Download or read book Force Sensors for Microelectronic Packaging Applications written by Jürg Schwizer and published by Springer Science & Business Media. This book was released on 2005-12-11 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.
Download or read book Thermal Transport for Applications in Micro Nanomachining written by Basil T. Wong and published by Springer Science & Business Media. This book was released on 2008-07-19 with total page 243 pages. Available in PDF, EPUB and Kindle. Book excerpt: Beginning with an overview of nanomachining, this monograph introduces the relevant concepts from solid-state physics, thermodynamics, and lattice structures. It then covers modeling of thermal transport at the nanoscale and details simulations of different processes relevant to nanomachining. The final chapter summarizes the important points and discusses directions for future work to improve the modeling of nanomachining.
Download or read book Encyclopedia of Packaging Materials Processes and Mechanics written by Avram Bar-Cohen and published by World Scientific. This book was released on 2019 with total page 1079 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories. The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications"--Publisher's website
Download or read book Microjoining and Nanojoining written by Y N Zhou and published by Elsevier. This book was released on 2008-03-27 with total page 835 pages. Available in PDF, EPUB and Kindle. Book excerpt: Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products.Part one reviews the basics of microjoining, including solid-state bonding and fusion microwelding. Part two covers microjoining and nanojoining processes, such as bonding mechanisms and metallurgy, process development and optimization, thermal stresses and distortion, positioning and fixturing, sensing, and numerical modelling. Part three discusses microjoining of materials such as plastics, ceramics, metals and advanced materials such as shape memory alloys and nanomaterials. The book also discusses applications of microjoining such as joining superconductors, the manufacture of medical devices and the sealing of solid oxide fuel cells.This book provides a comprehensive overview of the fundamental aspects of microjoining processes and techniques. It is a valuable reference for production engineers, designers and researchers using or studying microjoining technologies in such industries as microelectronics and biomedical engineering. - Reviews the basics of nanojoining including solid-state bonding and fusion microwelding - Covers microjoining and nanojoining processes such as bonding mechanisms and metallurgy, sensing and numerical modelling - Examines applications of microjoining such as the manufacturing of medical devices, and the sealing of solid oxide fuel cells
Download or read book Capillary Forces in Microassembly written by Pierre Lambert and published by Springer Science & Business Media. This book was released on 2007-08-29 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: Capillary Forces in Microassembly discusses the use of capillary forces as a gripping principle in microscale assembly. Clearly written and well-organized, this text brings together physical concepts at the microscale with practical applications in micromanipulation. Throughout this work, the reader will find a review of the existing gripping principles, elements to model capillary forces as well as descriptions of the simulation and experimental test bench developed to study the design parameters. Using well-known concepts from surface science (such as surface tension, capillary effects, wettability, and contact angles) as inputs to mechanical models, the amount of effort required to handle micro-components is then predicted. Researchers and engineers involved in micromanipulation and precision assembly will find this a highly useful reference for microassembly system design and analysis.
Download or read book CCD Image Sensors in Deep Ultraviolet written by Flora Li and published by Springer Science & Business Media. This book was released on 2006-01-05 with total page 231 pages. Available in PDF, EPUB and Kindle. Book excerpt: As the deep-ultraviolet (DUV) laser technology continues to mature, an increasing number of industrial and manufacturing applications are emerging. For example, the new generation of semiconductor inspection systems is being pushed to image at increasingly shorter DUV wavelengths to facilitate inspection of deep sub-micron features in integrated circuits. DUV-sensitive charge-coupled device (CCD) cameras are in demand for these applications. Although CCD cameras that are responsive at DUV wavelengths are now available, their long-term stability is still a major concern. This book describes the degradation mechanisms and long-term performance of CCDs in the DUV, along with new results of device performance at these wavelengths.
Download or read book CMOS Hotplate Chemical Microsensors written by Markus Graf and published by Springer Science & Business Media. This book was released on 2007-04-19 with total page 131 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first comprehensive text on microhotplate-based chemical sensor systems in CMOS-technology covers all aspects of successful sensor prototyping: theoretical considerations for modelling, controller- and system design, simulation of circuits and microsensors, design considerations, microfabrication, packaging and testing. A whole family of metal-oxide based microsensor systems with increasing complexity is presented, including fully integrated sensor arrays. This represents one of the first examples of integrated nanomaterials, microtechnology and embedded circuitry.
Download or read book Piezoelectric Multilayer Beam Bending Actuators written by Rüdiger G. Ballas and published by Springer Science & Business Media. This book was released on 2007-03-06 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes the application of piezoelectric materials, particularly piezoceramics, in the wide field of actuators and sensors. It gives a step-by-step introduction to the structure and mechanics of piezoelectric beam bending actuators in multilayer technology, which are of increasing importance for industrial applications. The book presents the suitability of the developed theoretical aspects in a memorable way.
Download or read book Fast Simulation of Electro Thermal MEMS written by Tamara Bechtold and published by Springer Science & Business Media. This book was released on 2006-11-01 with total page 185 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides the reader with a complete methodology and software environment for creating efficient dynamic compact models for electro-thermal MEMS devices. It supplies the basic knowledge and understanding for using model order reduction at the engineering level. This tutorial is written for MEMS engineers and is enriched with many case studies which equip readers with the know-how to facilitate the simulation of a specific problem.
Download or read book Integrated Chemical Microsensor Systems in CMOS Technology written by Andreas Hierlemann and published by Springer Science & Business Media. This book was released on 2005-08-29 with total page 236 pages. Available in PDF, EPUB and Kindle. Book excerpt: Beginning with a comprehensive survey of existing semiconductor-based chemical microsensors and microsystems, this book proceeds to describe in detail CMOS technology-based chemical microsensor systems. The benefits of using CMOS technology for developing chemical microsensor systems and, in particular, monolithically integrated sensor systems comprising transducers and associated circuitry are laid out. Several successful realizations of such microsensor systems are presented. First, the fundamentals of the chemical sensing process itself will be elucidated, followed by a short description of microfabrication techniques and the CMOS substrate. Thereafter, a comprehensive overview of semiconductor-based and CMOS-based transducer structures and their applications is given. It is shown that CMOS-technology can be successfully used as platform technology to integrate microtransducers with the necessary driving and signal conditioning circuitry, and, in a next step, to develop monolithic multisensor arrays and fully developed microsystems with on-chip sensor control and standard interfaces. The book concludes with a brief outlook to future developments, such as interfacing cells with CMOS microelectronics.
Download or read book Proceedings of the Workshop on Microtechnologies and Applications to Space Systems written by and published by . This book was released on 1993 with total page 382 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Micromechanical Photonics written by Hiroo Ukita and published by Springer Science & Business Media. This book was released on 2007-04-14 with total page 259 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the most comprehensive book on the basics, realization and applications of micromechanical photonics. Its purpose is to give the engineering student and the practical engineer a systematic introduction to optical MEMS (Micro electro mechanical systems) and micromechanical photonics. It does this not only through theoretical and experimental results, but also by describing various products and their fields of application.
Download or read book Space Microelectronics written by and published by . This book was released on 1988 with total page 48 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of the Second International Symposium on Microstructures and Microfabricated Systems written by Denise Denton and published by The Electrochemical Society. This book was released on 1995 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book CMOS MEMS written by Henry Baltes and published by John Wiley & Sons. This book was released on 2013-03-26 with total page 610 pages. Available in PDF, EPUB and Kindle. Book excerpt: This edition of 'CMOS-MEMS' was originally published in the successful series 'Advanced Micro & Nanosystems'. Here, the combination of the globally established, billion dollar chip mass fabrication technology CMOS with the fascinating and commercially promising new world of MEMS is covered from all angles. The book introduces readers to this fi eld and takes them from fabrication technologies and material charaterization aspects to the actual applications of CMOS-MEMS - a wide range of miniaturized physical, chemical and biological sensors and RF systems. Vital knowledge on circuit and system integration issues concludes this in-depth treatise, illustrating the advantages of combining CMOS and MEMS in the first place, rather than having a hybrid solution.
Download or read book Modeling and Simulation for Microelectronic Packaging Assembly written by Shen Liu and published by John Wiley & Sons. This book was released on 2011-05-17 with total page 586 pages. Available in PDF, EPUB and Kindle. Book excerpt: Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Download or read book Handbook of Silicon Based MEMS Materials and Technologies written by Markku Tilli and published by Elsevier. This book was released on 2020-04-17 with total page 1028 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies, and manufacturing with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, modeling, manufacturing, processing, system integration, measurement, and materials characterization techniques of MEMS structures. The third edition of this book provides an important up-to-date overview of the current and emerging technologies in MEMS making it a key reference for MEMS professionals, engineers, and researchers alike, and at the same time an essential education material for undergraduate and graduate students. - Provides comprehensive overview of leading-edge MEMS manufacturing technologies through the supply chain from silicon ingot growth to device fabrication and integration with sensor/actuator controlling circuits - Explains the properties, manufacturing, processing, measuring and modeling methods of MEMS structures - Reviews the current and future options for hermetic encapsulation and introduces how to utilize wafer level packaging and 3D integration technologies for package cost reduction and performance improvements - Geared towards practical applications presenting several modern MEMS devices including inertial sensors, microphones, pressure sensors and micromirrors
