Download or read book Proceedings of the International Symposium on Semiconductor Wafer Bonding written by and published by . This book was released on 1991 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings of the Fourth International Symposium on Cleaning Technology in Semiconductor Device Manufacturing written by Richard E. Novak and published by The Electrochemical Society. This book was released on 1996 with total page 642 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings of the Fifth International Symposium on Cleaning Technology in Semiconductor Device Manufacturing written by Jerzy Rużyłło and published by The Electrochemical Society. This book was released on 1998 with total page 668 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2017-12-19 with total page 3276 pages. Available in PDF, EPUB and Kindle. Book excerpt: Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.

Download or read book Rapid Thermal Processing written by Richard B. Fair and published by Academic Press. This book was released on 2012-12-02 with total page 441 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the first definitive book on rapid thermal processing (RTP), an essential namufacturing technology for single-wafer processing in highly controlled environments. Written and edited by nine experts in the field, this book covers a range of topics for academics and engineers alike, moving from basic theory to advanced technology for wafer manufacturing. The book also provides new information on the suitability or RTP for thin film deposition, junction formation, silicides, epitaxy, and in situ processing. Complete discussions on equipment designs and comparisons between RTP and other processing approaches also make this book useful for supplemental information on silicon processing, VLSI processing, and integrated circuit engineering.

Download or read book Proceedings of the Fifth Symposium on Automated Integrated Circuits Manufacturing written by Vaughn E. Akins and published by . This book was released on 1990 with total page 302 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings of the Second International Symposium on Process Physics and Modeling in Semiconductor Technology written by G. R. Srinivasan and published by . This book was released on 1991 with total page 826 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings of the Second International Symposium on Process Control Diagnostics and Modeling in Semiconductor Manufacturing written by M. Meyyappan and published by The Electrochemical Society. This book was released on 1997 with total page 366 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings of the Fifth International Symposium on High Purity Silicon written by Cor L. Claeys and published by The Electrochemical Society. This book was released on 1998 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings of the Symposium on Automated Integrated Circuits Manufacturing written by and published by . This book was released on 1990 with total page 304 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Developments in Surface Contamination and Cleaning Vol 1 written by Rajiv Kohli and published by William Andrew. This book was released on 2015-11-12 with total page 898 pages. Available in PDF, EPUB and Kindle. Book excerpt: Developments in Surface Contamination and Cleaning, Vol. 1: Fundamentals and Applied Aspects, Second Edition, provides an excellent source of information on alternative cleaning techniques and methods for characterization of surface contamination and validation. Each volume in this series contains a particular topical focus, covering the key techniques and recent developments in the area. This volume forms the heart of the series, covering the fundamentals and application aspects, characterization of surface contaminants, and methods for removal of surface contamination. In addition, new cleaning techniques effective at smaller scales are considered and employed for removal where conventional cleaning techniques fail, along with new cleaning techniques for molecular contaminants. The Volume is edited by the leading experts in small particle surface contamination and cleaning, providing an invaluable reference for researchers and engineers in R&D, manufacturing, quality control, and procurement specification in a multitude of industries such as aerospace, automotive, biomedical, defense, energy, manufacturing, microelectronics, optics and xerography. - Provides best-practice guidance for scientists and engineers engaged in surface cleaning or those who handle the consequences of surface contamination - Addresses the continuing trends of shrinking device size and contamination vulnerability in a range of industries as spearheaded by the semiconductor industry - Presents state-of-the-art survey information on precision cleaning and characterization methods as written by a team of world-class experts in the field

Download or read book Handbook for Cleaning for Semiconductor Manufacturing written by Karen A. Reinhardt and published by John Wiley & Sons. This book was released on 2011-04-12 with total page 596 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides an In-depth discussion of surface conditioning for semiconductor applications The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications provides an in-depth discussion of surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet processing is reviewed as well as surface and colloidal aspects of cleaning and etching. Topics covered in this new reference include: Front end line (FEOL) and back end of line (BEOL) cleaning applications such as high-k/metal gate post-etch cleaning and pore sealing, high-dose implant stripping and cleaning, and germanium, and silicon passivation Formulation development practices, methodology and a new directions are presented including chemicals used for preventing corrosion of copper lines, cleaning aluminium lines, reclaiming wafers, and water bonding, as well as the filtering and recirculating of chemicals including reuse and recycling Wetting, cleaning, and drying of features, such as high aspect ratio features and hydrophilic surface states, especially how to dry without watermarks, the abilities to wet hydrophobic surfaces and to remove liquid from deep features The chemical reactions and mechanisms of silicon dioxide etching with hydrofluoric acid, particle removal with ammonium hydroxide/hydrogen peroxide mixture, and metal removal with hydrochloric acid The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications is a valuable resource for any engineer or manager associated with using or supplying cleaning and contamination free technologies for semiconductor manufacturing. Engineers working for semiconductor manufacturing, capital equipment, chemicals, or other industries that assures cleanliness of chemicals, material, and equipment in the manufacturing area will also find this handbook an indispensible reference.

Download or read book Passivity of Metals and Semiconductors written by Michael Brian Ives and published by The Electrochemical Society. This book was released on 2001 with total page 1000 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Semiconductor Measurement Technology written by National Institute of Standards and Technology (U.S.) and published by . This book was released on 1994 with total page 76 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Handbook of Silicon Wafer Cleaning Technology written by Karen Reinhardt and published by William Andrew. This book was released on 2018-03-16 with total page 794 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Silicon Wafer Cleaning Technology, Third Edition, provides an in-depth discussion of cleaning, etching and surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet and plasma processing are reviewed, including surface and colloidal aspects. This revised edition includes the developments of the last ten years to accommodate a continually involving industry, addressing new technologies and materials, such as germanium and III-V compound semiconductors, and reviewing the various techniques and methods for cleaning and surface conditioning. Chapters include numerous examples of cleaning technique and their results. The book helps the reader understand the process they are using for their cleaning application and why the selected process works. For example, discussion of the mechanism and physics of contamination, metal, particle and organic includes information on particle removal, metal passivation, hydrogen-terminated silicon and other processes that engineers experience in their working environment. In addition, the handbook assists the reader in understanding analytical methods for evaluating contamination. The book is arranged in an order that segments the various cleaning techniques, aqueous and dry processing. Sections include theory, chemistry and physics first, then go into detail for the various methods of cleaning, specifically particle removal and metal removal, amongst others. - Focuses on cleaning techniques including wet, plasma and other surface conditioning techniques used to manufacture integrated circuits - Reliable reference for anyone that manufactures integrated circuits or supplies the semiconductor and microelectronics industries - Covers processes and equipment, as well as new materials and changes required for the surface conditioning process

Download or read book Fundamental Gas phase and Surface Chemistry of Vapor phase Deposition II and Process Control Diagnostics and Modeling in Semiconductor Manufacturing IV written by Electrochemical Society. High Temperature Materials Division and published by The Electrochemical Society. This book was released on 2001 with total page 526 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Scientific Wet Process Technology for Innovative LSI FPD Manufacturing written by Tadahiro Ohmi and published by CRC Press. This book was released on 2018-10-03 with total page 569 pages. Available in PDF, EPUB and Kindle. Book excerpt: As science pushes closer toward the atomic size scale, new challenges arise to slow the pace of the miniaturization that has transformed our society and fueled the information age. New technologies are necessary to surpass these obstacles and realize the tremendous growth predicted by Moore's law. Assembled from the works of pioneering researchers, Scientific Wet Process Technology for Innovative LSI/FPD Manufacturing presents new developments and technologies for producing the next generation of electronic circuits and displays. This book introduces radical-reaction-based semiconductor manufacturing technologies that overcome the limitations of the existing molecule-reaction-based technologies. It systematically details the procedures and underlying concepts involved in wet process technologies and applications. Following an introduction to semiconductor surface chemical electronics, expert contributors discuss the principles and technology of high-performance wet cleaning; etching technologies and processes; antistatic technology; wet vapor resist stripping technology; and process and safety technologies including waste reclamation, chemical composition control, and ultrapure water and liquid chemical supply systems and materials for fluctuation-free facilities. Currently, large production runs are needed to balance the costs of acquiring and tuning equipment for specialized operating conditions. Scientific Wet Process Technology for Innovative LSI/FPD Manufacturing explains the technologies and processes used to meet the demand for variety and low volumes that exists in today's digital electronics marketplace.