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Book Fabrication and Characterisation of Silicon germanium Schottky Diode

Download or read book Fabrication and Characterisation of Silicon germanium Schottky Diode written by Oscar Aik Poh Tan and published by . This book was released on 2003 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book The Fabrication and Characterization of Ion implanted Germanium incorporated Silicon carbide Diodes and Transistors

Download or read book The Fabrication and Characterization of Ion implanted Germanium incorporated Silicon carbide Diodes and Transistors written by Matthias Lang and published by . This book was released on 2006 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The unique material properties of Silicon-Carbide (SiC) make it a superior choice over Silicon or Gallium-Arsenide for applications in power electronics. Unfortunately, SiC semiconductor technology was only developed in recent years and its processes are still immature. Additionally, proper lattice matched compatible elements and alloy materials are rare, which gives other wide-bandgap materials, such as Gallium-Nitride, dominance. Furthermore, the well-established standard CMOS processes can not be applied to SiC in all cases. Finding proper complementary elements and alloys could bring SiC into competition with other wide-bandgap materials again. This thesis describes the incorporation of Germanium (Ge) in SiC as a way of bandgap engineering. Alloying with Germanium is believed to lower the bandgap of SiC, therefore using it to create heterojunction devices. I will introduce Ge-alloyed SiC heterojunction diodes, transistors and Schottky-barrier diodes, and address its advantages over their isomaterial devices. The design of the above mentioned devices will be reported, as well as all fabrication steps. Finally, a thorough analysis and evaluation will be concluded based on device measurements.

Book The Fabrication and Characterisation of 4H silicon Carbide Schottky Barrier Diodes

Download or read book The Fabrication and Characterisation of 4H silicon Carbide Schottky Barrier Diodes written by Dominique Johanne Morrison and published by . This book was released on 2000 with total page 171 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Silicon Based Millimeter Wave Devices

Download or read book Silicon Based Millimeter Wave Devices written by Johann-Friedrich Luy and published by Springer Science & Business Media. This book was released on 2013-03-07 with total page 359 pages. Available in PDF, EPUB and Kindle. Book excerpt: A description of field-theoretical methods for the design and analysis of planar waveguide structures and antennas. The principles and limitations of transit-time devices with different injection mechanisms are covered, as are aspects of fabrication and characterization. The physical properties of silicon Schottky contacts and diodes are treated in a separate chapter, while two whole chapters are devoted to silicon/germanium devices. The integration of devices in monolithic circuits is explained together with advanced technologies, such as the self-mixing oscillator operation, before concluding with sensor and system applications.

Book Fabrication and Characterization of Gallium Arsenide Metal Oxide Semiconductor Field effect Transistors and Thermography of Silicon Carbide Schottky Diodes

Download or read book Fabrication and Characterization of Gallium Arsenide Metal Oxide Semiconductor Field effect Transistors and Thermography of Silicon Carbide Schottky Diodes written by Karthik Rajagopalan and published by . This book was released on 2010 with total page 258 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Applications of Silicon Germanium Heterostructure Devices

Download or read book Applications of Silicon Germanium Heterostructure Devices written by C.K Maiti and published by CRC Press. This book was released on 2001-07-20 with total page 402 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first book to deal with the design and optimization of transistors made from strained layers, Applications of Silicon-Germanium Heterostructure Devices combines three distinct topics-technology, device design and simulation, and applications-in a comprehensive way. Important aspects of the book include key technology issues for the growth of st

Book Silicon Germanium

Download or read book Silicon Germanium written by Raminderpal Singh and published by John Wiley & Sons. This book was released on 2004-03-15 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt: "An excellent introduction to the SiGe BiCMOS technology, from the underlying device physics to current applications." -Ron Wilson, EETimes "SiGe technology has demonstrated the ability to provide excellent high-performance characteristics with very low noise, at high power gain, and with excellent linearity. This book is a comprehensive review of the technology and of the design methods that go with it." -Alberto Sangiovanni-Vincentelli Professor, University of California, Berkeley Cofounder, Chief Technology Officer, Member of Board Cadence Design Systems Inc. Filled with in-depth insights and expert advice, Silicon Germanium covers all the key aspects of this technology and its applications. Beginning with a brief introduction to and historical perspective of IBM's SiGe technology, this comprehensive guide quickly moves on to: * Detail many of IBM's SiGe technology development programs * Explore IBM's approach to device modeling and characterization-including predictive TCAD modeling * Discuss IBM's design automation and signal integrity knowledge and implementation methodologies * Illustrate design applications in a variety of IBM's SiGe technologies * Highlight details of highly integrated SiGe BiCMOS system-on-chip (SOC) design Written for RF/analog and mixed-signal designers, CAD designers, semiconductor students, and foundry process engineers worldwide, Silicon Germanium provides detailed insight into the modeling and design automation requirements for leading-edge RF/analog and mixed-signal products, and illustrates in-depth applications that can be implemented using IBM's advanced SiGe process technologies and design kits. "This volume provides an excellent introduction to the SiGe BiCMOS technology, from the underlying device physics to current applications. But just as important is the window the text provides into the infrastructure-the process development, device modeling, and tool development." -Ron Wilson Silicon Engineering Editor, EETimes "This book chronicles the development of SiGe in detail, provides an in-depth look at the modeling and design automation requirements for making advanced applications using SiGe possible, and illustrates such applications as implemented using IBM's process technologies and design methods." -John Kelly Senior Vice President and Group Executive, Technology Group, IBM

Book Fabrication and Modelling of Porous Silicon Schottky Diode

Download or read book Fabrication and Modelling of Porous Silicon Schottky Diode written by Janani Jayabalakrishnan and published by . This book was released on 2017 with total page 48 pages. Available in PDF, EPUB and Kindle. Book excerpt: The thesis work primarily focuses on fabrication and modelling of Schottky Diode formed using porous silicon. The wafer used for this is silicon coated with silicon nitride on both sides. A photoresist is deposited on the front side of the wafer using spin coating technique and silicon nitride that is coated on the back side is etched off using dry chemical etching process. A photomask is designed using AutoCAD software which helps open windows on the front side of the wafer. Windows are opened on the front side using positive photoresist technique. This technique enables the portion of the wafer that is exposed to UV light more soluble in the developer solution making the unexposed portion opaque or insoluble. Silicon nitride is etched off on the front side where the windows are opened using similar dry chemical etching process. After coating photoresist on the front side, silicon nitride on the backside is etched completely. Silicon nitride thickness before and after etching has been recorded. The wafer is then diced into smaller samples and allowed to grow pores. Electrochemical etching process with the electrolyte HF:Ethanol in the ratio of 1:3 is used for porous silicon formation. The samples are then coated with Chrome/Gold contact on front and backside and are examined under Scanning Electron Microscope (SEM). The device, when exposed to light, exhibits schottky diode characteristics. The forward and reverse diode characteristics have been tested.

Book Fabrication and Characterization of N silicon Metal insulator semiconductor Diodes Containing a Photoanodically Grown Insulating Layer

Download or read book Fabrication and Characterization of N silicon Metal insulator semiconductor Diodes Containing a Photoanodically Grown Insulating Layer written by Mark Douglas Rosenblum and published by . This book was released on 1988 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book The Fabrication and Characterisation of 4H SiC Schottky Barrier Diodes

Download or read book The Fabrication and Characterisation of 4H SiC Schottky Barrier Diodes written by Dominique Johanne Morrison and published by . This book was released on 2000 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Fabrication and Characterization of Silicon Quantum Confined Diodes

Download or read book Fabrication and Characterization of Silicon Quantum Confined Diodes written by Amanda Margaret Bowhill and published by . This book was released on 1994 with total page 120 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Fabrication and Characterization of Schottky barrier Diodes for Mixer Applications

Download or read book Fabrication and Characterization of Schottky barrier Diodes for Mixer Applications written by James A. Griffin and published by . This book was released on 1979 with total page 68 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Semiconductor Material and Device Characterization

Download or read book Semiconductor Material and Device Characterization written by Dieter K. Schroder and published by John Wiley & Sons. This book was released on 2015-06-29 with total page 800 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Third Edition updates a landmark text with the latest findings The Third Edition of the internationally lauded Semiconductor Material and Device Characterization brings the text fully up-to-date with the latest developments in the field and includes new pedagogical tools to assist readers. Not only does the Third Edition set forth all the latest measurement techniques, but it also examines new interpretations and new applications of existing techniques. Semiconductor Material and Device Characterization remains the sole text dedicated to characterization techniques for measuring semiconductor materials and devices. Coverage includes the full range of electrical and optical characterization methods, including the more specialized chemical and physical techniques. Readers familiar with the previous two editions will discover a thoroughly revised and updated Third Edition, including: Updated and revised figures and examples reflecting the most current data and information 260 new references offering access to the latest research and discussions in specialized topics New problems and review questions at the end of each chapter to test readers' understanding of the material In addition, readers will find fully updated and revised sections in each chapter. Plus, two new chapters have been added: Charge-Based and Probe Characterization introduces charge-based measurement and Kelvin probes. This chapter also examines probe-based measurements, including scanning capacitance, scanning Kelvin force, scanning spreading resistance, and ballistic electron emission microscopy. Reliability and Failure Analysis examines failure times and distribution functions, and discusses electromigration, hot carriers, gate oxide integrity, negative bias temperature instability, stress-induced leakage current, and electrostatic discharge. Written by an internationally recognized authority in the field, Semiconductor Material and Device Characterization remains essential reading for graduate students as well as for professionals working in the field of semiconductor devices and materials. An Instructor's Manual presenting detailed solutions to all the problems in the book is available from the Wiley editorial department.