Download or read book Scanning Electron Microscope Examination of Wire Bonds from High reliability Devices written by Kathryn O. Leedy and published by . This book was released on 1973 with total page 40 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book High Reliability Autonomous Management Systems for Spacecraft written by Jianjun Zhang and published by Elsevier. This book was released on 2023-08-22 with total page 208 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book examines the autonomous management of spacecraft, which uses modern control technologies such as artificial intelligence to establish a remote intelligent body on the spacecraft so that the spacecraft can complete its flight tasks by itself. Its goal is to accurately perceive its own state and external environment without relying on external information injection and control, or rely on external control as little as possible, make various appropriate decisions based on this information and user tasks, and be able to autonomously control spacecraft to complete various tasks. - Divides the autonomous management level of spacecraft into two levels: - Basic autonomy to meet spacecraft health requirements, namely, autonomous health management, and autonomy of the advanced stage. - Divides the implementation of spacecraft autonomous management into three aspects: - Autonomous health management of spacecraft – the spacecraft can monitor and sense its own state and can autonomously detect, isolate, and recover from faults. - Autonomous mission management – the spacecraft can directly receive the mission, formulate a reasonable plan according to the current state and working environment of the spacecraft, and convert the mission into a specific sequence of instructions. - Spacecraft autonomous data management – the spacecraft processes a large amount of raw data and extracts useful information and autonomously executes or changes flight tasks. - The autonomous management model of the spacecraft is divided into two points: - Compatibility – the existing traditional control systems belong to the execution layer logic and are compatible with the existing systems. - Scalability – it adopts a layered structure, and each layer has different autonomous capabilities.
Download or read book Semiconductor Device Reliability written by A. Christou and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 571 pages. Available in PDF, EPUB and Kindle. Book excerpt: This publication is a compilation of papers presented at the Semiconductor Device Reliabi lity Workshop sponsored by the NATO International Scientific Exchange Program. The Workshop was held in Crete, Greece from June 4 to June 9, 1989. The objective of the Workshop was to review and to further explore advances in the field of semiconductor reliability through invited paper presentations and discussions. The technical emphasis was on quality assurance and reliability of optoelectronic and high speed semiconductor devices. The primary support for the meeting was provided by the Scientific Affairs Division of NATO. We are indebted to NATO for their support and to Dr. Craig Sinclair, who admin isters this program. The chapters of this book follow the format and order of the sessions of the meeting. Thirty-six papers were presented and discussed during the five-day Workshop. In addi tion, two panel sessions were held, with audience participation, where the particularly controversial topics of bum-in and reliability modeling and prediction methods were dis cussed. A brief review of these sessions is presented in this book.
Download or read book High Reliability Magnetic Devices written by Colonel Wm. T. McLyman and published by CRC Press. This book was released on 2002-07-17 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: Showcasing the most authoritative information, this book features step-by-step instructions on ordering raw materials, choosing construction techniques, conducting in-process inspection, performing end-item testing, and providing quality assurance recommendations to improve reliability and minimize cost. Providing 400 easy-to-follow illustrations, the book features discussions on the maximization of output power in transformer design, toroidal powder core selection, transformer and inductor losses, eddy currents and insulation, annealing and stress-relief in magnetic cores, magnet wire and electrical insulating materials, soldering and magnet wire termination, and more.
Download or read book Reliability Engineering for Nuclear and Other High Technology Systems 1985 written by A.A. Lakner and published by CRC Press. This book was released on 2017-11-22 with total page 465 pages. Available in PDF, EPUB and Kindle. Book excerpt: First Published in 2017. This book presents a much needed practical methodology for the establishment of cost-effective reliability programs in nuclear or other high technology industries. Thanks to the high competence and practical experience of the authors in the field of reliability, it vividly illustrates the applicability of proven, cost-effective reliability techniques applied in the American space and military programs as hybridized with the avant-garde approach used by nuclear authorities, utilities and researchers in the United Kingdom and France. This emerged method will support a diligent effort in the enhancement of nuclear safety and protection of the health of the general public. The methodology developed in this book exemplifies the total integrated reliability program approach in the design, procurement, manufacturing, test, installation and operational phases of an equipment life cycle. It is based on lessons learned in space and military programs with certain methodological modifications to enhance practicality. The techniques described here are applicable to college instruction, plant upper and middle management personnel, as well as to regulating agencies with equal benefits; it provides a very pragmatic and cost-efficient approach to the reliability engineering discipline
Download or read book Leading High Reliability Organizations in Healthcare written by Richard Morrow and published by CRC Press. This book was released on 2016-03-15 with total page 246 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book details the attributes and practices that help high-reliability organizations (HROs) excel in the service they provide to their customers. Explaining what it takes to achieve high reliability in healthcare settings, it presents proven tools and concepts that leading healthcare organizations are using to improve safety and quality. The book identifies the necessary infrastructure, methods, and analytics required to achieve and sustain higher reliability. It also includes case studies that illustrate success stories and failures, so readers can avoid making the same mistakes.
Download or read book The Circuit Designer s Companion written by Tim Williams and published by Elsevier. This book was released on 2013-10-22 with total page 313 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Circuit Designer's Companion covers the theoretical aspects and practices in analogue and digital circuit design. Electronic circuit design involves designing a circuit that will fulfill its specified function and designing the same circuit so that every production model of it will fulfill its specified function, and no other undesired and unspecified function. This book is composed of nine chapters and starts with a review of the concept of grounding, wiring, and printed circuits. The subsequent chapters deal with the passive and active components of circuitry design. These topics are followed by discussions of the principles of other design components, including linear integrated circuits, digital circuits, and power supplies. The remaining chapters consider the vital role of electromagnetic compatibility in circuit design. These chapters also look into safety, design of production, testability, reliability, and thermal management of the designed circuit. This book is of great value to electrical and design engineers.
Download or read book Advanced MOS Device Physics written by Norman Einspruch and published by Elsevier. This book was released on 2012-12-02 with total page 383 pages. Available in PDF, EPUB and Kindle. Book excerpt: VLSI Electronics Microstructure Science, Volume 18: Advanced MOS Device Physics explores several device physics topics related to metal oxide semiconductor (MOS) technology. The emphasis is on physical description, modeling, and technological implications rather than on the formal aspects of device theory. Special attention is paid to the reliability physics of small-geometry MOSFETs. Comprised of eight chapters, this volume begins with a general picture of MOS technology development from the device and processing points of view. The critical issue of hot-carrier effects is discussed, along with the device engineering aspects of this problem; the emerging low-temperature MOS technology; and the problem of latchup in scaled MOS circuits. Several device models that are suitable for use in circuit simulators are also described. The last chapter examines novel electron transport effects observed in ultra-small MOS structures. This book should prove useful to semiconductor engineers involved in different aspects of MOS technology development, as well as for researchers in this field and students of the corresponding disciplines.
Download or read book NBS Special Publication written by and published by . This book was released on 1968 with total page 828 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliable Design of Medical Devices written by Richard C. Fries and published by CRC Press. This book was released on 1997-01-30 with total page 734 pages. Available in PDF, EPUB and Kindle. Book excerpt: Presenting the basic concepts and major issues associated with medical device design, this text describes current development processes as well as standards and regulatory information, providing a basis for assessing new technologies. It aims to help manufacturers establish and operate a viable reliability assurance programme, and purchasers to formulate effective methods of vendor evaluation.
Download or read book NBS FDA Workshop Reliability Technology for Cardiac Pacemakers written by Harry A. Schafft and published by . This book was released on 1976 with total page 60 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microelectronics in Space Research written by Research Triangle Institute. Solid State Laboratory and published by . This book was released on 1965 with total page 148 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Publications of the National Bureau of Standards 1973 Catalog written by United States. National Bureau of Standards and published by . This book was released on 1974 with total page 360 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Design of 3D Integrated Circuits and Systems written by Rohit Sharma and published by CRC Press. This book was released on 2018-09-03 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.
Download or read book Technical Abstract Bulletin written by and published by . This book was released on with total page 850 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Journal of Research of the National Bureau of Standards written by United States. National Bureau of Standards and published by . This book was released on 1974 with total page 728 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Compound Semiconductors 1998 written by H Sakaki and published by CRC Press. This book was released on 2021-02-01 with total page 931 pages. Available in PDF, EPUB and Kindle. Book excerpt: Compound Semiconductors 1998 explores research and development in key semiconductor materials and III-V compounds such as gallium arsenide, indium phosphide, gallium nitride, silicon germanium, and silicon carbide. It critically assesses progress in key technologies such as reliability assessment and reports on advances in the use of semiconductors in modern electronic and optoelectronic devices. Coverage in this volume reflects the increased interest and research funding in nitride-based materials; wide band-gap devices; mobile communications, including III-V-based transistors and photonic devices; crystal growth and characterization; and nanoscale phenomena, such as quantum wires, dots, and other low dimensional structures.
