomogeneous unbound problems. The second topic applies a fast multipole method to reduce the computational complexity associated with the MoM part of the hybrid method. The last topic presents effective preconditioners for the solution of the hybrid FEM/MoM matrix equation using combined formulations. The effective preconditioners are derived from the FEM and absorbing boundary condition (ABC)"--Abstract, leaf iv.
Download or read book Development and Applications of a Hybrid Finite element Method method of moments FEM MoM Tool to Model Electromagnetic Compatibility and Signal Integrity Problems in Printed Circuit Boards written by Yun Ji and published by . This book was released on 2000 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: "EMAP5 is a numerical software package designed to model electromagnetic problems. It is a hybrid finite-element/moment-method (FEM/MoM) code. It employs the finite element method to analyze a volume, and employs the method of moments to analyze the current distribution on the surface of the volume. The two methods are coupled through the tangential fields on the volume surface. This dissertation presents the latest improvements made to the EMAP5 code. A novel preconditioning technique is developed that can significantly improve the efficiency and accuracy of iterative solvers. Three different solution methods are investigated and a general guideline for choosing solution methods is provided. The interior resonance problem of the electric- and magnetic- field integral equations (EFIE and MFIE) is investigated. A combined field integral equation (CFIE) is implemented. The CFIE avoids problems due to the interior resonance when solving electromagnetic scattering problems and when modeling typical printed circuit board (PCB) geometries. The dissertation also discusses methods for efficiently analyzing PCB geometries using hybrid FEM/MoM techniques"--Abstract, leaf iv
Download or read book Modern EMC Analysis Techniques Volume II written by Nikolaos V. Kantartzis and published by Morgan & Claypool Publishers. This book was released on 2008-07-08 with total page 248 pages. Available in PDF, EPUB and Kindle. Book excerpt: The objective of this two-volume book is the systematic and comprehensive description of the most competitive time-domain computational methods for the efficient modeling and accurate solution of modern real-world EMC problems. Intended to be self-contained, it performs a detailed presentation of all well-known algorithms, elucidating on their merits or weaknesses, and accompanies the theoretical content with a variety of applications. Outlining the present volume, numerical investigations delve into printed circuit boards, monolithic microwave integrated circuits, radio frequency microelectromechanical systems as well as to the critical issues of electromagnetic interference, immunity, shielding, and signal integrity. Biomedical problems and EMC test facility characterizations are also thoroughly covered by means of diverse time-domain models and accurate implementations. Furthermore, the analysis covers the case of large-scale applications and electrostatic discharge problems, while special attention is drawn to the impact of contemporary materials in the EMC world, such as double negative metamaterials, bi-isotropic media, and several others. Table of Contents: Introduction / Printed Circuit Boards in EMC Structures / Electromagnetic Interference, Immunity, Shielding, and Signal Integrity / Bioelectromagnetic Problems: Human Exposure to Electromagnetic Fields / Time-Domain Characterization of EMC Test Facilities / Large-Scale EMC and Electrostatic Discharge Problems / Contemporary Material Modeling in EMC Applications
Download or read book Circuit Oriented Electromagnetic Modeling Using the PEEC Techniques written by Albert Ruehli and published by John Wiley & Sons. This book was released on 2017-06-19 with total page 461 pages. Available in PDF, EPUB and Kindle. Book excerpt: Bridges the gap between electromagnetics and circuits by addressing electrometric modeling (EM) using the Partial Element Equivalent Circuit (PEEC) method This book provides intuitive solutions to electromagnetic problems by using the Partial Element Equivalent Circuit (PEEC) method. This book begins with an introduction to circuit analysis techniques, laws, and frequency and time domain analyses. The authors also treat Maxwell's equations, capacitance computations, and inductance computations through the lens of the PEEC method. Next, readers learn to build PEEC models in various forms: equivalent circuit models, non-orthogonal PEEC models, skin-effect models, PEEC models for dielectrics, incident and radiate field models, and scattering PEEC models. The book concludes by considering issues like stability and passivity, and includes five appendices some with formulas for partial elements. Leads readers to the solution of a multitude of practical problems in the areas of signal and power integrity and electromagnetic interference Contains fundamentals, applications, and examples of the PEEC method Includes detailed mathematical derivations Circuit Oriented Electromagnetic Modeling Using the PEEC Techniques is a reference for students, researchers, and developers who work on the physical layer modeling of IC interconnects and Packaging, PCBs, and high speed links.
Download or read book Electrical Modeling and Design for 3D System Integration written by Er-Ping Li and published by John Wiley & Sons. This book was released on 2012-04-10 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt: New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.
Download or read book Modern EMC Analysis Techniques Volume II written by Nikolaos Kantartzis and published by Springer Nature. This book was released on 2022-06-01 with total page 238 pages. Available in PDF, EPUB and Kindle. Book excerpt: The objective of this two-volume book is the systematic and comprehensive description of the most competitive time-domain computational methods for the efficient modeling and accurate solution of modern real-world EMC problems. Intended to be self-contained, it performs a detailed presentation of all well-known algorithms, elucidating on their merits or weaknesses, and accompanies the theoretical content with a variety of applications. Outlining the present volume, numerical investigations delve into printed circuit boards, monolithic microwave integrated circuits, radio frequency microelectromechanical systems as well as to the critical issues of electromagnetic interference, immunity, shielding, and signal integrity. Biomedical problems and EMC test facility characterizations are also thoroughly covered by means of diverse time-domain models and accurate implementations. Furthermore, the analysis covers the case of large-scale applications and electrostatic discharge problems, while special attention is drawn to the impact of contemporary materials in the EMC world, such as double negative metamaterials, bi-isotropic media, and several others. Table of Contents: Introduction / Printed Circuit Boards in EMC Structures / Electromagnetic Interference, Immunity, Shielding, and Signal Integrity / Bioelectromagnetic Problems: Human Exposure to Electromagnetic Fields / Time-Domain Characterization of EMC Test Facilities / Large-Scale EMC and Electrostatic Discharge Problems / Contemporary Material Modeling in EMC Applications
Download or read book Modeling and Design of Electromagnetic Compatibility for High Speed Printed Circuit Boards and Packaging written by Xing-Chang Wei and published by CRC Press. This book was released on 2017-09-19 with total page 341 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.
Download or read book Modeling and Design of Electromagnetic Compatibility for High speed Printed Circuit Boards and Packaging written by Xing-Chang Wei and published by CRC Press. This book was released on 2017 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: 7.2.2.1 Modeling of the Graphene Absorber -- 7.2.2.2 Fabrication and Measurement -- 7.2.2.3 Conclusion -- References -- Index
Download or read book Electromagnetic Compatibility written by David Weston and published by CRC Press. This book was released on 2017-12-19 with total page 860 pages. Available in PDF, EPUB and Kindle. Book excerpt: This totally revised and expanded reference/text provides comprehensive, single-source coverage of the design, problem solving, and specifications of electromagnetic compatibility (EMC) into electrical equipment/systems-including new information on basic theories, applications, evaluations, prediction techniques, and practical diagnostic options for preventing EMI through cost-effective solutions. Offers the most recent guidelines, safety limits, and standards for human exposure to electromagnetic fields! Containing updated data on EMI diagnostic verification measurements, as well as over 900 drawings, photographs, tables, and equations-500 more than the previous edition-Electromagnetic Compatibility: Principles and Applications, Second Edition:
Download or read book Techniques for Numerically Efficient Analysis of Multi scale Problems in Computational Electromagnetics written by Kapil Sharma and published by . This book was released on 2017 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Multi-scale problems in numerical electromagnetics are becoming increasingly common with the advent and widespread usage of compact mobile phones, body area networks, small and nano antennas, sensors, high-speed interconnects, integrated circuits and complex electronic packaging structures, to name just a few commercial applications. Numerical electromagnetic modeling and simulation of structures with multi-scale features is highly challenging due to the fact that electrically small as well as large features are simultaneously present in the model which demands for discretization of the computational domain such that the number of degrees of freedom is very large, thus, levying a heavy burden on computational resources. The multi-scale nature of a given problem also exacerbates the challenge of generating very fine meshes which do not introduce instabilities or ill-conditioned behaviors. In this work we introduce a hybrid technique, which combines frequency domain and time domain techniques in a manner such that the fine features (electrically small) of the object being modeled are handled by the Method of Moments (MoM) technique while the electrically large parts of the structure are dealt with by using the Finite-Difference Time-Domain (FDTD) technique in order to reduce the computational burden. Recently, structures with multi-scale features have been simulated by using the dipole moment (DM) approach combined with the FDTD technique to handle fine features in a multi-scale geometry. However, when the size of the scatterer becomes larger in terms of the wavelength and the quasi-static assumption becomes invalid, extensive modifications of the DM/FDTD hybrid approach are needed resulting in a high computational cost.The research proposes a novel hybrid FDTD technique, which combines the Method of Moments and the Finite-Difference Time-Domain techniques directly in the time domain circumventing the need to carry out frequency transform calculations as required in the DM approach when the object size is not small (size>/20). The proposed technique utilizes piecewise sinusoidal basis functions to represent the currents on arbitrarily shaped wires with fine features, and modified RWG basis function for surfaces. The fields scattered by the object with fine features in MoM region are computed in the time domain on a planar interface. The time domain fields obtained at the planar interface are then combined with the FDTD update equations. In contrast to the existing techniques used to handle this type of problems, the proposed technique is both efficient as well as stable.
Download or read book REDUCTION OF ELECTROMAGNETIC I written by Chun-Ming Angus Lee and published by Open Dissertation Press. This book was released on 2017-01-27 with total page 118 pages. Available in PDF, EPUB and Kindle. Book excerpt: This dissertation, "Reduction of Electromagnetic Interference Due to Electric Field Coupling on Printed Circuit Board" by Chun-ming, Angus, Lee, 李俊明, was obtained from The University of Hong Kong (Pokfulam, Hong Kong) and is being sold pursuant to Creative Commons: Attribution 3.0 Hong Kong License. The content of this dissertation has not been altered in any way. We have altered the formatting in order to facilitate the ease of printing and reading of the dissertation. All rights not granted by the above license are retained by the author. Abstract: ABSTRACT The broad applications of power electronic equipment improve the power factor and efficiency of the power converters, but they also generate electromagnetic noise to pollute the environment and the power system network. The development of power filter technology provides an effective solution towards the power frequency harmonics. Through its research, this thesis contributes to the development of high frequency electromagnetic interference (EMI) in switch mode power supply (SMPS). Traditional EMI reduction technologies relies on filtering and shielding, which are generally applied to the product by simple design rules or integrated simulation software. The high voltage switching characteristics of the switch mode power supply and the near field electric coupling between the PCB traces have a significant impact on the final EMI emission of the product. A novel approach technique to reduce such the electric coupling is mandatory. This thesis describes the measurement method used to assess the electric field coupling and the level of significance. The measurement result confirms the contribution of the electric coupling in the overall EMI generated from the SMPS. Extensive experiments verify the effectiveness of EMI reduction techniques. A thorough analysis on the electric field models of the PCB traces concludes the capacitance effect determines a high portion of the EMI generated from the SMPS. Nevertheless, the calculation of capacitance is time consuming. Any alternation in the geometry of the circuit requires the whole system to be re-calculated the whole system. During the experimental stage, a de-coupled field calculation closely resembles the mythesis.doc - iii - capacitance. The index of the electric field coupling is then defined as the "Coupling Index." It comprises the benefits fast calculation and independence of the changes in the PCB geometry. Utilising the "Coupling Index," a computer simulation tool is developed to provide a quantitative comparison on the noise coupling as well as the EMI as a result of electric field coupling. On the whole, the simulation tool combined with artificial intelligence forms an integrated simulation software with automatic trace routing. The software optimises the effects of the electric field coupling between the PCB traces to reduce the EMI generation. In summary, this thesis demonstrates the EMI due to electric field coupling in SMPS and develops an automatic software package to reduce the coupling effect with the aid of artificial software. This contributes to the ultimate PCB auto-routing tools with all EMI parameters taken into consideration. mythesis.doc - iv - DOI: 10.5353/th_b2995770 Subjects: Electromagnetic interference Electronic circuits - Noise
Download or read book Symposium Record written by and published by . This book was released on 1997 with total page 678 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electrical Electronics Abstracts written by and published by . This book was released on 1997 with total page 1860 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microwave Circuit Modeling Using Electromagnetic Field Simulation written by Daniel G. Swanson and published by Artech House. This book was released on 2003 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt: Annotation This practical "how to" book is an ideal introduction to electromagnetic field-solvers. Where most books in this area are strictly theoretical, this unique resource provides engineers with helpful advice on selecting the right tools for their RF (radio frequency) and high-speed digital circuit design work
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1995 with total page 702 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Applied Mechanics Reviews written by and published by . This book was released on 1992 with total page 348 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book The International Journal of Microcircuits and Electronic Packaging written by and published by . This book was released on 1992 with total page 1220 pages. Available in PDF, EPUB and Kindle. Book excerpt:
