Download or read book Heat Transfer in Miniaturized Electronic Equipment written by Cornell Aeronautical Laboratory and published by . This book was released on 1955 with total page 102 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Heat Transfer in Miniaturized Electonic written by United States. Ships Bureau and published by . This book was released on 1956 with total page 98 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Heat Transfer in Miniaturized Electronic Equipment written by Cornell Aeronautical Laboratory and published by . This book was released on 1955 with total page 100 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Heat Transfer in Miniaturized Electronic Equipment written by Cornell Aeronautical Laboratory and published by . This book was released on 1955 with total page 85 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Heat Transfer in Miniaturized Electronic Equipment written by and published by . This book was released on 1955 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Miniaturization unclassified Title written by Defense Documentation Center (U.S.) and published by . This book was released on 1962 with total page 180 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Heat Transfer written by Younes Shabany and published by . This book was released on 2010 with total page 491 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Thermal Management of Microelectronic Equipment written by Lian-Tuu Yeh and published by American Society of Mechanical Engineers. This book was released on 2002 with total page 454 pages. Available in PDF, EPUB and Kindle. Book excerpt: With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.

Download or read book Heat Transfer and Fluid Flow written by James M. Jacobs and published by . This book was released on 1958 with total page 444 pages. Available in PDF, EPUB and Kindle. Book excerpt: A total of 2519 annotated references to the unclassified report literature is presented. Subjects covered under heat transfer and fluid flow include radioinduced heating; boiling; boiler, evaporators, pump, and heat exchanger design; hydrodynamics; coolants and their properties; thermal and flow instrumentation; high temperature materials; thermal properties of materials; and thermal insulation. Subjects covered less completely include thermodynamics; aerodynamics; high temperature corrosion; corrosion specific to heat transfer systems; erosion; mass transfer; corrosion film formation and effects; coolant processing and radioactivity; radiation effects of heat transfer materials; and pertinent data of thermonuclear processes. Subject, report number availability, and author indexes are given.

Download or read book Thermal Management Handbook For Electronic Assemblies written by Jerry E. Sergent and published by McGraw Hill Professional. This book was released on 1998 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt: Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The "hands-on" guide to thermal management! In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.

Download or read book Microscale Heat Transfer Fundamentals and Applications written by S. Kakaç and published by Springer Science & Business Media. This book was released on 2006-05-20 with total page 517 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume contains an archival record of the NATO Advanced Institute on Microscale Heat Transfer – Fundamental and Applications in Biological and Microelectromechanical Systems held in Çesme – Izmir, Turkey, July 18–30, 2004. The ASIs are intended to be high-level teaching activity in scientific and technical areas of current concern. In this volume, the reader may find interesting chapters and various Microscale Heat Transfer Fundamental and Applications. The growing use of electronics, in both military and civilian applications has led to the widespread recognition for need of thermal packaging and management. The use of higher densities and frequencies in microelectronic circuits for computers are increasing day by day. They require effective cooling due to heat generated that is to be dissipated from a relatively low surface area. Hence, the development of efficient cooling techniques for integrated circuit chips is one of the important contemporary applications of Microscale Heat Transfer which has received much attention for cooling of high power electronics and applications in biomechanical and aerospace industries. Microelectromechanical systems are subject of increasing active research in a widening field of discipline. These topics and others are the main themeof this Institute.

Download or read book Nuclear Science Abstracts written by and published by . This book was released on 1967 with total page 990 pages. Available in PDF, EPUB and Kindle. Book excerpt: NSA is a comprehensive collection of international nuclear science and technology literature for the period 1948 through 1976, pre-dating the prestigious INIS database, which began in 1970. NSA existed as a printed product (Volumes 1-33) initially, created by DOE's predecessor, the U.S. Atomic Energy Commission (AEC). NSA includes citations to scientific and technical reports from the AEC, the U.S. Energy Research and Development Administration and its contractors, plus other agencies and international organizations, universities, and industrial and research organizations. References to books, conference proceedings, papers, patents, dissertations, engineering drawings, and journal articles from worldwide sources are also included. Abstracts and full text are provided if available.

Download or read book Heat Transfer in Miniaturized Electonic written by United States. Ships Bureau and published by . This book was released on 1956 with total page 85 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book TID written by and published by . This book was released on 1958 with total page 446 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Guide Manual of Cooling Methods for Electronic Equipment written by United States. Navy Department. Bureau of Ships and published by . This book was released on 1956 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Guide Manual of Cooling Methods for Electronic Equipment written by Cornell Aeronautical Laboratory and published by . This book was released on 1956 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Heat Transfer written by Younes Shabany and published by CRC Press. This book was released on 2009-12-17 with total page 526 pages. Available in PDF, EPUB and Kindle. Book excerpt: The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use