Download or read book Extreme Environment Silicon Carbide Hybrid Temperature Pressure Optical Sensors written by and published by . This book was released on 2010 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: This final report contains the main results from a 3-year program to further investigate the merits of SiC-based hybrid sensor designs for extreme environment measurements in gas turbines. The study is divided in three parts. Part 1 studies the material properties of SiC such as temporal response, refractive index change with temperature, and material thermal response reversibility. Sensor data from a combustion rig-test using this SiC sensor technology is analyzed and a robust distributed sensor network design is proposed. Part 2 of the study focuses on introducing redundancy in the sensor signal processing to provide improved temperature measurement robustness. In this regard, two distinct measurement methods emerge. A first method uses laser wavelength sensitivity of the SiC refractive index behavior and a second method that engages the Black-Body (BB) radiation of the SiC package. Part 3 of the program investigates a new way to measure pressure via a distance measurement technique that applies to hot objects including corrosive fluids.
Download or read book Ultra High Temperature Sensors Based on Optical Property written by and published by . This book was released on 2008 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: In this program, Nuonics, Inc. has studied the fundamentals of a new Silicon Carbide (SiC) materials-based optical sensor technology suited for extreme environments of coal-fired engines in power production. The program explored how SiC could be used for sensing temperature, pressure, and potential gas species in a gas turbine environment. The program successfully demonstrated the optical designs, signal processing and experimental data for enabling both temperature and pressure sensing using SiC materials. The program via its sub-contractors also explored gas species sensing using SiC, in this case, no clear commercially deployable method was proven. Extensive temperature and pressure measurement data using the proposed SiC sensors was acquired to 1000 deg-C and 40 atms, respectively. Importantly, a first time packaged all-SiC probe design was successfully operated in a Siemens industrial turbine rig facility with the probe surviving the harsh chemical, pressure, and temperature environment during 28 days of test operations. The probe also survived a 1600 deg-C thermal shock test using an industrial flame.
Download or read book Silicon Carbide Pressure Sensors for High Temperature Applications written by Sheng Jin and published by . This book was released on 2011 with total page 214 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Extreme Temperature Robust Optical Sensor Designs and Fault tolerant Signal Processing written by and published by . This book was released on 2012 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicon Carbide (SiC) probe designs for extreme temperature and pressure sensing uses a single crystal SiC optical chip encased in a sintered SiC material probe. The SiC chip may be protected for high temperature only use or exposed for both temperature and pressure sensing. Hybrid signal processing techniques allow fault-tolerant extreme temperature sensing. Wavelength peak-to-peak (or null-to-null) collective spectrum spread measurement to detect wavelength peak/null shift measurement forms a coarse-fine temperature measurement using broadband spectrum monitoring. The SiC probe frontend acts as a stable emissivity Black-body radiator and monitoring the shift in radiation spectrum enables a pyrometer. This application combines all-SiC pyrometry with thick SiC etalon laser interferometry within a free-spectral range to form a coarse-fine temperature measurement sensor. RF notch filtering techniques improve the sensitivity of the temperature measurement where fine spectral shift or spectrum measurements are needed to deduce temperature.
Download or read book Line of sight Sealed Silicon Carbide Diaphragms for Harsh Environment Sensors written by Debbie Gahaton Jones and published by . This book was released on 2007 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Monolithically Integrated Silicon Carbide Sensor Arrays for Extreme Environments written by Sandip Kumar Roy and published by . This book was released on 2017 with total page 141 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Harsh Environment Electronics written by Ahmed Sharif and published by John Wiley & Sons. This book was released on 2019-08-05 with total page 398 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.
Download or read book Ultra High Temperature Sensors Based on Optical Property Modulation and Vibration Tolerant Interferometry written by and published by . This book was released on 2006 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The goals of the Year 2006 Continuation Phase 2 three months period (April 1 to Sept. 30) of this project were to (a) conduct a probe elements industrial environment feasibility study and (b) fabricate embedded optical phase or microstructured SiC chips for individual gas species sensing. Specifically, SiC chips for temperature and pressure probe industrial applications were batch fabricated. Next, these chips were subject to a quality test for use in the probe sensor. A batch of the best chips for probe design were selected and subject to further tests that included sensor performance based on corrosive chemical exposure, power plant soot exposure, light polarization variations, and extreme temperature soaking. Experimental data were investigated in detail to analyze these mentioned industrial parameters relevant to a power plant. Probe design was provided to overcome mechanical vibrations. All these goals have been achieved and are described in detail in the report. The other main focus of the reported work is to modify the SiC chip by fabricating an embedded optical phase or microstructures within the chip to enable gas species sensing under high temperature and pressure. This has been done in the Kar UCF Lab. using a laser-based system whose design and operation is explained. Experimental data from the embedded optical phase-based chip for changing temperatures is provided and shown to be isolated from gas pressure and species. These design and experimentation results are summarized to give positive conclusions on the proposed high temperature high pressure gas species detection optical sensor technology.
Download or read book Optics Letters written by and published by . This book was released on 2008 with total page 576 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Dual Parameter Opto Mechanical Fiber Optic Sensors for Harsh Environment Sensing written by Tian You Richard Liang and published by . This book was released on 2014 with total page 89 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thesis concerns with the development of a dual-parameter sensor based on fiber Bragg grating (FBG) and a packaging design for high pressure sensing in harsh environment. This thesis starts by introducing a novel design of a partially coated FBG, using a metallic insert and a thermal curing epoxy. An analytical opto-mechanical model, based on couple mode theory, was developed and presented. The experimental and modelling result of the optical response of the partially coated FBG were compared and shown to be in excellent agreement. The experiments were executed on a custom-built fiber optic calibration station. The coated FBG sensor has a temperature sensitivity of 26.9 ± 0.3 pm/°C, which is 2.7 times higher than a bare fiber; and a force sensitivity of 0.104 nm/N, which is 13 times smaller than a bare fiber. The zero reference of the sensor has a drift of a maximum of 70 pm but the sensor is shown to settle within ±5 pm after 3 thermal cycles and 10 tensile loading cycles. A low profile packaging design is presented for a maximum pressure of 20.68 MPa (3000 psi) for harsh environment applications. A detailed study with FEM analysis revealed the optimal design for the package's sleeve thickness is 0.5 mm. The temperature sensitivity is in close agreement with the unpackaged coated sensor with 10% difference. Compared to the modelling, the equivalent force sensitivity is 27% lower due to prototype dimensional uncertainties and modelling uncertainties with the material properties. The lack of pre-tension of the FBG sensor in the package also attributed to lower force sensitivity at pressure level lower than 4.13 MPa (600 psi).
Download or read book Chemical Vapor Deposition written by S Neralla and published by BoD – Books on Demand. This book was released on 2016-08-31 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides an overview of chemical vapor deposition (CVD) methods and recent advances in developing novel materials for application in various fields. CVD has now evolved into the most widely used technique for growth of thin films in electronics industry. Several books on CVD methods have emerged in the past, and thus the scope of this book goes beyond providing fundamentals of the CVD process. Some of the chapters included highlight current limitations in the CVD methods and offer alternatives in developing coatings through overcoming these limitations.
Download or read book Silicon Carbide Technology for Extreme Environments written by Daniel Richard Brennan and published by . This book was released on 2016 with total page 138 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microelectromechanical Systems written by National Research Council and published by National Academies Press. This book was released on 1998-01-01 with total page 76 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectromenchanical systems (MEMS) is a revolutionary field that adapts for new uses a technology already optimized to accomplish a specific set of objectives. The silicon-based integrated circuits process is so highly refined it can produce millions of electrical elements on a single chip and define their critical dimensions to tolerances of 100-billionths of a meter. The MEMS revolution harnesses the integrated circuitry know-how to build working microsystems from micromechanical and microelectronic elements. MEMS is a multidisciplinary field involving challenges and opportunites for electrical, mechanical, chemical, and biomedical engineering as well as physics, biology, and chemistry. As MEMS begin to permeate more and more industrial procedures, society as a whole will be strongly affected because MEMS provide a new design technology that could rivalâ€"perhaps surpassâ€"the societal impact of integrated circuits.
Download or read book Sensors for Extreme Harsh Environments written by Society of Photo-optical Instrumentation Engineers (United States) and published by . This book was released on 2014 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Sensors for Extreme Harsh Environments II written by Debbie G. Senesky and published by . This book was released on 2015-07-30 with total page 277 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Download or read book Development of a High Temperature Silicon Carbide Capacitive Pressure Sensor System Based on a Clapp type Oscillator Circuit written by Maximilian C Scardelletti and published by . This book was released on 2016 with total page 194 pages. Available in PDF, EPUB and Kindle. Book excerpt: In this dissertation, the development of a packaged silicon carbide (SiC) based MEMS capacitive pressure sensor system that is designed to monitor the pressure of a conventional gas turbofan engine is described. The electronic circuit of the pressure sensor system is based on a Clapp-type oscillator that includes a 6H-SiC MESFET, a SiCN MEMS-based capacitive pressure sensor, titanate MIM capacitors, wirewound inductors, and thick film resistors. The capacitive pressure sensor is incorporated in the LC tank circuit of the oscillator so that a pressure-induced change in capacitance causes a change in the resonant frequency of the oscillator. The MESFET is used to induce oscillation. Individual passive components were evaluated at high temperature to assess their utility in an integrated system. Both wireless and wired variants of the pressure sensor systems for use at high temperature were developed. In developing the final packaged device, several prototype designs of the Clapp-type oscillator circuit that incorporate wireless capability were explored. Prototype circuits with slot-ring and chip antennas operating between 700 MHz and 1 GHz exhibited a maximum operating temperature of 250¿C, limited by the low gain of the MESFET at these frequencies. Prototype circuits operating at 30 and 90 MHz that utilize large spiral inductors in the Clapp oscillator as the radiating element extended stable operation to 470°C. Several wireless pressure sensor prototypes based on the Clapp oscillator circuit were developed. A prototype incorporating a polysilicon capacitive pressure sensor and a spiral inductor exhibited stable operation up to 300°C. A second prototype that used a SiCN capacitive pressure sensor functioned at temperatures up to 400°C. A third prototype based on the 2nd prototype but incorporating a compact, directional chip antenna had a maximum operating temperature of 300oC, limited by the antenna. Based on size restrictions, the packaged system utilized a wired configuration. This prototype operates reliably from 0 to 350 psi and from 25 to 540°C, with a sensitivity of 6.8x10-2 MHz/psi and negligible difference in frequency response. The packaged sensor passed standard benchtop temperature, pressure and vibration acceptance tests required prior to any future test on a flight worthy engine.
Download or read book Silicon Carbide written by Wolfgang J. Choyke and published by Springer Science & Business Media. This book was released on 2013-04-17 with total page 911 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since the 1997 publication of "Silicon Carbide - A Review of Fundamental Questions and Applications to Current Device Technology" edited by Choyke, et al., there has been impressive progress in both the fundamental and developmental aspects of the SiC field. So there is a growing need to update the scientific community on the important events in research and development since then. The editors have again gathered an outstanding team of the world's leading SiC researchers and design engineers to write on the most recent developments in SiC.
