Download or read book Fabrication and Mass Transport Analysis of Tape Cast Nano silver High Temperature Solder written by Jared Ray McCoppin and published by . This book was released on 2013 with total page 146 pages. Available in PDF, EPUB and Kindle. Book excerpt: The principal objective in this research was to develop a die attach method to facilitate the use of wide band gap semiconductors in high-temperature environments, and study fundamental mass transport in nano-initiated die attach microstructure at high temperature. Low temperature sintering silver-nano-pastes have been demonstrated as an effective method for die attach by other groups. Fabrication and optimization of the die attach method in this work was accomplished via tape casting. A novel binder system and a bimodal particle distribution were utilized. The tape casting method allowed die attach materials to be pre-stressed. Fundamental understanding of creep deformation process and creep analysis of the resulting silver microstructure was investigated for isothermal stability over extended time. The binder system played a significant role on the level of residual char left within the sintered microstructure. Of the binders investigated, polypropylene carbonate (PPC) resulted in the smallest amount of char residue at 0.6%. Decreasing the organic concentration of PPC resulted in a tradeoff of lower green strength with increased shear strength. Tapes formulated with 10wt.% of PPC binder resulted in viable tapes having approximately 54MPa's of shear strength. Bimodal distribution of nanopowder with micron powder reduced the need for nanopowder by 70%. Micron powder (1-3um) resulted in comparable shear strengths with the nanotapes. Shear strength decreased as particle size was increased above 5um. Pre-stressing allowed for the decoupling of die-material fabrication pressure from the assembly pressure. Tapes pre-stressed to 212MPa showed a significant improvement in green microstructure and shear strength over un-stressed tapes. Relaxation during isothermal annealing of curved bimorph strips monitored by laser beam deflection was used to measure changes in stress and showed a logarithmic decay over time. Thermal cycling of the bimorph strips indicated the material exhibited the Bauschinger effect. In this work, low temperature sintering with silver nanotape has been demonstrated as an effective method to attach a bare die. Optimization of the tape by means of binder, organic concentration, bimodal dispersion, and pre-stressing resulted in a state of the art method capable of shear strengths greater than 60MPa's. Post sintering, the microstructure exhibited recrystallization and grain growth due to surface diffusion over prolonged thermal exposure. According to this work, die attach of purely nano-silver forms an effective bond at low temperatures but prolonged thermal exposure at high temperatures results in creep and abnormal grain growth.
Download or read book High Temperature Electronics written by F. Patrick McCluskey and published by CRC Press. This book was released on 1996-12-13 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Download or read book Additive Manufacturing written by Amit Bandyopadhyay and published by CRC Press. This book was released on 2015-09-08 with total page 547 pages. Available in PDF, EPUB and Kindle. Book excerpt: The field of additive manufacturing has seen explosive growth in recent years due largely in part to renewed interest from the manufacturing sector. Conceptually, additive manufacturing, or industrial 3D printing, is a way to build parts without using any part-specific tooling or dies from the computer-aided design (CAD) file of the part. Today, mo
Download or read book Fundamentals of Numerical Modelling of Casting Processes written by Jesper Hattel and published by . This book was released on 2005 with total page 540 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Manufacturing Processes written by H. N. Gupta and published by New Age International. This book was released on 2012-09 with total page 13 pages. Available in PDF, EPUB and Kindle. Book excerpt: Effective from 2008-09 session, U.P.T.U. has introduced the subject of manufacturing processes for first year engineering students of all streams. This textbook covers the entire course material in a distilled form.
Download or read book Electrospun Nanofibers written by Mehdi Afshari and published by Woodhead Publishing. This book was released on 2016-09-13 with total page 650 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electrospun Nanofibers covers advances in the electrospinning process including characterization, testing and modeling of electrospun nanofibers, and electrospinning for particular fiber types and applications. Electrospun Nanofibers offers systematic and comprehensive coverage for academic researchers, industry professionals, and postgraduate students working in the field of fiber science. Electrospinning is the most commercially successful process for the production of nanofibers and rising demand is driving research and development in this field. Rapid progress is being made both in terms of the electrospinning process and in the production of nanofibers with superior chemical and physical properties. Electrospinning is becoming more efficient and more specialized in order to produce particular fiber types such as bicomponent and composite fibers, patterned and 3D nanofibers, carbon nanofibers and nanotubes, and nanofibers derived from chitosan. - Provides systematic and comprehensive coverage of the manufacture, properties, and applications of nanofibers - Covers recent developments in nanofibers materials including electrospinning of bicomponent, chitosan, carbon, and conductive fibers - Brings together expertise from academia and industry to provide comprehensive, up-to-date information on nanofiber research and development - Offers systematic and comprehensive coverage for academic researchers, industry professionals, and postgraduate students working in the field of fiber science
Download or read book Assembly and Reliability of Lead Free Solder Joints written by John H. Lau and published by Springer Nature. This book was released on 2020-05-29 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
Download or read book Materials and Processes written by Barrie D. Dunn and published by Springer. This book was released on 2015-12-29 with total page 677 pages. Available in PDF, EPUB and Kindle. Book excerpt: The objective of this book is to assist scientists and engineers select the ideal material or manufacturing process for particular applications; these could cover a wide range of fields, from light-weight structures to electronic hardware. The book will help in problem solving as it also presents more than 100 case studies and failure investigations from the space sector that can, by analogy, be applied to other industries. Difficult-to-find material data is included for reference. The sciences of metallic (primarily) and organic materials presented throughout the book demonstrate how they can be applied as an integral part of spacecraft product assurance schemes, which involve quality, material and processes evaluations, and the selection of mechanical and component parts. In this successor edition, which has been revised and updated, engineering problems associated with critical spacecraft hardware and the space environment are highlighted by over 500 illustrations including micrographs and fractographs. Space hardware captured by astronauts and returned to Earth from long durations in space are examined. Information detailed in the Handbook is applicable to general terrestrial applications including consumer electronics as well as high reliability systems associated with aeronautics, medical equipment and ground transportation. This Handbook is also directed to those involved in maximizing the relia bility of new materials and processes for space technology and space engineering. It will be invaluable to engineers concerned with the construction of advanced structures or mechanical and electronic sub-systems.
Download or read book Structural Integrity and Reliability in Electronics written by W.J. Plumbridge and published by Springer Science & Business Media. This book was released on 2007-05-08 with total page 341 pages. Available in PDF, EPUB and Kindle. Book excerpt: Knowledge itself is soon obsolete; It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuing miniaturisation and the anticipated abolition of lead containing solders, represents a major engineering challenge. The involvement of numerous disciplines; such as electrical, electronic, mechanical, manufacturing, and materials engineering together with physicists and computer specialists, adds to the complexity of the situation. Nevertheless, with electronics being the World's largest industrial sector, the potential rewards to the winners are substantial. This book aims to provide the ingredients for understanding, together with knowledge of reliability in interconnection technology and of the implementation of lead free solders. It is strongly contended that such a combination forms the necessary basis for greater structural integrity and enhanced performance The text is essentially in three parts: The intentions of the Part I component {The Materials Perspective, Chapters 1 6) are to present a snapshot of the current, but rapidly changing, global scene and to establish a firm understanding of the fundamentals surrounding interconnection performance. With potential readers possessing a broad spectrum of knowledge and expertise, this is essential. It could be argued that the reason for the limited progress made in this field to date has been due to the difficulties encountered in communicating effectively across the discipline boundaries.
Download or read book Composite Materials written by Kamal K. Kar and published by Springer. This book was released on 2016-10-14 with total page 694 pages. Available in PDF, EPUB and Kindle. Book excerpt: Composite materials are used as substitutions of metals/traditional materials in aerospace, automotive, civil, mechanical and other industries. The present book collects the current knowledge and recent developments in the characterization and application of composite materials. To this purpose the volume describes the outstanding properties of this class of advanced material which recommend it for various industrial applications.
Download or read book Lead Free Soldering in Electronics written by Katsuaki Suganuma and published by CRC Press. This book was released on 2003-12-11 with total page 355 pages. Available in PDF, EPUB and Kindle. Book excerpt: Assessing the scientific and technological aspects of lead-free soldering, Lead-Free Soldering in Electronics considers the necessary background and requirements for proper alloy selection. It highlights the metallurgical and mechanical properties; plating and processing technologies; and evaluation methods vital to the production of lead-free solders in electronics. A valuable resource for those interested in promoting environmentally-conscious electronic packaging practices! Responding to increasing environmental and health concerns over lead toxicity, Lead-Free Soldering in Electronics discusses: Soldering inspection and design Mechanical evaluation in electronics Lead-free solder paste and reflow soldering Wave soldering Plating lead-free soldering in electronics Lead-Free Soldering in Electronics will benefit manufacturing, electronics, and mechanical engineers, as well as undergraduate and graduate students in these disciplines.
Download or read book Handbook of Modern Sensors written by Jacob Fraden and published by Springer Science & Business Media. This book was released on 2006-04-29 with total page 596 pages. Available in PDF, EPUB and Kindle. Book excerpt: Seven years have passed since the publication of the previous edition of this book. During that time, sensor technologies have made a remarkable leap forward. The sensitivity of the sensors became higher, the dimensions became smaller, the sel- tivity became better, and the prices became lower. What have not changed are the fundamental principles of the sensor design. They are still governed by the laws of Nature. Arguably one of the greatest geniuses who ever lived, Leonardo Da Vinci, had his own peculiar way of praying. He was saying, “Oh Lord, thanks for Thou do not violate your own laws. ” It is comforting indeed that the laws of Nature do not change as time goes by; it is just our appreciation of them that is being re?ned. Thus, this new edition examines the same good old laws of Nature that are employed in the designs of various sensors. This has not changed much since the previous edition. Yet, the sections that describe the practical designs are revised substantially. Recent ideas and developments have been added, and less important and nonessential designs were dropped. Probably the most dramatic recent progress in the sensor technologies relates to wide use of MEMS and MEOMS (micro-electro-mechanical systems and micro-electro-opto-mechanical systems). These are examined in this new edition with greater detail. This book is about devices commonly called sensors. The invention of a - croprocessor has brought highly sophisticated instruments into our everyday lives.
Download or read book Handbook of Batteries written by David Linden and published by McGraw-Hill Professional. This book was released on 2002 with total page 1516 pages. Available in PDF, EPUB and Kindle. Book excerpt: BETTER BATTERIES Smaller, lighter, more powerful, and longer-lasting: the better battery is a much-sought commodity in the increasingly portable, ever-more-wireless world of electronics. Powering laptops, handhelds, cell phones, pagers, watches, medical devices, and many other modern necessitites, batteries are crucial to today's cutting-edge technologies. BEST CHOICE FOR BATTERY DESIGN AND EVALUATION This definitive guide from top international experts provides the best technical guidance you can find on designing winning products and selecting the most appropriate batteries for particular applications. HANDBOOK OF BATTERIES covers the field from the tiniest batteries yet devised for life-critical applications to the large batteries required for electric and hybrid electric vehicles. EXPERT INFORMATION Edited by battery experts David Linden, battery consultant and editor of the first two editions, and Dr. Thomas Reddy, a pioneer in the lithium battery field, HANDBOOK OF BATTERIES updates you on current methods, helps you solve problems, and makes comparisons easier. Essential for professionals, valuable to hobbyists, and preferred as a consumer guide for battery purchasers, this the THE source for battery information. The only comprehensive reference in the field, HANDBOOK OF BATTERIES has more authoritative information than any other source: * Authored by a team of leading battery technology experts from around the globe * Covers the characteristics, properties, and performance of every major battery type * Entirely revised, including new information on Lithium Ion and Large Nickel Metal Hydride batteries, and portable fuel cells. This one-of-a-kind HANDBOOK helps you: * Apply leading-edge technologies, materials, and methods in new designs and products * Predict battery performance under any conditions * Have all the needed data and equations at your fingertips
Download or read book Advanced Battery Materials written by Chunwen Sun and published by John Wiley & Sons. This book was released on 2019-03-26 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electrochemical energy storage has played important roles in energy storage technologies for portable electronics and electric vehicle applications. During the past thirty years, great progress has been made in research and development of various batteries, in term of energy density increase and cost reduction. However, the energy density has to be further increased to achieve long endurance time. In this book, recent research and development in advanced electrode materials for electrochemical energy storage devices are presented, including lithium ion batteries, lithium-sulfur batteries and metal-air batteries, sodium ion batteries and supercapacitors. The materials involve transition metal oxides, sulfides, Si-based material as well as graphene and graphene composites.
Download or read book NADCA Product Specification Standards for Die Castings written by Diecasting Development Council (North American Die Casting Association) and published by North Amer Die Casting Assn. This book was released on 1994-01-01 with total page 130 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Brazing written by Dušan P Sekulić and published by Elsevier. This book was released on 2013-03-04 with total page 625 pages. Available in PDF, EPUB and Kindle. Book excerpt: Brazing processes offer enhanced control, adaptability and cost-efficiency in the joining of materials. Unsurprisingly, this has lead to great interest and investment in the area. Drawing on important research in the field, Advances in brazing provides a clear guide to the principles, materials, methods and key applications of brazing.Part one introduces the fundamentals of brazing, including molten metal wetting processes, strength and margins of safety of brazed joints, and modeling of associated physical phenomena. Part two goes on to consider specific materials, such as super alloys, filler metals for high temperature brazing, diamonds and cubic boron nitride, and varied ceramics and intermetallics. The brazing of carbon-carbon (C/C) composites to metals is also explored before applications of brazing and brazed materials are discussed in part three. Brazing of cutting materials, use of coating techniques, and metal-nonmetal brazing for electrical, packaging and structural applications are reviewed, along with fluxless brazing, the use of glasses and glass ceramics for high temperature applications and nickel-based filler metals for components in contact with drinking water.With its distinguished editor and international team of expert contributors, Advances in brazing is a technical guide for any professionals requiring an understanding of brazing processes, and offers a deeper understanding of the subject to researchers and engineers within the field of joining. - Reviews the advances of brazing processes in joining materials - Discusses the fundamentals of brazing and considers specific materials, including super alloys, filler metals, ceramics and intermetallics - Brazing of cutting materials and structural applications are also discussed
Download or read book Engineered Materials Handbook Desk Edition written by ASM International. Handbook Committee and published by ASM International. This book was released on 1995-11-01 with total page 1313 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive reference on the properties, selection, processing, and applications of the most widely used nonmetallic engineering materials. Section 1, General Information and Data, contains information applicable both to polymers and to ceramics and glasses. It includes an illustrated glossary, a collection of engineering tables and data, and a guide to materials selection. Sections 2 through 7 focus on polymeric materials--plastics, elastomers, polymer-matrix composites, adhesives, and sealants--with the information largely updated and expanded from the first three volumes of the Engineered Materials Handbook. Ceramics and glasses are covered in Sections 8 through 12, also with updated and expanded information. Annotation copyright by Book News, Inc., Portland, OR
