Download or read book Materials Modification and Synthesis by Ion Beam Processing written by and published by . This book was released on 1997 with total page 760 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Meeting Abstracts written by Electrochemical Society. Meeting and published by . This book was released on 1997 with total page 1674 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Atomic Layer Deposition for Semiconductors written by Cheol Seong Hwang and published by Springer Science & Business Media. This book was released on 2013-10-18 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.
Download or read book Plasma Catalysis written by Annemie Bogaerts and published by MDPI. This book was released on 2019-04-02 with total page 248 pages. Available in PDF, EPUB and Kindle. Book excerpt: Plasma catalysis is gaining increasing interest for various gas conversion applications, such as CO2 conversion into value-added chemicals and fuels, N2 fixation for the synthesis of NH3 or NOx, methane conversion into higher hydrocarbons or oxygenates. It is also widely used for air pollution control (e.g., VOC remediation). Plasma catalysis allows thermodynamically difficult reactions to proceed at ambient pressure and temperature, due to activation of the gas molecules by energetic electrons created in the plasma. However, plasma is very reactive but not selective, and thus a catalyst is needed to improve the selectivity. In spite of the growing interest in plasma catalysis, the underlying mechanisms of the (possible) synergy between plasma and catalyst are not yet fully understood. Indeed, plasma catalysis is quite complicated, as the plasma will affect the catalyst and vice versa. Moreover, due to the reactive plasma environment, the most suitable catalysts will probably be different from thermal catalysts. More research is needed to better understand the plasma–catalyst interactions, in order to further improve the applications.
Download or read book Materials for Optoelectronics written by Maurice Quillec and published by Springer Science & Business Media. This book was released on 1996-01-31 with total page 404 pages. Available in PDF, EPUB and Kindle. Book excerpt: Optoelectronics ranks one of the highest increasing rates among the different industrial branches. This activity is closely related to devices which are themselves extremely dependent on materials. Indeed, the history of optoelectronic devices has been following closely that of the materials. KLUWER Academic Publishers has thus rightly identified "Materials for Optoelectronics" as a good opportunity for a book in the series entitled "Electronic Materials; Science and Technology". Although a sound background in solid state physics is recommended, the authors have confined their contribution to a graduate student level, and tried to define any concept they use, to render the book as a whole as self-consistent as possible. In the first section the basic aspects are developed. Here, three chapters consider semiconductor materials for optoelectronics under various aspects. Prof. G. E. Stillman begins with an introduction to the field from the point of view of the optoelectronic market. Then he describes how III-V materials, especially the Multi Quantum Structures meet the requirements of optoelectronic functions, including the support of microelectronics for optoelectronic integrated circuits. In chapter 2, Prof.
Download or read book High k Gate Dielectric Materials written by Niladri Pratap Maity and published by CRC Press. This book was released on 2020-12-18 with total page 248 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume explores and addresses the challenges of high-k gate dielectric materials, one of the major concerns in the evolving semiconductor industry and the International Technology Roadmap for Semiconductors (ITRS). The application of high-k gate dielectric materials is a promising strategy that allows further miniaturization of microelectronic components. This book presents a broad review of SiO2 materials, including a brief historical note of Moore’s law, followed by reliability issues of the SiO2 based MOS transistor. It goes on to discuss the transition of gate dielectrics with an EOT ~ 1 nm and a selection of high-k materials. A review of the various deposition techniques of different high-k films is also discussed. High-k dielectrics theories (quantum tunneling effects and interface engineering theory) and applications of different novel MOSFET structures, like tunneling FET, are also covered in this book. The volume also looks at the important issues in the future of CMOS technology and presents an analysis of interface charge densities with the high-k material tantalum pentoxide. The issue of CMOS VLSI technology with the high-k gate dielectric materials is covered as is the advanced MOSFET structure, with its working structure and modeling. This timely volume will prove to be a valuable resource on both the fundamentals and the successful integration of high-k dielectric materials in future IC technology.
Download or read book Physics and Technology of Silicon Carbide Devices written by George Gibbs and published by . This book was released on 2016-10-01 with total page 284 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicon (Si) is by far the most widely used semiconductor material for power devices. On the other hand, Si-based power devices are approaching their material limits, which has provoked a lot of efforts to find alternatives to Si-based power devices for better performance. With the rapid innovations and developments in the semiconductor industry, Silicon Carbide (SiC) power devices have progressed from immature prototypes in laboratories to a viable alternative to Si-based power devices in high-efficiency and high-power density applications. SiC devices have numerous persuasive advantages--high-breakdown voltage, high-operating electric field, high-operating temperature, high-switching frequency and low losses. Silicon Carbide (SiC) devices belong to the so-called wide band gap semiconductor group, which offers a number of attractive characteristics for high voltage power semiconductors when compared to commonly used silicon (Si). Recently, some SiC power devices, for example, Schottky-barrier diodes (SBDs), metal-oxide-semiconductor field-effecttransistors (MOSFETs), junction FETs (JFETs), and their integrated modules have come onto the market. Physics and Technology of Silicon Carbide Devices abundantly describes recent technologies on manufacturing, processing, characterization, modeling, etc. for SiC devices.
Download or read book Fiberglass and Glass Technology written by Frederick T. Wallenberger and published by Springer Science & Business Media. This book was released on 2009-11-27 with total page 479 pages. Available in PDF, EPUB and Kindle. Book excerpt: Fiberglass and Glass Technology: Energy-Friendly Compositions and Applications provides a detailed overview of fiber, float and container glass technology with special emphasis on energy- and environmentally-friendly compositions, applications and manufacturing practices which have recently become available and continue to emerge. Energy-friendly compositions are variants of incumbent fiberglass and glass compositions that are obtained by the reformulation of incumbent compositions to reduce the viscosity and thereby the energy demand. Environmentally-friendly compositions are variants of incumbent fiber, float and container glass compositions that are obtained by the reformulation of incumbent compositions to reduce environmentally harmful emissions from their melts. Energy- and environmentally-friendly compositions are expected to become a key factor in the future for the fiberglass and glass industries. This book consists of two complementary sections: continuous glass fiber technology and soda-lime-silica glass technology. Important topics covered include: o Commercial and experimental compositions and products o Design of energy- and environmentally-friendly compositions o Emerging glass melting technologies including plasma melting o Fiberglass composite design and engineering o Emerging fiberglass applications and markets Fiberglass and Glass Technology: Energy-Friendly Compositions and Applications is written for researchers and engineers seeking a modern understanding of glass technology and the development of future products that are more energy- and environmentally-friendly than current products.
Download or read book Metallopolymer Nanocomposites written by A.D. Pomogailo and published by Springer Science & Business Media. This book was released on 2006-01-27 with total page 577 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents and analyzes the essential data on nanoscale metal clusters dispersed in, or chemically bonded with polymers. Special attention is paid to the in situ synthesis of the nanocomposites, their chemical interactions, and the size and distribution of the particles in the polymer matrix. Numerous novel nanocomposites are described with regard to their mechanical, electrophysical, optical, magnetic, catalytic and biological properties. Their applications, present and future, are outlined.
Download or read book Introduction to Structural Chemistry written by Stepan S. Batsanov and published by Springer Science & Business Media. This book was released on 2012-11-29 with total page 548 pages. Available in PDF, EPUB and Kindle. Book excerpt: A concise description of models and quantitative parameters in structural chemistry and their interrelations, with 280 tables and >3000 references giving the most up-to-date experimental data on energy characteristics of atoms, molecules and crystals (ionisation potentials, electron affinities, bond energies, heats of phase transitions, band and lattice energies), optical properties (refractive index, polarisability), spectroscopic characteristics and geometrical parameters (bond distances and angles, coordination numbers) of substances in gaseous, liquid and solid states, in glasses and melts, for various thermodynamic conditions. Systems of metallic, covalent, ionic and van der Waals radii, effective atomic charges and other empirical and semi-empirical models are critically revised. Special attention is given to new and growing areas: structural studies of solids under high pressures and van der Waals molecules in gases. The book is addressed to researchers, academics, postgraduates and advanced-course students in crystallography, materials science, physical chemistry of solids.
Download or read book Protection of Materials and Structures From the Space Environment written by Jacob Kleiman and published by Springer Science & Business Media. This book was released on 2012-09-22 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: The goals of the 10th International Space Conference on “Protection of Materials and Structures from Space Environment” ICPMSE-10J, since its inception in 1992, have been to facilitate exchanges between members of the various engineering and science disciplines involved in the development of space materials, including aspects of LEO, GEO and Deep Space environments, ground-based qualification, and in-flight experiments and lessons learned from operational vehicles that are closely interrelated to disciplines of the atmospheric sciences, solar-terrestrial interactions and space life sciences. The knowledge of environmental conditions on and around the Moon, Mars, Venus and the low Earth orbit as well as other possible candidates for landing such as asteroids have become an important issue, and protecting both hardware and human life from the effects of space environments has taken on a new meaning in light of the increased interest in space travel and colonization of other planets. And while many material experiments have been carried out on the ground and in open space in the last 50 years (LDEF, MEEP, SARE, MISSE, AOP, DSPSE, ESEM, EURECA, HST, MDIM, MIS, MPID, MPAC and SEED), many questions regarding the environmental impact of space on materials remain either poorly understood or unanswered. The coming generations of scientists will have to continue this work and tackle new challenges, continuing to build the level of confidence humans will need to continue the colonization of space. It is hoped that the proceedings of the ICPMSE-10J presented in this book will constitute a small contribution to doing so.
Download or read book Superconductivity written by R.G. Sharma and published by Springer. This book was released on 2015-02-26 with total page 427 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the basics and applications of superconducting magnets. It explains the phenomenon of superconductivity, theories of superconductivity, type II superconductors and high-temperature cuprate superconductors. The main focus of the book is on the application to superconducting magnets to accelerators and fusion reactors and other applications of superconducting magnets. The thermal and electromagnetic stability criteria of the conductors and the present status of the fabrication techniques for future magnet applications are addressed. The book is based on the long experience of the author in studying superconducting materials, building magnets and numerous lectures delivered to scholars. A researcher and graduate student will enjoy reading the book to learn various aspects of magnet applications of superconductivity. The book provides the knowledge in the field of applied superconductivity in a comprehensive way.
Download or read book Copper Interconnect Technology written by Tapan Gupta and published by Springer Science & Business Media. This book was released on 2010-01-22 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.
Download or read book High Dielectric Constant Materials written by Howard Huff and published by Springer Science & Business Media. This book was released on 2005 with total page 740 pages. Available in PDF, EPUB and Kindle. Book excerpt: Issues relating to the high-K gate dielectric are among the greatest challenges for the evolving International Technology Roadmap for Semiconductors (ITRS). More than just an historical overview, this book will assess previous and present approaches related to scaling the gate dielectric and their impact, along with the creative directions and forthcoming challenges that will define the future of gate dielectric scaling technology. Topics include: an extensive review of Moore's Law, the classical regime for SiO2 gate dielectrics; the transition to silicon oxynitride gate dielectrics; the transition to high-K gate dielectrics (including the drive towards equivalent oxide thickness in the single-digit nanometer regime); and future directions and issues for ultimate technology generation scaling. The vision, wisdom, and experience of the team of authors will make this book a timely, relevant, and interesting, resource focusing on fundamentals of the 45 nm Technology Generation and beyond.
Download or read book Fuel Cells I written by Günther G. Scherer and published by Springer Science & Business Media. This book was released on 2008-09-11 with total page 279 pages. Available in PDF, EPUB and Kindle. Book excerpt: See table of contents
Download or read book Advanced Ceramics and Composites written by Rainer Gadow and published by expert verlag. This book was released on 2000 with total page 362 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book The Science and Engineering of Microelectronic Fabrication written by Stephen A. Campbell and published by Oxford University Press, USA. This book was released on 1996 with total page 572 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Science and Engineering of Microelectronic Fabrication provides an introduction to microelectronic processing. Geared towards a wide audience, it may be used as a textbook for both first year graduate and upper level undergraduate courses and as a handy reference for professionals. The text covers all the basic unit processes used to fabricate integrated circuits including photolithography, plasma and reactive ion etching, ion implantation, diffusion, oxidation, evaporation, vapor phase epitaxial growth, sputtering and chemical vapor deposition. Advanced processing topics such as rapid thermal processing, nonoptical lithography, molecular beam epitaxy, and metal organic chemical vapor deposition are also presented. The physics and chemistry of each process is introduced along with descriptions of the equipment used for the manufacturing of integrated circuits. The text also discusses the integration of these processes into common technologies such as CMOS, double poly bipolar, and GaAs MESFETs. Complexity/performance tradeoffs are evaluated along with a description of the current state-of-the-art devices. Each chapter includes sample problems with solutions. The book also makes use of the process simulation package SUPREM to demonstrate impurity profiles of practical interest.