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Book 3D TCAD Simulation for CMOS Nanoeletronic Devices

Download or read book 3D TCAD Simulation for CMOS Nanoeletronic Devices written by Yung-Chun Wu and published by Springer. This book was released on 2017-06-19 with total page 337 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book demonstrates how to use the Synopsys Sentaurus TCAD 2014 version for the design and simulation of 3D CMOS (complementary metal–oxide–semiconductor) semiconductor nanoelectronic devices, while also providing selected source codes (Technology Computer-Aided Design, TCAD). Instead of the built-in examples of Sentaurus TCAD 2014, the practical cases presented here, based on years of teaching and research experience, are used to interpret and analyze simulation results of the physical and electrical properties of designed 3D CMOSFET (metal–oxide–semiconductor field-effect transistor) nanoelectronic devices. The book also addresses in detail the fundamental theory of advanced semiconductor device design for the further simulation and analysis of electric and physical properties of semiconductor devices. The design and simulation technologies for nano-semiconductor devices explored here are more practical in nature and representative of the semiconductor industry, and as such can promote the development of pioneering semiconductor devices, semiconductor device physics, and more practically-oriented approaches to teaching and learning semiconductor engineering. The book can be used for graduate and senior undergraduate students alike, while also offering a reference guide for engineers and experts in the semiconductor industry. Readers are expected to have some preliminary knowledge of the field.

Book Wafer Bonding

    Book Details:
  • Author : Marin Alexe
  • Publisher : Springer Science & Business Media
  • Release : 2004-05-14
  • ISBN : 9783540210498
  • Pages : 524 pages

Download or read book Wafer Bonding written by Marin Alexe and published by Springer Science & Business Media. This book was released on 2004-05-14 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt: During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Book Smaller Satellites  Bigger Business

Download or read book Smaller Satellites Bigger Business written by Michael J Rycroft and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 610 pages. Available in PDF, EPUB and Kindle. Book excerpt: Y. Fujimori, Symposium Programme Committee Chair, and Faculty Member, International Space University e-mail: [email protected] M.Rycroft, Faculty Member, International Space University e-mail: [email protected] N. Crosby, International Space University e-mail: [email protected] For the sixth annual ISU Symposium the theme was "Smaller Satellites: Bigger Business? Concepts, Applications and Markets for Micro/Nanosatellites in a New Information World". Thus, the Symposium addressed the crucial question: are small satellites the saviour of space programmes around the world It did this from the unique perspective of the International Space today? University - the interdisciplinary, international and intercultural perspective. This Symposium brought together a variety of people working on small satellites - engineers, scientists, planners, providers, operators, policy makers and business executives, together with representatives from regulatory bodies, from national and international organizations, and from the finance sector, and also entrepreneurs. Discussion and debate were encouraged, based on the papers presented and those published here.

Book POWER HVMOS Devices Compact Modeling

Download or read book POWER HVMOS Devices Compact Modeling written by Wladyslaw Grabinski and published by Springer Science & Business Media. This book was released on 2010-07-20 with total page 210 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductor power electronics plays a dominant role due its increased efficiency and high reliability in various domains including the medium and high electrical drives, automotive and aircraft applications, electrical power conversion, etc. Power/HVMOS Devices Compact Modeling will cover very extensive range of topics related to the development and characterization power/high voltage (HV) semiconductor technologies as well as modeling and simulations of the power/HV devices and smart power integrated circuits (ICs). Emphasis is placed on the practical applications of the advanced semiconductor technologies and the device level compact/spice modeling. This book is intended to provide reference information by selected, leading authorities in their domain of expertise. They are representing both academia and industry. All of them have been chosen because of their intimate knowledge of their subjects as well as their ability to present them in an easily understandable manner.

Book The Physics and Fabrication of Microstructures and Microdevices

Download or read book The Physics and Fabrication of Microstructures and Microdevices written by Michael J. Kelly and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 481 pages. Available in PDF, EPUB and Kindle. Book excerpt: les Houches This Winter School on "The Physics and Fabrication of Microstructures" originated with a European industrial decision to investigate in some detail the potential of custom-designed microstructures for new devices. Beginning in 1985, GEC and THOMSON started a collaboration on these subjects, supported by an ESPRIT grant from the Commission of the European Com munity. To the outside observer of the whole field, it appears clear that the world effort is very largely based in the United States and Japan. It also appears that cooperation and dissemination of results are very well organised outside Europe and act as a major influence on the development of new concepts and devices. In Japan, a main research programme of the Research and Development for Basic Technology for Future Industries is focused on "Future Electron Devices". In Japan and in the United States, many workshops are organised annually in order to bring together the major specialists in industry and academia, allowing fast dissemination of advances and contacts for setting up cooperative efforts.

Book Proceedings of the 2nd International Conference on Electronic Engineering and Renewable Energy Systems

Download or read book Proceedings of the 2nd International Conference on Electronic Engineering and Renewable Energy Systems written by Bekkay Hajji and published by Springer Nature. This book was released on 2020-08-14 with total page 858 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book includes papers presented at the Second International Conference on Electronic Engineering and Renewable Energy (ICEERE 2020), which focus on the application of artificial intelligence techniques, emerging technology and the Internet of things in electrical and renewable energy systems, including hybrid systems, micro-grids, networking, smart health applications, smart grid, mechatronics and electric vehicles. It particularly focuses on new renewable energy technologies for agricultural and rural areas to promote the development of the Euro-Mediterranean region. Given its scope, the book is of interest to graduate students, researchers and practicing engineers working in the fields of electronic engineering and renewable energy.

Book DRAM Circuit Design

Download or read book DRAM Circuit Design written by Brent Keeth and published by Wiley-IEEE Press. This book was released on 2001 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt: "DRAM Circuit Design" teaches readers the introductory level design of DRAM memory chips. It focuses on giving readers a reference that can be used to educate students or practicing design engineers in DRAM circuit design.

Book AGARD Conference Proceedings

    Book Details:
  • Author : North Atlantic Treaty Organization. Advisory Group for Aerospace Research and Development
  • Publisher :
  • Release : 1994
  • ISBN : 9789283600046
  • Pages : pages

Download or read book AGARD Conference Proceedings written by North Atlantic Treaty Organization. Advisory Group for Aerospace Research and Development and published by . This book was released on 1994 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Semiconductor Device Reliability

Download or read book Semiconductor Device Reliability written by A. Christou and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 571 pages. Available in PDF, EPUB and Kindle. Book excerpt: This publication is a compilation of papers presented at the Semiconductor Device Reliabi lity Workshop sponsored by the NATO International Scientific Exchange Program. The Workshop was held in Crete, Greece from June 4 to June 9, 1989. The objective of the Workshop was to review and to further explore advances in the field of semiconductor reliability through invited paper presentations and discussions. The technical emphasis was on quality assurance and reliability of optoelectronic and high speed semiconductor devices. The primary support for the meeting was provided by the Scientific Affairs Division of NATO. We are indebted to NATO for their support and to Dr. Craig Sinclair, who admin isters this program. The chapters of this book follow the format and order of the sessions of the meeting. Thirty-six papers were presented and discussed during the five-day Workshop. In addi tion, two panel sessions were held, with audience participation, where the particularly controversial topics of bum-in and reliability modeling and prediction methods were dis cussed. A brief review of these sessions is presented in this book.

Book Physical Limitations of Semiconductor Devices

Download or read book Physical Limitations of Semiconductor Devices written by Vladislav A. Vashchenko and published by Springer Science & Business Media. This book was released on 2008-03-22 with total page 337 pages. Available in PDF, EPUB and Kindle. Book excerpt: Providing an important link between the theoretical knowledge in the field of non-linier physics and practical application problems in microelectronics, the purpose of the book is popularization of the physical approach for reliability assurance. Another unique aspect of the book is the coverage given to the role of local structural defects, their mathematical description, and their impact on the reliability of the semiconductor devices.

Book Biodynamic Excisional Skin Tension Lines for Cutaneous Surgery

Download or read book Biodynamic Excisional Skin Tension Lines for Cutaneous Surgery written by Sharad P. Paul and published by Springer. This book was released on 2018-05-02 with total page 198 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a detailed review of the ‘state-of-the art’ of skin lines in cutaneous surgery. Surgical literature is inundated with references to Langer’s Lines, Cleavage Lines, Wrinkle Lines and Relaxed Skin Tension Lines, but this title discusses the difference between these and incisional and excisional lines biomechanically, introducing the concept of biodynamic excisional skin tension (BEST) Lines. The problem with current concepts of skin tension lines is that they seem to differ in different textbooks, and lines for surgical egress, which work in conditions of low tension, are not necessarily suitable for skin cancer surgery. Biodynamic Excisional Skin Tension Lines for Cutaneous Surgery describes skin biomechanics, the properties of collagen and elastin, lower limb skin vascularity and also maps BEST lines across the body, making it a great reference guide for plastic or dermatologic surgery worldwide. As such, it will be beneficial for anyone performing cutaneous surgery and skin cancer excisions in clinical practice, or for those planning further research into skin biomechanics to read this volume.

Book Micromachined Thin Film Sensors for SOI CMOS Co Integration

Download or read book Micromachined Thin Film Sensors for SOI CMOS Co Integration written by Jean Laconte and published by Springer Science & Business Media. This book was released on 2006-04-11 with total page 316 pages. Available in PDF, EPUB and Kindle. Book excerpt: Co-integration of sensors with their associated electronics on a single silicon chip may provide many significant benefits regarding performance, reliability, miniaturization and process simplicity without significantly increasing the total cost. Micromachined Thin-Film Sensors for SOI-CMOS Co-integration covers the challenges and interests and demonstrates the successful co-integration of gas-flow sensors on dielectric membrane, with their associated electronics, in CMOS-SOI technology. We firstly investigate the extraction of residual stress in thin layers and in their stacking and the release, in post-processing, of a 1 μm-thick robust and flat dielectric multilayered membrane using Tetramethyl Ammonium Hydroxide (TMAH) silicon micromachining solution. The optimization of its selectivity towards aluminum is largely demonstrated. The second part focuses on sensors design and characteristics. A novel loop-shape polysilicon microheater is designed and built in a CMOS-SOI standard process. High thermal uniformity, low power consumption and high working temperature are confirmed by extensive measurements. The additional gas flow sensing layers are judiciously chosen and implemented. Measurements in the presence of a nitrogen flow and gas reveal fair sensitivity on a large flow velocity range as well as good response to many gases. Finally, MOS transistors suspended on released dielectric membranes are presented and fully characterized as a concluding demonstrator of the co-integration in SOI technology.

Book Manual of Digital Earth

Download or read book Manual of Digital Earth written by Huadong Guo and published by Springer Nature. This book was released on 2019-11-18 with total page 846 pages. Available in PDF, EPUB and Kindle. Book excerpt: This open access book offers a summary of the development of Digital Earth over the past twenty years. By reviewing the initial vision of Digital Earth, the evolution of that vision, the relevant key technologies, and the role of Digital Earth in helping people respond to global challenges, this publication reveals how and why Digital Earth is becoming vital for acquiring, processing, analysing and mining the rapidly growing volume of global data sets about the Earth. The main aspects of Digital Earth covered here include: Digital Earth platforms, remote sensing and navigation satellites, processing and visualizing geospatial information, geospatial information infrastructures, big data and cloud computing, transformation and zooming, artificial intelligence, Internet of Things, and social media. Moreover, the book covers in detail the multi-layered/multi-faceted roles of Digital Earth in response to sustainable development goals, climate changes, and mitigating disasters, the applications of Digital Earth (such as digital city and digital heritage), the citizen science in support of Digital Earth, the economic value of Digital Earth, and so on. This book also reviews the regional and national development of Digital Earth around the world, and discusses the role and effect of education and ethics. Lastly, it concludes with a summary of the challenges and forecasts the future trends of Digital Earth. By sharing case studies and a broad range of general and scientific insights into the science and technology of Digital Earth, this book offers an essential introduction for an ever-growing international audience.

Book Radio Frequency Integrated Circuit Engineering

Download or read book Radio Frequency Integrated Circuit Engineering written by Cam Nguyen and published by John Wiley & Sons. This book was released on 2015-03-04 with total page 884 pages. Available in PDF, EPUB and Kindle. Book excerpt: Radio-Frequency Integrated-Circuit Engineering addresses the theory, analysis and design of passive and active RFIC's using Si-based CMOS and Bi-CMOS technologies, and other non-silicon based technologies. The materials covered are self-contained and presented in such detail that allows readers with only undergraduate electrical engineering knowledge in EM, RF, and circuits to understand and design RFICs. Organized into sixteen chapters, blending analog and microwave engineering, Radio-Frequency Integrated-Circuit Engineering emphasizes the microwave engineering approach for RFICs. * Provides essential knowledge in EM and microwave engineering, passive and active RFICs, RFIC analysis and design techniques, and RF systems vital for RFIC students and engineers * Blends analog and microwave engineering approaches for RFIC design at high frequencies * Includes problems at the end of each chapter

Book Creating the Customer Driven Academic Library

Download or read book Creating the Customer Driven Academic Library written by Jeannette Woodward and published by American Library Association. This book was released on 2009 with total page 209 pages. Available in PDF, EPUB and Kindle. Book excerpt: In this book, the author attacks these and other pressing issues facing today's academic librarians. Her trailbrazing strategies centre on keeping the customer's point of view in focus at all times to help you to integrate technology to meet today's student and faculty needs.

Book Fundamentals of Semiconductor Manufacturing and Process Control

Download or read book Fundamentals of Semiconductor Manufacturing and Process Control written by Gary S. May and published by John Wiley & Sons. This book was released on 2006-05-26 with total page 428 pages. Available in PDF, EPUB and Kindle. Book excerpt: A practical guide to semiconductor manufacturing from processcontrol to yield modeling and experimental design Fundamentals of Semiconductor Manufacturing and Process Controlcovers all issues involved in manufacturing microelectronic devicesand circuits, including fabrication sequences, process control,experimental design, process modeling, yield modeling, and CIM/CAMsystems. Readers are introduced to both the theory and practice ofall basic manufacturing concepts. Following an overview of manufacturing and technology, the textexplores process monitoring methods, including those that focus onproduct wafers and those that focus on the equipment used toproduce wafers. Next, the text sets forth some fundamentals ofstatistics and yield modeling, which set the foundation for adetailed discussion of how statistical process control is used toanalyze quality and improve yields. The discussion of statistical experimental design offers readers apowerful approach for systematically varying controllable processconditions and determining their impact on output parameters thatmeasure quality. The authors introduce process modeling concepts,including several advanced process control topics such asrun-by-run, supervisory control, and process and equipmentdiagnosis. Critical coverage includes the following: * Combines process control and semiconductor manufacturing * Unique treatment of system and software technology and managementof overall manufacturing systems * Chapters include case studies, sample problems, and suggestedexercises * Instructor support includes electronic copies of the figures andan instructor's manual Graduate-level students and industrial practitioners will benefitfrom the detailed exami?nation of how electronic materials andsupplies are converted into finished integrated circuits andelectronic products in a high-volume manufacturingenvironment. An Instructor's Manual presenting detailed solutions to all theproblems in the book is available from the Wiley editorialdepartment. An Instructor Support FTP site is also available.

Book Remote Sensing and Image Interpretation

Download or read book Remote Sensing and Image Interpretation written by Thomas M. Lillesand and published by John Wiley & Sons. This book was released on 2004 with total page 838 pages. Available in PDF, EPUB and Kindle. Book excerpt: From recent developments in digital image processing to the next generation of satellite systems, this book provides a comprehensive introduction to the field of remote sensing and image interpretation. This book is discipline neutral, so readers in any field of study can gain a clear understanding of these systems and their virtually unlimited applications. * The authors underscore close interactions among the related areas of remote sensing, GIS, GPS, digital image processing, and environmental modeling. * Appendices include material on sources of remote sensing data and information, remote sensing periodicals, online glossaries, and online tutorials.