Download or read book Heterogeneous Integrations written by John H. Lau and published by Springer. This book was released on 2019-04-03 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Download or read book Chiplet Design and Heterogeneous Integration Packaging written by John H. Lau and published by Springer Nature. This book was released on 2023-03-27 with total page 542 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Download or read book Heterogeneous Optoelectronics Integration written by Elias Towe and published by SPIE Press. This book was released on 2000 with total page 304 pages. Available in PDF, EPUB and Kindle. Book excerpt: Numerous efforts are directed at investigating the use of optics at short distances--for example, at the chip-to-chip and board-to-board levels of the interconnection hierarchy. This book provides an overview of the state of the art in heterogeneous integration of electronics, optoelectronics, and micro-optics for short-distance optical interconnections.
Download or read book Cooperation and Integration in 6G Heterogeneous Networks written by Jun Du and published by Springer Nature. This book was released on 2022-12-08 with total page 461 pages. Available in PDF, EPUB and Kindle. Book excerpt: To provide ubiquitous and various services, 6G networks tend to be more comprehensive and multidimensional by integrating current terrestrial networks with space-/air-based information networks and marine information networks; then, heterogeneous network resources, as well as different types of users and data, will be also integrated. Driven by the exponentially growing demands of multimedia data traffic and computation-heavy applications, 6G heterogenous networks are expected to achieve a high QoS with ultra-reliability and low latency. In response, resource allocation has been considered an important factor that can improve 6G performance directly by configuring heterogeneous communication, computing and caching resources effectively and efficiently. The book addresses a range of technical issues in cooperative resource allocation and information sharing for the future 6G heterogenous networks, from the terrestrial ultra-dense networks and space-based networks to the integrated satellite-terrestrial networks, as well as introducing the effects of cooperative behavior among mobile users on increasing capacity, trustworthiness and privacy. For the cooperative transmission in heterogeneous networks, the authors commence with the traffic offloading problems in terrestrial ultra-dense networks, and the cognitive and cooperative mechanisms in heterogeneous space-based networks, the stability analysis of which is also provided. Moreover, for the cooperative transmission in integrated satellite-terrestrial networks, the authors present a pair of dynamic and adaptive resource allocation strategies for traffic offloading, cooperative beamforming and traffic prediction based cooperative transmission. Later, the authors discuss the cooperative computation and caching resource allocation in heterogeneous networks, with the highlight of providing our current studies on the game theory, auction theory and deep reinforcement learning based approaches. Meanwhile, the authors introduce the cooperative resource and information sharing among users, in which capacity oriented-, trustworthiness oriented-, and privacy oriented cooperative mechanisms are investigated. Finally, the conclusion is drawn.
Download or read book Semantic Integration of Heterogeneous Software Specifications written by Martin Große-Rhode and published by Springer Science & Business Media. This book was released on 2003-12-09 with total page 348 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first book to integrate various model-based software specification approaches. The integration approach is based on a common semantic domain of abstract systems, their composition and development. Its applicability is shown through semantic interpretations and compositional comparisons of different specification approaches. These range from formal specification techniques like process calculi, Petri nets and rule-based formalisms to semiformal software modeling languages like those in the UML family.
Download or read book Integration of Heterogeneous Manufacturing Machinery in Cells and Systems written by Wasim Ahmed Khan and published by CRC Press. This book was released on 2024-06-13 with total page 271 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the advent of the 4th Industrial Revolution, the implementation of the nine pillars of technology has taken a firm root, especially after the post-COVID pandemic era. The integration of cyber-physical systems is one of the most important pillars that has led to the maximization of productivity, which also leads to the maximization of profits from a manufacturing system. This book discusses manufacturing enterprises, then looks at the theoretical and practical aspects of integrating these manufacturing systems using legacy and modern communication methodologies and relates them to the current level of technology readiness. Integration of Heterogenous Manufacturing Machinery in Cells and Systems: Policies and Practices focuses on the methods covering the use of Artificial Intelligence, Augmented Reality, the Internet of Things, and cellular and physical industrial communication. It describes the nine pillars of technology which include the Internet of Things, Cloud Computing, Autonomous, and Robotics Systems, Big Data Analytics, Augmented Reality, Cyber Security, Simulation, System integration, and Additive Manufacturing. The book highlights the methods used that cover mechanical, electrical, electronics, and computer software aspects of developing manufacturing machinery and discusses computer-aided design (CAD), production planning, and manufacturing, as well as production databases with basics and semantics. This book is an ideal reference for undergraduate, graduate, and postgraduate students of industrial, manufacturing, mechanical, and mechatronics engineering, along with professionals and general readers.
Download or read book 3D Interconnect Architectures for Heterogeneous Technologies written by Lennart Bamberg and published by Springer Nature. This book was released on 2022-06-27 with total page 403 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.
Download or read book Wafer Level 3 D ICs Process Technology written by Chuan Seng Tan and published by Springer Science & Business Media. This book was released on 2009-06-29 with total page 365 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Download or read book Management of Heterogeneous and Autonomous Database Systems written by Ahmed K. Elmagarmid and published by Morgan Kaufmann. This book was released on 1999 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt: An Overview of Multidatabase Systems: Past and Present / Athman Bouguettaya, Boualem Benatallah, Ahmed Elmagarmid / - Local Autonomy and Its Effects on Multidatabase Systems / Ahmed Elmagarmid, Weimin Du, Rafi Ahmed / - Semantic Similarities Between Objects in Multiple Databases / Vipul Kashyap, Amit Sheth / - Resolution of Representational Diversity in Multidatabase Systems / Joachim Hammer, Dennis McLeod / - Schema Integration: Past, Present, and Future / Sudha Ram, V. Ramesh / - Schema and Language Translation / Bogdan Czejdo, Le Gruenwald / - Multidatabase Languages / Paolo Missier, Marek Rusinkiewicz, W. Jin / - Interdependent Database Systems / George Karabatis, Marek Rusinkiewicz, Amit Sheth / - Correctness Criteria and Concurrency Control / Panos K. Chrysanthis, Krithi Ramamritham / - Transaction Management in Multidatabase Systems: Current Technologies and Formalisms / Ken Barker, Ahmed Elmagarmid / - Transaction-Based Recovery / Jari Veijalainen. ...
Download or read book Ecosystem Function in Heterogeneous Landscapes written by Gary M. Lovett and published by Springer Science & Business Media. This book was released on 2005-12-15 with total page 528 pages. Available in PDF, EPUB and Kindle. Book excerpt: This groundbreaking work connects the knowledge of system function developed in ecosystem ecology with landscape ecology's knowledge of spatial structure. The book elucidates the challenges faced by ecosystem scientists working in spatially heterogeneous systems, relevant conceptual approaches used in other disciplines and in different ecosystem types, and the importance of spatial heterogeneity in conservation resource management.
Download or read book Handbook of 3D Integration Volume 4 written by Paul D. Franzon and published by John Wiley & Sons. This book was released on 2019-05-06 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt: This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Download or read book Heterogeneous Information Exchange and Organizational Hubs written by H. Bestougeff and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 253 pages. Available in PDF, EPUB and Kindle. Book excerpt: Helene Bestougeff, Universite de Marne Ia Vallee, France Jacques-Emile Dubois, Universite Paris VII-Denis Diderot, France Bhavani Thuraisingham, MITRE Corporation, USA The last fifty years promoted the conceptual trio: Knowledge, Information and Data (KID) to the center of our present scientific technological and human activities. The intrusion of the Internet drastically modified the historical cycles of communication between authors, providers and users. Today, information is often the result of the interaction between data and the knowledge based on their comprehension, interpretation and prediction. Nowadays important goals involve the exchange of heterogeneous information, as many real life and even specific scientific and technological problems are all interdisciplinary by nature. For a specific project, this signifies extracting information, data and even knowledge from many different sources that must be addressed by interoperable programs. Another important challenge is that of corporations collaborating with each other and forming coalitions and partnerships. One development towards achieving this challenge is organizational hubs. This concept is new and still evolving. Much like an airport hub serving air traffic needs, organizational hubs are central platforms that provide information and collaboration specific to a group of users' needs. Now companies are creating hubs particular to certain types of industries. The users of hubs are seen as communities for which all related information is directly available without further searching efforts and often with value-added services.
Download or read book Foundations of Heterogeneous Integration written by Farhang Yazdani and published by . This book was released on 2018 with total page 177 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author's extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level. Provides knowledge and skills necessary to design wirebond, flip chip and system in package (SIP) products; Provides practical solutions for 2.5D/3D memory and logic integration, explaining a complex, multidisciplinary topic in straightforward terms; Demonstrates a unique co-design methodology for optimizing cross domain heterogeneous integration, including examples, pathfinding, packaging strategy, interposer structure, etc.; Includes real, industry-based examples to give readers hands-on practical design experience.
Download or read book Die stacking Architecture written by Yuan Xie and published by Morgan & Claypool Publishers. This book was released on 2015-06-01 with total page 129 pages. Available in PDF, EPUB and Kindle. Book excerpt: The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.
Download or read book Advanced Driver Assistance Systems and Autonomous Vehicles written by Yan Li and published by Springer Nature. This book was released on 2022-10-28 with total page 628 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive reference for both academia and industry on the fundamentals, technology details, and applications of Advanced Driver-Assistance Systems (ADAS) and autonomous driving, an emerging and rapidly growing area. The book written by experts covers the most recent research results and industry progress in the following areas: ADAS system design and test methodologies, advanced materials, modern automotive technologies, artificial intelligence, reliability concerns, and failure analysis in ADAS. Numerous images, tables, and didactic schematics are included throughout. This essential book equips readers with an in-depth understanding of all aspects of ADAS, providing insights into key areas for future research and development. • Provides comprehensive coverage of the state-of-the-art in ADAS • Covers advanced materials, deep learning, quality and reliability concerns, and fault isolation and failure analysis • Discusses ADAS system design and test methodologies, novel automotive technologies • Features contributions from both academic and industry authors, for a complete view of this important technology
Download or read book Pre organic Evolution and the Biblical Idea of God written by Charles Chapman and published by . This book was released on 1891 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Handbook of 3D Integration Volume 3 written by Philip Garrou and published by John Wiley & Sons. This book was released on 2014-07-21 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt: Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.
