Download or read book High Performance Computing written by Ponnuswamy Sadayappan and published by . This book was released on 2020 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 35th International Conference on High Performance Computing, ISC High Performance 2020, held in Frankfurt/Main, Germany, in June 2020.* The 27 revised full papers presented were carefully reviewed and selected from 87 submissions. The papers cover a broad range of topics such as architectures, networks & infrastructure; artificial intelligence and machine learning; data, storage & visualization; emerging technologies; HPC algorithms; HPC applications; performance modeling & measurement; programming models & systems software. *The conference was held virtually due to the COVID-19 pandemic. Chapters "Scalable Hierarchical Aggregation and Reduction Protocol (SHARP) Streaming-Aggregation Hardware Design and Evaluation", "Solving Acoustic Boundary Integral Equations Using High Performance Tile Low-Rank LU Factorization", "Scaling Genomics Data Processing with Memory-Driven Computing to Accelerate Computational Biology", "Footprint-Aware Power Capping for Hybrid Memory Based Systems", and "Pattern-Aware Staging for Hybrid Memory Systems" are available open access under a Creative Commons Attribution 4.0 International License via link.springer.com.
Download or read book Vertical 3D Memory Technologies written by Betty Prince and published by John Wiley & Sons. This book was released on 2014-08-13 with total page 466 pages. Available in PDF, EPUB and Kindle. Book excerpt: The large scale integration and planar scaling of individual system chips is reaching an expensive limit. If individual chips now, and later terrabyte memory blocks, memory macros, and processing cores, can be tightly linked in optimally designed and processed small footprint vertical stacks, then performance can be increased, power reduced and cost contained. This book reviews for the electronics industry engineer, professional and student the critical areas of development for 3D vertical memory chips including: gate-all-around and junction-less nanowire memories, stacked thin film and double gate memories, terrabit vertical channel and vertical gate stacked NAND flash, large scale stacking of Resistance RAM cross-point arrays, and 2.5D/3D stacking of memory and processor chips with through-silicon-via connections now and remote links later. Key features: Presents a review of the status and trends in 3-dimensional vertical memory chip technologies. Extensively reviews advanced vertical memory chip technology and development Explores technology process routes and 3D chip integration in a single reference
Download or read book Innovations in the Memory System written by Rajeev Balasubramonian and published by Springer Nature. This book was released on 2022-05-31 with total page 129 pages. Available in PDF, EPUB and Kindle. Book excerpt: The memory system has the potential to be a hub for future innovation. While conventional memory systems focused primarily on high density, other memory system metrics like energy, security, and reliability are grabbing modern research headlines. With processor performance stagnating, it is also time to consider new programming models that move some application computations into the memory system. This, in turn, will lead to feature-rich memory systems with new interfaces. The past decade has seen a number of memory system innovations that point to this future where the memory system will be much more than dense rows of unintelligent bits. This book takes a tour through recent and prominent research works, touching upon new DRAM chip designs and technologies, near data processing approaches, new memory channel architectures, techniques to tolerate the overheads of refresh and fault tolerance, security attacks and mitigations, and memory scheduling.
Download or read book High Performance Computing written by Ponnuswamy Sadayappan and published by Springer Nature. This book was released on 2020-06-15 with total page 564 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 35th International Conference on High Performance Computing, ISC High Performance 2020, held in Frankfurt/Main, Germany, in June 2020.* The 27 revised full papers presented were carefully reviewed and selected from 87 submissions. The papers cover a broad range of topics such as architectures, networks & infrastructure; artificial intelligence and machine learning; data, storage & visualization; emerging technologies; HPC algorithms; HPC applications; performance modeling & measurement; programming models & systems software. *The conference was held virtually due to the COVID-19 pandemic. Chapters "Scalable Hierarchical Aggregation and Reduction Protocol (SHARP) Streaming-Aggregation Hardware Design and Evaluation", "Solving Acoustic Boundary Integral Equations Using High Performance Tile Low-Rank LU Factorization", "Scaling Genomics Data Processing with Memory-Driven Computing to Accelerate Computational Biology", "Footprint-Aware Power Capping for Hybrid Memory Based Systems", and "Pattern-Aware Staging for Hybrid Memory Systems" are available open access under a Creative Commons Attribution 4.0 International License via link.springer.com.
Download or read book Semiconductor Memory Devices and Circuits written by Shimeng Yu and published by CRC Press. This book was released on 2022-04-19 with total page 214 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers semiconductor memory technologies from device bit-cell structures to memory array design with an emphasis on recent industry scaling trends and cutting-edge technologies. The first part of the book discusses the mainstream semiconductor memory technologies. The second part of the book discusses the emerging memory candidates that may have the potential to change the memory hierarchy, and surveys new applications of memory technologies for machine/deep learning applications. This book is intended for graduate students in electrical and computer engineering programs and researchers or industry professionals in semiconductors and microelectronics. Explains the design of basic memory bit-cells including 6-transistor SRAM, 1-transistor-1-capacitor DRAM, and floating gate/charge trap FLASH transistor Examines the design of the peripheral circuits including the sense amplifier and array-level organization for the memory array Examines industry trends of memory technologies such as FinFET based SRAM, High-Bandwidth-Memory (HBM), 3D NAND Flash, and 3D X-point array Discusses the prospects and challenges of emerging memory technologies such as PCM, RRAM, STT-MRAM/SOT-MRAM and FeRAM/FeFET Explores the new applications such as in-memory computing for AI hardware acceleration.
Download or read book Advances In 3d Integrated Circuits And Systems written by Hao Yu and published by World Scientific. This book was released on 2015-08-28 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt: 3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.
Download or read book 3D Integration in VLSI Circuits written by Katsuyuki Sakuma and published by CRC Press. This book was released on 2018-04-17 with total page 211 pages. Available in PDF, EPUB and Kindle. Book excerpt: Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.
Download or read book Architecture of Computing Systems ARCS 2017 written by Jens Knoop and published by Springer. This book was released on 2017-03-02 with total page 267 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the proceedings of the 30th International Conference on Architecture of Computing Systems, ARCS 2017, held in Vienna, Austria, in April 2017. The 19 full papers presented in this volume were carefully reviewed and selected from 42 submissions. They were organized in topical sections entitled: resilience; accelerators; performance; memory systems; parallelism and many-core; scheduling; power/energy.
Download or read book Architecture of Computing Systems written by Georgios Goumas and published by Springer Nature. This book was released on 2023-09-26 with total page 333 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the proceedings of the 36th International Conference on Architecture of Computing Systems, ARCS 2023, which took place in Athens, Greece, in June 2023. The 18 full papers in this volume were carefully reviewed and selected from 35 submissions. ARCS provides a platform covering newly emerging and cross-cutting topics, such as autonomous and ubiquitous systems, reconfigurable computing and acceleration, neural networks and artificial intelligence. The selected papers cover a variety of topics from the ARCS core domains, including energy efficiency, applied machine learning, hardware and software system security, reliable and fault-tolerant systems and organic computing. Back to top
Download or read book Intelligent Internet of Things written by Farshad Firouzi and published by Springer Nature. This book was released on 2020-01-21 with total page 647 pages. Available in PDF, EPUB and Kindle. Book excerpt: This holistic book is an invaluable reference for addressing various practical challenges in architecting and engineering Intelligent IoT and eHealth solutions for industry practitioners, academic and researchers, as well as for engineers involved in product development. The first part provides a comprehensive guide to fundamentals, applications, challenges, technical and economic benefits, and promises of the Internet of Things using examples of real-world applications. It also addresses all important aspects of designing and engineering cutting-edge IoT solutions using a cross-layer approach from device to fog, and cloud covering standards, protocols, design principles, reference architectures, as well as all the underlying technologies, pillars, and components such as embedded systems, network, cloud computing, data storage, data processing, big data analytics, machine learning, distributed ledger technologies, and security. In addition, it discusses the effects of Intelligent IoT, which are reflected in new business models and digital transformation. The second part provides an insightful guide to the design and deployment of IoT solutions for smart healthcare as one of the most important applications of IoT. Therefore, the second part targets smart healthcare-wearable sensors, body area sensors, advanced pervasive healthcare systems, and big data analytics that are aimed at providing connected health interventions to individuals for healthier lifestyles.
Download or read book More than Moore Technologies for Next Generation Computer Design written by Rasit O. Topaloglu and published by Springer. This book was released on 2015-02-09 with total page 225 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as “More than Moore” (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to “Moore's Law”. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.
Download or read book Three Dimensional Integration of Semiconductors written by Kazuo Kondo and published by Springer. This book was released on 2015-12-09 with total page 423 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.
Download or read book VLSI Design and Test for Systems Dependability written by Shojiro Asai and published by Springer. This book was released on 2018-07-20 with total page 792 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses the new roles that the VLSI (very-large-scale integration of semiconductor circuits) is taking for the safe, secure, and dependable design and operation of electronic systems. The book consists of three parts. Part I, as a general introduction to this vital topic, describes how electronic systems are designed and tested with particular emphasis on dependability engineering, where the simultaneous assessment of the detrimental outcome of failures and cost of their containment is made. This section also describes the related research project “Dependable VLSI Systems,” in which the editor and authors of the book were involved for 8 years. Part II addresses various threats to the dependability of VLSIs as key systems components, including time-dependent degradations, variations in device characteristics, ionizing radiation, electromagnetic interference, design errors, and tampering, with discussion of technologies to counter those threats. Part III elaborates on the design and test technologies for dependability in such applications as control of robots and vehicles, data processing, and storage in a cloud environment and heterogeneous wireless telecommunications. This book is intended to be used as a reference for engineers who work on the design and testing of VLSI systems with particular attention to dependability. It can be used as a textbook in graduate courses as well. Readers interested in dependable systems from social and industrial–economic perspectives will also benefit from the discussions in this book.
Download or read book Advances in Computer Communication and Computational Sciences written by Sanjiv K. Bhatia and published by Springer. This book was released on 2018-08-18 with total page 548 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book includes the insights that reflect ‘Advances in Computer and Computational Sciences’ from upcoming researchers and leading academicians across the globe. It contains the high-quality peer-reviewed papers of ‘International Conference on Computer, Communication and Computational Sciences (IC4S 2017), held during 11–12 October, 2017 in Thailand. These papers are arranged in the form of chapters. The content of this book is divided into two volumes that cover variety of topics such as intelligent hardware and software design, advanced communications, intelligent computing techniques, intelligent image processing, and web and informatics. This book helps the perspective readers’ from computer industry and academia to derive the advances of next generation computer and communication technology and shape them into real life applications.
Download or read book Computing Handbook written by Teofilo Gonzalez and published by CRC Press. This book was released on 2014-05-07 with total page 2326 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first volume of this popular handbook mirrors the modern taxonomy of computer science and software engineering as described by the Association for Computing Machinery (ACM) and the IEEE Computer Society (IEEE-CS). Written by established leading experts and influential young researchers, it examines the elements involved in designing and implementing software, new areas in which computers are being used, and ways to solve computing problems. The book also explores our current understanding of software engineering and its effect on the practice of software development and the education of software professionals.
Download or read book Algorithms and Architectures for Parallel Processing written by Guojun Wang and published by Springer. This book was released on 2015-11-16 with total page 828 pages. Available in PDF, EPUB and Kindle. Book excerpt: This four volume set LNCS 9528, 9529, 9530 and 9531 constitutes the refereed proceedings of the 15th International Conference on Algorithms and Architectures for Parallel Processing, ICA3PP 2015, held in Zhangjiajie, China, in November 2015. The 219 revised full papers presented together with 77 workshop papers in these four volumes were carefully reviewed and selected from 807 submissions (602 full papers and 205 workshop papers). The first volume comprises the following topics: parallel and distributed architectures; distributed and network-based computing and internet of things and cyber-physical-social computing. The second volume comprises topics such as big data and its applications and parallel and distributed algorithms. The topics of the third volume are: applications of parallel and distributed computing and service dependability and security in distributed and parallel systems. The covered topics of the fourth volume are: software systems and programming models and performance modeling and evaluation.
Download or read book Emerging Computing From Devices to Systems written by Mohamed M. Sabry Aly and published by Springer Nature. This book was released on 2022-07-11 with total page 446 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book covers a range of topics dealing with emerging computing technologies which are being developed in response to challenges faced due to scaling CMOS technologies. It provides a sneak peek into the capabilities unleashed by these technologies across the complete system stack, with contributions by experts discussing device technology, circuit, architecture and design automation flows. Presenting a gradual progression of the individual sub-domains and the open research and adoption challenges, this book will be of interest to industry and academic researchers, technocrats and policymakers. Chapters "Innovative Memory Architectures Using Functionality Enhanced Devices" and "Intelligent Edge Biomedical Sensors in the Internet of Things (IoT) Era" are available open access under a Creative Commons Attribution 4.0 International License via link.springer.com.
