Download or read book Evaluation of Die Attach Materials for High Temperature Power Electronics Applications and Analysis of the Ag Particles Sintering Solution written by Luis Alberto Navarro Melchor and published by . This book was released on 2015 with total page 206 pages. Available in PDF, EPUB and Kindle. Book excerpt: Sintering of Ag particles is an interesting solution as die-attach material for power electronics packaging in high temperature applications because it offers the outstanding properties of Ag (including a 961 oC melting point) using low process temperature (

Download or read book Evaluation of die attach materials for high temperature power electronics applications and analysis of the Ag particles sintering solution written by Luis Alberto Navarro Melchor and published by . This book was released on 2015 with total page 201 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Die Attach Materials for High Temperature Applications in Microelectronics Packaging written by Kim S. Siow and published by Springer. This book was released on 2019-01-29 with total page 279 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.

Download or read book Harsh Environment Electronics written by Ahmed Sharif and published by John Wiley & Sons. This book was released on 2019-03-19 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.

Download or read book Interface Circuits for Microsensor Integrated Systems written by Giuseppe Ferri and published by MDPI. This book was released on 2018-12-07 with total page 171 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a printed edition of the Special Issue "Interface Circuits for Microsensor Integrated Systems" that was published in Micromachines

Download or read book Sintering Fundamentals written by G.S. Upadhyaya and published by Trans Tech Publications Ltd. This book was released on 2009-06-11 with total page 152 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume is indexed by Thomson Reuters BCI (WoS). This book comprises state-of-the–art reviews written by acknowledged experts who are active in sintering science. It includes seven invited reviews by authors hailing from five countries: J-M.Chaix (France) discusses quantitative aspects of the microstructures and modeling of sintering; with the technical aspects of image-analysis - including that of nanostructured materials - adding extra value. Z.S. Nikolic (Serbia) provides a theoretical review of the simulation of liquid-phase sintering, particularly under microgravity conditions, and extensively and critically reviews the results reported in the sintering literature. A.L. Lisovsky (Ukraine) opens up the vista of deconsolidation of polycrystalline skeletons in sintered composite materials, and deals with systems having more than one refractory solid phase, and with nanodispersed composite materials. G.S. Upadhyaya ( India) reviews the Samsonov model for the electronic mechanism of sintering, and its relevance; pointing out that, although the model is a qualitative one, it has great utility as a predictive tool and that various case-studies drawn from real multi-phase material systems are a testimony to the value of Samsonov’s model.

Download or read book Spark Plasma Sintering of Materials written by Pasquale Cavaliere and published by Springer. This book was released on 2019-02-18 with total page 781 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes spark plasma sintering (SPS) in depth. It addresses fundamentals and material-specific considerations, techniques, and applications across a broad spectrum of materials. The book highlights methods used to consolidate metallic or ceramic particles in very short times. It highlights the production of complex alloys and metal matrix composites with enhanced mechanical and wear properties. Emphasis is placed on the speed of the sintering processes, uniformity in product microstructure and properties, reduced grain growth, the compaction and sintering of materials in one processing step, various materials processing, and high energy efficiency. Current and potential applications in space science and aeronautics, automation, mechanical engineering, and biomedicine are addressed throughout the book.

Download or read book Structural Integrity and Reliability in Electronics written by W.J. Plumbridge and published by Springer Science & Business Media. This book was released on 2007-05-08 with total page 341 pages. Available in PDF, EPUB and Kindle. Book excerpt: Knowledge itself is soon obsolete; It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuing miniaturisation and the anticipated abolition of lead containing solders, represents a major engineering challenge. The involvement of numerous disciplines; such as electrical, electronic, mechanical, manufacturing, and materials engineering together with physicists and computer specialists, adds to the complexity of the situation. Nevertheless, with electronics being the World's largest industrial sector, the potential rewards to the winners are substantial. This book aims to provide the ingredients for understanding, together with knowledge of reliability in interconnection technology and of the implementation of lead free solders. It is strongly contended that such a combination forms the necessary basis for greater structural integrity and enhanced performance The text is essentially in three parts: The intentions of the Part I component {The Materials Perspective, Chapters 1 6) are to present a snapshot of the current, but rapidly changing, global scene and to establish a firm understanding of the fundamentals surrounding interconnection performance. With potential readers possessing a broad spectrum of knowledge and expertise, this is essential. It could be argued that the reason for the limited progress made in this field to date has been due to the difficulties encountered in communicating effectively across the discipline boundaries.

Download or read book Liquid Phase Sintering written by R.M. German and published by Springer Science & Business Media. This book was released on 2013-12-14 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the past few years there has been rapid growth in the activities involving particulate materials because of recognized advantages in manufacturing. This growth is attributed to several factors; i) an increased concern over energy utilization, ii) a desire to better control microstructure in engineermg materials, iii) the need for 1mproved material economy, iv) societal and economic pressures for higher productivity and quality, v) requirements for unique property combinations for high performance applica tions, and vi) a desire for net shape forming. Accordingly, liquid phase sintering has received increased attention as part of the growth in particulate materials processing. As a consequence, the commercial applications for liquid phase sintering are expanding rapidly. This active and expanding interest is not well served by available texts. For this reason I felt it was appropriate to write this book on liquid phase sintering. The technology of liquid phase sintering IS quite old and has been in use in the ceramics industry for many centuries. However, the general perception among materials and manufacturing engineers is that liquid phase sintering is still a novel technique. I believe the diverse technological appli cations outlined in this book will dispel I such impressions. Liquid phase. sintering has great value in fabricating several unique materials to near net shapes and will continue to expand in applications as the fundamental attrib utes are better appreciated. I am personally involved with several uses for liquid phase sintering.

Download or read book Innovative Solid State Bonding Designs and Techniques for High Power Electronic and Laser Diode Packaging written by Yi-Ling Chen and published by . This book was released on 2016 with total page 180 pages. Available in PDF, EPUB and Kindle. Book excerpt: Rapid evolution of electronics industry has made the adoption of high performance chips more urgent. In fact, those chips cannot be used unless high temperature die attach materials and methods are available. The conventional die attach methods typically require a processing temperature 20--30 °C above the melting temperature of bonding material, which melts and reacts with to-be-bonded parts to form the bonding joint. For high temperature applications (> 400 °C), the processing temperature will sharply increase along with the increased melting temperature to reach the molten phase. However, such high processing temperature will damage nearly all electronic components. To respond to such challenge, the metal bonding is considered to be a possible solution.In this dissertation, the solid-state bonding technique is employed for various bonding designs by electroplating Ag-based and In-based systems as bonding media. No molten phase or flux is involved. For most cases, the bonding conditions are conducted at 300 °C with 6.89 MPa (1,000 psi) pressure for a dwell time of 3 min in vacuum. The bonding time, 3 min, is constrained by the furnace. It is worth mentioning that this pressure is less than 10% of what is used in industrial thermo-compression processes.To begin with, silver (Ag) was chosen as a bonding medium because of its exceptional properties and reasonable price. There are two designs for the Ag layer. For the first design, the 50 microm Ag layer plated on the copper (Cu) substrate is initially annealed at 400 °C for 5 h to increase Ag grain sizes, thereby making it easier to deform during bonding. For the second design, the 10 microm Ag layer is plated on the substrate and followed another 5 microm Ag with cavities. The fundamental concept is to release the thermal induced stress by creating cavities in the Ag layer to allow easier plastic deformation for the bonding medium. The resulting Ag layers are then bonded to the Cu chips. For both designs, all samples are bonded well and pass MIL-STD-883J method 2019.9. The Ag layer is also applied to the Cu wire bonding. To overcome Cu oxidation issue, the bonding surface on the 1 mm Cu wire is plated a 50 microm Ag layer. An annealing step is followed to facilitate the Ag layer easier to deform and conform to the Cu or Si bonding surfaces. In-plane pull test and vertical pull test are performed to measure the breaking force of the wire bonds. For wire-bonds made on the Cu substrate, the breaking forces on in-plane pull test are greater than 20 kg. The breaking forces on vertical pull test are approximately one-half of in-plane pull test results. For wire-bonds made on Si chip, breaking forces are approximately 80% of those made on Cu substrate.Next, the novel method is to bond the Si chips to Cu substrates directly. This structure design can provide low-resistance paths for electricity and heat. There is no specific joint used in between. The basic concept is to provide room for Cu and Si to deform without restriction by producing trenches inside the Cu substrate. When the bond between two surfaces is formed, the trenches inside the Cu substrate could release the part of thermal stress from the coefficient of thermal expansion CTE mismatch. Therefore, the bond could deal with the large CTE mismatch between Si (3 ppm/°C) and Cu (17 ppm/°C). The cross-sectional images show that the Si chips are well bonded to the Cu substrates without visible voids and cracks. After the bonding process, the simple shear tests are conducted to evaluate the bond strength, while the Si chips are all broken first. It demonstrates that the bond is stronger than the Si chip itself.Finally, the Ag-rich Ag-In solid solution layers have successfully developed on Si and silicon carbide (SiC) chips. Ag has definite advantages among metals, but it still has its own weaknesses, which can actually or potentially lead to failure. That is Ag can be tarnished not only when exposed to certain corrosive gases such as hydrogen sulfide or sulfur gas but also under normal atmospheric conditions for a long period of time. Ag-In solid solution is further studied while Ag-In binary system has been demonstrated with an exceptional anti-tarnish property. To fabricate the single phase Ag-In solid solution, the Ag/In/Ag multilayers are electroplated on the chips. Importantly, the bottom Ag layer is initially annealed at 350 °C to increase its grain sizes and to reduce grain boundaries, inasmuch as the reaction rate between Ag and In is subject to the microstructure of Ag layer. The In/Ag layers are followed to be plated onto Si chip. To decompose AgIn2 and Ag2In, the two-step annealing process is then performed in a vacuum environment at 180 °C and 350 °C, respectively. After the bonding process, the compositions of resulting joints are measured by SEM/EDX, which is a homogeneous Ag-rich Ag-In solid solution.In this study, five different bonding designs are reported. All bonds made between the chips and the substrates are fabricated at relatively low processing temperatures. The bonding structures are designed to be used for high operating temperatures. The results are encouraging. These novel methods may bring a chance for those who need die-attach materials for high performance electronic devices under severe environmental conditions in industries.

Download or read book Nonlinear Approaches in Engineering Applications written by Reza N. Jazar and published by Springer. This book was released on 2019-08-06 with total page 458 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the latest applications of nonlinear approaches in engineering and addresses a range of scientific problems. Examples focus on issues in automotive technology, including automotive dynamics, control for electric and hybrid vehicles, and autodriver algorithm for autonomous vehicles. Also included are discussions on renewable energy plants, data modeling, driver-aid methods, and low-frequency vibration. Chapters are based on invited contributions from world-class experts who advance the future of engineering by discussing the development of more optimal, accurate, efficient, cost, and energy effective systems. This book is appropriate for researchers, students, and practising engineers who are interested in the applications of nonlinear approaches to solving engineering and science problems. Presents a broad range of practical topics and approaches; Explains approaches to better, safer, and cheaper systems; Emphasises automotive applications, physical meaning, and methodologies.

Download or read book Lead Free Soldering in Electronics written by Katsuaki Suganuma and published by CRC Press. This book was released on 2003-12-11 with total page 355 pages. Available in PDF, EPUB and Kindle. Book excerpt: Assessing the scientific and technological aspects of lead-free soldering, Lead-Free Soldering in Electronics considers the necessary background and requirements for proper alloy selection. It highlights the metallurgical and mechanical properties; plating and processing technologies; and evaluation methods vital to the production of lead-free solders in electronics. A valuable resource for those interested in promoting environmentally-conscious electronic packaging practices! Responding to increasing environmental and health concerns over lead toxicity, Lead-Free Soldering in Electronics discusses: Soldering inspection and design Mechanical evaluation in electronics Lead-free solder paste and reflow soldering Wave soldering Plating lead-free soldering in electronics Lead-Free Soldering in Electronics will benefit manufacturing, electronics, and mechanical engineers, as well as undergraduate and graduate students in these disciplines.

Download or read book High Temperature Electronics written by F. Patrick McCluskey and published by CRC Press. This book was released on 1996-12-13 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.

Download or read book Sintering written by Suk-Joong L. Kang and published by Elsevier. This book was released on 2004-11-27 with total page 279 pages. Available in PDF, EPUB and Kindle. Book excerpt: Sintering is the process of forming materials and components from a powder under the action of thermal energy. It is a key materials science subject: most ceramic materials and many specialist metal powder products for use in key industries such as electronics, automotive and aerospace are formed this way. Written by one of the leading experts in the field, this book offers an unrivalled introduction to sintering and sintering processes for students of materials science and engineering, and practicing engineers in industry. The book is unique in providing a complete grounding in the principles of sintering and equal coverage of the three key sintering processes: densification, grain growth and microstructure. Students and professional engineers alike will be attracted by the emphasis on developing a detailed understanding of the theory and practical processes of sintering, the balanced coverage of ceramic and metal sintering, and the accompanying examination questions with selected solutions. - Delivering unrivalled depth of coverage on the basis of sintering, science, including thermodynamics and polycrystalline microstructure. - Unique in its balanced coverage of the three key sintering elements - densification, grain growth and microstructure. - A key reference for students and engineers in materials science and engineering, accompanied by examination questions and selected solutions.

Download or read book Sintered Ag Die Attach as a Solution to Improve Thermal Performance of High Power Modules written by Mohammed S. Mansi and published by . This book was released on 2014 with total page 158 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Fabrication and Mass Transport Analysis of Tape Cast Nano silver High Temperature Solder written by Jared Ray McCoppin and published by . This book was released on 2013 with total page 146 pages. Available in PDF, EPUB and Kindle. Book excerpt: The principal objective in this research was to develop a die attach method to facilitate the use of wide band gap semiconductors in high-temperature environments, and study fundamental mass transport in nano-initiated die attach microstructure at high temperature. Low temperature sintering silver-nano-pastes have been demonstrated as an effective method for die attach by other groups. Fabrication and optimization of the die attach method in this work was accomplished via tape casting. A novel binder system and a bimodal particle distribution were utilized. The tape casting method allowed die attach materials to be pre-stressed. Fundamental understanding of creep deformation process and creep analysis of the resulting silver microstructure was investigated for isothermal stability over extended time. The binder system played a significant role on the level of residual char left within the sintered microstructure. Of the binders investigated, polypropylene carbonate (PPC) resulted in the smallest amount of char residue at 0.6%. Decreasing the organic concentration of PPC resulted in a tradeoff of lower green strength with increased shear strength. Tapes formulated with 10wt.% of PPC binder resulted in viable tapes having approximately 54MPa's of shear strength. Bimodal distribution of nanopowder with micron powder reduced the need for nanopowder by 70%. Micron powder (1-3um) resulted in comparable shear strengths with the nanotapes. Shear strength decreased as particle size was increased above 5um. Pre-stressing allowed for the decoupling of die-material fabrication pressure from the assembly pressure. Tapes pre-stressed to 212MPa showed a significant improvement in green microstructure and shear strength over un-stressed tapes. Relaxation during isothermal annealing of curved bimorph strips monitored by laser beam deflection was used to measure changes in stress and showed a logarithmic decay over time. Thermal cycling of the bimorph strips indicated the material exhibited the Bauschinger effect. In this work, low temperature sintering with silver nanotape has been demonstrated as an effective method to attach a bare die. Optimization of the tape by means of binder, organic concentration, bimodal dispersion, and pre-stressing resulted in a state of the art method capable of shear strengths greater than 60MPa's. Post sintering, the microstructure exhibited recrystallization and grain growth due to surface diffusion over prolonged thermal exposure. According to this work, die attach of purely nano-silver forms an effective bond at low temperatures but prolonged thermal exposure at high temperatures results in creep and abnormal grain growth.

Download or read book Performance and Reliability of Bonded Interfaces for High Temperature Packaging written by and published by . This book was released on 2017 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: The presentation focuses on mechanical characterization, reliability evaluation and thermomechanical modeling of sintered silver bonded interface material. Two types of sintered silver material are being investigated in this study - first one based on nanosilver particles and the other one comprising of a mixture of nanosilver particles and micron-sized silver flakes. Shear stress results obtained as a function of displacement rates and ambient temperature are reported. Also, scanning acoustic microscopy images of samples for accelerated testing and thermomechanical modeling results are presented.