Download or read book Advances in Heat Transfer Enhancement written by Sujoy Kumar Saha and published by Springer. This book was released on 2016-04-23 with total page 128 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Brief addresses the phenomena of heat transfer enhancement. A companion edition in the SpringerBrief Subseries on Thermal Engineering and Applied Science to three other monographs including “Critical Heat Flux in Flow Boiling in Microchannels,” this volume is idea for professionals, researchers, and graduate students concerned with electronic cooling.
Download or read book Air Cooling Technology for Electronic Equipment written by Sung Jin Kim and published by CRC Press. This book was released on 2020-07-24 with total page 260 pages. Available in PDF, EPUB and Kindle. Book excerpt: Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics. Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling? The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.
Download or read book Heat Transfer Enhancement in Electronics Cooling written by American Society of Mechanical Engineers. Winter Annual Meeting and published by American Society of Mechanical Engineers. This book was released on 1991 with total page 80 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Heat Transfer Enhancement of Heat Exchangers written by Sadik Kakaç and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 670 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heat transfer enhancement in single-phase and two-phase flow heat exchangers in important in such industrial applications as power generating plant, process and chemical industry, heating, ventilation, air conditioning and refrigeration systems, and the cooling of electronic equipment. Energy savings are of primary importance in the design of such systems, leading to more efficient, environmentally friendly devices. This book provides invaluable information for such purposes.
Download or read book Electronics Cooling written by S. M. Sohel Murshed and published by BoD – Books on Demand. This book was released on 2016-06-15 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.
Download or read book Heat Transfer Enhancement of Small Scale Heat Sinks for Electronics Cooling written by Suabsakul Gururatana and published by . This book was released on 2011 with total page 254 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Cooling of Electronic Systems written by Sadik Kakaç and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 953 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
Download or read book Cooling Of Microelectronic And Nanoelectronic Equipment Advances And Emerging Research written by Madhusudan Iyengar and published by World Scientific. This book was released on 2014-08-25 with total page 471 pages. Available in PDF, EPUB and Kindle. Book excerpt: To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.
Download or read book Convective Heat Transfer in Porous Media written by Yasser Mahmoudi and published by CRC Press. This book was released on 2019-11-06 with total page 366 pages. Available in PDF, EPUB and Kindle. Book excerpt: Focusing on heat transfer in porous media, this book covers recent advances in nano and macro’ scales. Apart from introducing heat flux bifurcation and splitting within porous media, it highlights two-phase flow, nanofluids, wicking, and convection in bi-disperse porous media. New methods in modeling heat and transport in porous media, such as pore-scale analysis and Lattice–Boltzmann methods, are introduced. The book covers related engineering applications, such as enhanced geothermal systems, porous burners, solar systems, transpiration cooling in aerospace, heat transfer enhancement and electronic cooling, drying and soil evaporation, foam heat exchangers, and polymer-electrolyte fuel cells.
Download or read book Heat Transfer Enhancement in Electronic Cooling written by Sushil H. Bhavnani and published by . This book was released on 1991 with total page 59 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Thermal Management of Microelectronic Equipment written by Lian-Tuu Yeh and published by American Society of Mechanical Engineers. This book was released on 2002 with total page 454 pages. Available in PDF, EPUB and Kindle. Book excerpt: With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.
Download or read book Process Enhanced and Multiphase Heat Transfer written by A. E. Bergles and published by Begel House. This book was released on 1996-01-01 with total page 520 pages. Available in PDF, EPUB and Kindle. Book excerpt: The papers included in this volume span the areas of heat transfer where Professor Bergles has made seminal contributions--heat transfer enhancement, pool and forced convective boiling, cooling of electronic and microelectronic devices, single phase forced convection, and process heat transfer. Professor Bergles has been one of the foremost articulators of the need for careful experimentation, appropriate numerical computing, and frequent interactions among various constituencies to achieve progress in the field of heat transfer.
Download or read book Heat Transfer with Applications written by Kirk D. Hagen and published by . This book was released on 1999 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: "This guide on the basics of heat transfer focuses on applications and problem-solving rather than theory and mathematics, demonstrating the critical connection between conceptual principles and their actual application in real-world thermal systems. Adopts a direct, "get to the bottom line" approach that avoids lengthy, complex mathematical excursions, and promotes understanding with topically arranged applications problems and detailed examples at the end of each chapter to help users relate heat transfer theory to its practical, everyday usage. Presents numerous computer applications using spreadsheets and other software. An extensive appendix includes comprehensive databases of thermal properties and related data; facilitates computer solution of convection problems, and; provides polynomial curve fits for the main thermal properties of liquids and gases. For professionals in mechanical and industrial technology." -- Publisher.
Download or read book Advanced Liquid Metal Cooling For Chip Device And System written by Jing Liu and published by World Scientific. This book was released on 2022-04-08 with total page 961 pages. Available in PDF, EPUB and Kindle. Book excerpt: This compendium summarizes the core principles and practical applications of a brand-new advanced chip cooling category — liquid metal cooling. It illustrates the science and art of room temperature liquid metal enabled cooling for chip, device and system. The concise volume features unique scientific and practical merits, and clarified intriguing liquid metal coolant or medium behaviors in making new generation powerful cooling system.With both uniquely important fundamental and practical values, this useful reference text benefits researchers to set up their foundation and then find new ways of making advanced cooling system to fulfil the increasingly urgent needs in modern highly integrated chip industry.
Download or read book Advanced Computational Methods and Experiments in Heat Transfer XII written by B. Sundén and published by WIT Press. This book was released on 2012-06-27 with total page 377 pages. Available in PDF, EPUB and Kindle. Book excerpt: Containing papers presented at the twelfth in a series of successful international conferences on Advanced Computational Methods and Experiments in Heat Transfer, this book covers the latest developments in this important field. Heat Transfer plays a major role in emerging application fields such as sustainable development and the reduction of greenhouse gases, as well as micro- and nano-scale structures and bio-engineering. Typical applications include heat exchangers, gas turbine cooling, turbulent combustion and fires, electronics cooling, melting and solidification. The nature of heat transfer problems is complex, involving many different simultaneously occurring mechanisms (e.g., heat conduction, convection, turbulence, thermal radiation. phase change). Their complexity makes it imperative that we develop reliable and accurate computational methods to replace or complement expensive and time-consuming experimental trial and error work. Tremendous advances have been achieved during recent years due to improved numerical solutions of non-linear partial differential equations and more powerful computers capable of performing efficient and rapid calculations. Nevertheless, to further progress, it will also be necessary to develop theoretical and predictive computational procedures--both basic and innovative--and in applied research. Accurate experimental investigations are needed to validate the numerical calculations. The book includes such topics as: Heat Transfer in Energy Producing Devices; Heat Transfer Enhancement; Heat Transfer Problems; Natural and Forced Convection and Radiation; Multiphase Flow Heat Transfer; Modelling and Experiments.
Download or read book Advanced Flip Chip Packaging written by Ho-Ming Tong and published by Springer Science & Business Media. This book was released on 2013-03-20 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Download or read book Liquid Cooling of Electronic Devices by Single Phase Convection written by Frank P. Incropera and published by Wiley-Interscience. This book was released on 1999-05-31 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Liquid Cooling of Electronic Devices by Single-Phase Convection offers the first comprehensive and in-depth coverage of liquid convection as it applies to state-of-the-art thermal management systems. In this book, Dr. Incropera culls ten years of research results, clarifies the physical mechanisms associated with single-phase convection in the context of electronic cooling, and provides working engineers with a solid foundation for the design and development of rational liquid cooling systems. For those involved in designing these products - mechanical and electrical engineers, electronic packaging engineers, technical staff, and others - this book provides an invaluable road map to meet the challenge.
