Download or read book Enhanced Cooling Techniques for Electronics Applications written by American Society of Mechanical Engineers. Winter Annual Meeting and published by . This book was released on 1993 with total page 158 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electronics Cooling written by S. M. Sohel Murshed and published by BoD – Books on Demand. This book was released on 2016-06-15 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.
Download or read book Thermal Management for Opto electronics Packaging and Applications written by Xiaobing Luo and published by John Wiley & Sons. This book was released on 2024-08-12 with total page 373 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal Management for Opto-electronics Packaging and Applications A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.
Download or read book Advanced Cooling Technologies and Applications written by S. M. Sohel Murshed and published by BoD – Books on Demand. This book was released on 2019-01-30 with total page 154 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since conventional cooling techniques are increasing falling short of meeting the ever-growing cooling demands of high heat generating devices, thermal systems, and processes, advanced and innovative cooling technologies are of immense importance to deal with such high thermal management. Hence, this book covers a number of key topics related to advanced cooling approaches, their performance, and applications, including: Evaporative air cooling; Spray impingement cooling; Heat pump-based cooling; Modular cooling for photovoltaic plant; Nucleate pool boiling of refrigerants; Transient flashing spray cooling and application; Compressor cooling systems for industry. The book is aimed at a wide variety of people from graduate students and researchers to manufacturers who are involved or interested in the areas of thermal management systems, cooling technologies, and their applications.
Download or read book Cooling Techniques for Electronic Equipment written by Dave S. Steinberg and published by Wiley-Interscience. This book was released on 1991-10-22 with total page 518 pages. Available in PDF, EPUB and Kindle. Book excerpt: Details infallible techniques for designing electronic hardware to withstand severe thermal environments. Using both SI and English units throughout, it presents methods for the development of various reliable electronic systems without the need of high-speed computers. It also offers mathematical modeling applications, using analog resistor networks, to provide the breakup of complex systems into numerous individual thermal resistors and nodes for those who prefer high-speed digital computer solutions to thermal problems.
Download or read book Advanced Flip Chip Packaging written by Ho-Ming Tong and published by Springer Science & Business Media. This book was released on 2013-03-20 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Download or read book Advanced Materials for Thermal Management of Electronic Packaging written by Xingcun Colin Tong and published by Springer Science & Business Media. This book was released on 2011-01-05 with total page 633 pages. Available in PDF, EPUB and Kindle. Book excerpt: The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Download or read book High Temperature Electronics written by F. Patrick McCluskey and published by CRC Press. This book was released on 1996-12-13 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Download or read book Heat Pipes written by David Reay and published by Butterworth-Heinemann. This book was released on 2013-10-01 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heat Pipes, Sixth Edition, takes a highly practical approach to the design and selection of heat pipes, making it an essential guide for practicing engineers and an ideal text for postgraduate students.This new edition has been revised to include new information on the underlying theory of heat pipes and heat transfer, and features fully updated applications, new data sections, and updated chapters on design and electronics cooling. The book is a useful reference for those with experience and an accessible introduction for those approaching the topic for the first time. - Contains all information required to design and manufacture a heat pipe - Suitable for use as a professional reference and graduate text - Revised with greater coverage of key electronic cooling applications
Download or read book The Role of Exergy in Energy and the Environment written by Sandro Nižetić and published by Springer. This book was released on 2018-07-30 with total page 889 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is devoted to the analysis and applications of energy, exergy, and environmental issues in all sectors of the economy, including industrial processes, transportation, buildings, and services. Energy sources and technologies considered are hydrocarbons, wind and solar energy, fuel cells, as well as thermal and electrical storage. This book provides theoretical insights, along with state-of-the-art case studies and examples and will appeal to the academic community, but also to energy and environmental professionals and decision makers.
Download or read book Advances in Heat Transfer written by and published by Elsevier. This book was released on 2024-10-05 with total page 314 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Heat Transfer, Volume 58 presents the latest in a serial that highlights new advances in the field, with this updated volume presenting interesting chapters written by an international board of authors. Sample chapters in this new release include Nanoscale Thin Film Evaporation and Ice thermal energy storage modeling: A review. - Provides the authority and expertise of leading contributors from an international board of authors - Presents the latest release in Advances in Heat Transfer serials
Download or read book Applications of Heat Mass and Fluid Boundary Layers written by R. O. Fagbenle and published by Woodhead Publishing. This book was released on 2020-01-27 with total page 530 pages. Available in PDF, EPUB and Kindle. Book excerpt: Applications of Heat, Mass and Fluid Boundary Layers brings together the latest research on boundary layers where there has been remarkable advancements in recent years. This book highlights relevant concepts and solutions to energy issues and environmental sustainability by combining fundamental theory on boundary layers with real-world industrial applications from, among others, the thermal, nuclear and chemical industries. The book's editors and their team of expert contributors discuss many core themes, including advanced heat transfer fluids and boundary layer analysis, physics of fluid motion and viscous flow, thermodynamics and transport phenomena, alongside key methods of analysis such as the Merk-Chao-Fagbenle method. This book's multidisciplinary coverage will give engineers, scientists, researchers and graduate students in the areas of heat, mass, fluid flow and transfer a thorough understanding of the technicalities, methods and applications of boundary layers, with a unified approach to energy, climate change and a sustainable future.
Download or read book Complete PCB Design Using OrCad Capture and Layout written by Kraig Mitzner and published by Elsevier. This book was released on 2011-04-01 with total page 529 pages. Available in PDF, EPUB and Kindle. Book excerpt: Complete PCB Design Using OrCad Capture and Layout provides instruction on how to use the OrCAD design suite to design and manufacture printed circuit boards. The book is written for both students and practicing engineers who need a quick tutorial on how to use the software and who need in-depth knowledge of the capabilities and limitations of the software package. There are two goals the book aims to reach: The primary goal is to show the reader how to design a PCB using OrCAD Capture and OrCAD Layout. Capture is used to build the schematic diagram of the circuit, and Layout is used to design the circuit board so that it can be manufactured. The secondary goal is to show the reader how to add PSpice simulation capabilities to the design, and how to develop custom schematic parts, footprints and PSpice models. Often times separate designs are produced for documentation, simulation and board fabrication. This book shows how to perform all three functions from the same schematic design. This approach saves time and money and ensures continuity between the design and the manufactured product. - Information is presented in the exact order a circuit and PCB are designed - Straightforward, realistic examples present the how and why the designs work, providing a comprehensive toolset for understanding the OrCAD software - Introduction to the IPC, JEDEC, and IEEE standards relating to PCB design - Full-color interior and extensive illustrations allow readers to learn features of the product in the most realistic manner possible
Download or read book Journal of Electronic Packaging written by and published by . This book was released on 2008 with total page 120 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Cooling of Electronic Equipment written by Allan W. Scott and published by Wiley-Interscience. This book was released on 1974 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Handbook of Thermal Management Systems written by Fethi Aloui and published by Elsevier. This book was released on 2023-08-24 with total page 862 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Thermal Management Systems: e-Mobility and Other Energy Applications is a comprehensive reference on the thermal management of key renewable energy sources and other electronic components. With an emphasis on practical applications, the book addresses thermal management systems of batteries, fuel cells, solar panels, electric motors, as well as a range of other electronic devices that are crucial for the development of sustainable transport systems. Chapters provide a basic understanding of the thermodynamics behind the development of a thermal management system, update on Batteries, Fuel Cells, Solar Panels, and Other Electronics, provide a detailed description of components, and discuss fundamentals. Dedicated chapters then systematically examine the heating, cooling, and phase changes of each system, supported by numerical analyses, simulations and experimental data. These chapters include discussion of the latest technologies and methods and practical guidance on their application in real-world system-level projects, as well as case studies from engineering systems that are currently in operation. Finally, next-generation technologies and methods are discussed and considered. - Presents a comprehensive overview of thermal management systems for modern electronic technologies related to energy production, storage and sustainable transportation - Addresses the main bottlenecks in the technology development for future green and sustainable transportation systems - Focuses on the practical aspects and implementation of thermal management systems through industrial case studies, real-world examples, and solutions to key problems
Download or read book Air Cooling Technology for Electronic Equipment written by Sung Jin Kim and published by CRC Press. This book was released on 1996-04-26 with total page 264 pages. Available in PDF, EPUB and Kindle. Book excerpt: Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics. Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling? The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.
