Download or read book Engineered Particulate Systems for Chemical Mechanical Planarization written by G. Bahar Basim and published by LAP Lambert Academic Publishing. This book was released on 2011-01 with total page 124 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical mechanical polishing (CMP) is used in microelectronics industry to planarize and pattern metal and dielectric layers. Decrease in the sizes of the devices and introduction of new materials necessitate improved control of the CMP that can be achieved by studying the slurry chemical and particulate properties. In this study, the impacts of slurry particle size distribution and stability on pad-particle-surface interactions are investigated. Impacts of hard and soft (transient) agglomerates on polishing performance are quantified. To stabilize slurries, repulsive force barriers provided by the self-assembled surfactant structures at the solid/liquid interface are utilized. A major finding of this work is that slurry stabilization has to be achieved by controlling not only the particle-particle interactions, but also the pad- particle-substrate interactions. Effective slurry formulations are developed by studying the frictional forces representative of particle- substrate interactions, while achieving stability by introducing adequate interparticle repulsion. Optimal slurry properties are examined and a slurry design criterion is developed.

Download or read book Formulation of Engineered Particulate Systems for Chemical Mechanical Polishing Applications written by Gul Bahar Basim and published by . This book was released on 2002 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: ABSTRACT: Chemical mechanical polishing (CMP) is widely used in the microelectronics industry to achieve planarization and patterning of metal and dielectric layers for microelectronic device manufacturing. Rapid advances in the microelectronics industry demand a decrease in the sizes of the devices, resulting in the requirement of a very thin layer of material removal with atomically flat and clean surface finish by CMP. Furthermore, new materials, such as copper and polymeric dielectrics, are introduced to build faster microprocessors, which are more vulnerable to defect formation and also demand more complicated chemistries. These trends necessitate improved control of the CMP that can be achieved by studying the slurry chemical and particulate properties to gain better fundamental understanding on the process. In this study, the impacts of slurry particle size distribution and stability on pad-particle-surface interactions during polishing are investigated. One of the main problems in CMP is the scratch or pit formation as a result of the presence of larger size particles in the slurries. Therefore, in this investigation, impacts of hard and soft (transient) agglomerates on polishing performance are quantified in terms of the material removal rate and the quality of the surface finish. It is shown that the presence of both types of agglomerates must be avoided in CMP slurries and robust stabilization schemes are needed to prevent the transient agglomerate formation. To stabilize the CMP slurries at extreme pH and ionic strength environments, under applied shear and normal forces, repulsive force barriers provided by the self-assembled surfactant structures at the solid/liquid interface are utilized. A major finding of this work is that slurry stabilization has to be achieved by controlling not only the particle-particle interactions, but also the pad-particle-substrate interactions. Perfect lubrication of surfaces by surfactants prevented polishing. Thus, effective slurry formulations are developed by studying the frictional forces, which are representative of the particle-substrate interactions, while achieving stability by introducing adequate interparticle repulsion. Finally, optimal slurry particulate properties are examined by analyzing the material removal mechanisms for silica-silica polishing. Based on the reported findings, a slurry design criterion is developed to achieve optimal polishing performance.

Download or read book Nanoparticle Engineering for Chemical Mechanical Planarization written by Ungyu Paik and published by CRC Press. This book was released on 2019-04-15 with total page 203 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progressively becomes perceived less as black art and more as a cutting-edge technology, it is emerging as the technology for achieving higher performance devices. Nanoparticle Engineering for Chemical-Mechanical Planarization explains the physicochemical properties of nanoparticles according to each step in the CMP process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. They present design techniques using polymeric additives to improve CMP performance. The final chapter focuses on novel CMP slurry for the application to memory devices beyond 50nm technology. Most books published on CMP focus on the polishing process, equipment, and cleaning. Even though some of these books may touch on CMP slurries, the methods they cover are confined to conventional slurries and none cover them with the detail required for the development of next-generation devices. With its coverage of fundamental concepts and novel technologies, this book delivers expert insight into CMP for all current and next-generation systems.

Download or read book Chemical Mechanical Planarization IV written by R. L. Opila and published by The Electrochemical Society. This book was released on 2001 with total page 350 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Introduction to Particle Technology written by Martin J. Rhodes and published by John Wiley & Sons. This book was released on 2024-05-16 with total page 501 pages. Available in PDF, EPUB and Kindle. Book excerpt: INTRODUCTION TO PARTICLE TECHNOLOGY A new edition of the indispensable guide to particulates and powders Particle technology concerns the formation, processing and properties of the particles and powders which make up many of the products that surround us. Such products range from the cement and aggregate in the built environment to pharmaceuticals and processed foods. Most of the process industries involve particles, either as essential components such as catalysts or as intermediate or final products, and minerals such as the rare earths that are generally mined and processed in particulate form. Particles can have many beneficial uses but they can also cause harm in the environment and, through inhalation, to the individual. In all cases, the powder properties, particularly particle size, are crucially important. This well-known textbook, now in its 3rd edition, provides an easily-understood introduction to the underlying scientific principles of particle technology, together with examples of how these principles can be used in practical design and operation of industrial processes. Each chapter contains both worked examples and exercises for the student. Based on feedback from students and users of the earlier editions, this revised and expanded text includes introductory chapters on particles as products and on computational methods. The topics have been selected to give coverage of the broad areas of particle technology and include: Characterization (size analysis, surface area) Processing (granulation, fluidization) Particle formation (granulation, crystallisation, tableting, size reduction) Storage and transport (hopper design, pneumatic conveying, standpipes) Separation (filtration, settling, cyclones) Safety (fire and explosion hazards, health hazards) Engineering the properties of particulate systems to achieve desired product performance Discrete element modelling of particulate systems Introduction to Particle Technology, 3rd Edition is essential reading for students of chemical engineering. The text is also recommended reading for students of mechanical engineering, applied chemistry, pharmaceutics, physics, mineral processing, and metallurgy, and is an excellent source for practising engineers and scientists looking to establish a working knowledge of the subject.

Download or read book Mobile Particulate Systems written by E. Guazzelli and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 407 pages. Available in PDF, EPUB and Kindle. Book excerpt: Mobile particulate systems involve the mechanics, flow and transport properties of mixtures of fluids and solids. These systems are intrinsic to the rheology of emulsions and suspensions, flocculation and aggregation, sedimentation and fluidization, flow of granular media, nucleation and growth of small particles, segregation, attrition and solidification processes. Its diversity means that the area has been studied by a number of different disciplines (e.g. chemical or civil engineering, mechanics, hydrodynamics, geophysics, condensed matter and statistical physics, etc.). Mobile Particulate Systems features general, orientational lectures and advanced topics, covering state of the art approaches to the study of suspensions, fluidized beds, sedimentation and granular flows.

Download or read book Slurry Abrasive Particle Agglomeration Experimentation and Modeling for Chemical Mechanical Planarization CMP written by Joy Marie Johnson and published by . This book was released on 2015 with total page 188 pages. Available in PDF, EPUB and Kindle. Book excerpt: A theoretical modeling approach is developed to predict silica-specific instability in chemical-mechanical polishing (CMP) slurries. In CMP, the formation of large agglomerates is of great concern, as these large particles are associated with high defectivity and poor polishing performance. The proposed model describes the complex CMP slurry system as a colloid under high non-linear shear conditions. The model diverges from the classic colloidal models by focusing on the following: reaction limited agglomeration (RLA) bounded by silica-specific modes of transitory bonding, and modified DVLO assumptions to include chemical activation and hydrodynamic agglomerate break-up condition evaluation. In order to build physical intuition and predict key model parameters, fundamental studies and novel metrology of agglomerates is performed.

Download or read book Particulate Systems in Nano and Biotechnologies written by Wolfgang Sigmund and published by CRC Press. This book was released on 2008-12-22 with total page 424 pages. Available in PDF, EPUB and Kindle. Book excerpt: Despite the widespread growth and acceptance of particulate technology, challenges in the design, operation, and manufacturing of these systems still exists. These critical issues must be resolved so that particle technology may continue to serve as a foundation for new nano and biotechnologies. Particulate Systems in Nano- and Biotechnologies pres

Download or read book Advances in Chemical Mechanical Planarization CMP written by Babu Suryadevara and published by Woodhead Publishing. This book was released on 2021-09-10 with total page 650 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP

Download or read book Design and Processing of Particulate Products written by Jim Litster and published by Cambridge University Press. This book was released on 2016-10-20 with total page 343 pages. Available in PDF, EPUB and Kindle. Book excerpt: With this unique and comprehensive text, readers will gain the quantitative tools needed to engineer the particulate processes and products that are ubiquitous in modern life. Covering a series of particle and particulate delivery form design processes, with emphasis on design and operation to control particle attributes, and supported by many worked examples, it is essential reading for students and practitioners. Topics covered include a range of particle design processes such as crystallization and precipitation, granulation, grinding, aerosol processes and spray drying, as well as forms of delivery such as granules, tablets, dry powders, and aerosols. Readers will learn from real-world examples how the primary particle properties and the structure and properties of the delivery form can lead to high performance products, ranging from pharmaceuticals, consumer goods and foods, to specialty chemicals, paints, agricultural chemicals and minerals.

Download or read book Chemical Mechanical Planarization Volume 867 written by A. Kumar and published by . This book was released on 2005-07-19 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt: Technology requirements associated with the progressive scaling of devices for future technology nodes, coupled with the aggressive introduction of new materials, places tremendous demands on chemical-mechanical polishing. The goal of this 2005 book, which is part of a popular series from MRS, is to bring together experts from a broad spectrum of research and technology groups currently working on CMP, to review advances made, and to offer a comprehensive discussion of future challenges that must be overcome. The book shows trends in the development of consumables, process modules, tool designs, process integration, modeling, defect characterization, and metrology. Topics include: planarization processes and applications; consumables -CMP pads and slurries; CMP equipment and metrology; and CMP modeling and simulation.

Download or read book Dynamics of Charged Particulate Systems written by Tarek I. Zohdi and published by Springer Science & Business Media. This book was released on 2012-04-05 with total page 124 pages. Available in PDF, EPUB and Kindle. Book excerpt: The objective of this monograph is to provide a concise introduction to the dynamics of systems comprised of charged small-scale particles. Flowing, small-scale, particles ("particulates'') are ubiquitous in industrial processes and in the natural sciences. Applications include electrostatic copiers, inkjet printers, powder coating machines, etc., and a variety of manufacturing processes. Due to their small-scale size, external electromagnetic fields can be utilized to manipulate and control charged particulates in industrial processes in order to achieve results that are not possible by purely mechanical means alone. A unique feature of small-scale particulate flows is that they exhibit a strong sensitivity to interparticle near-field forces, leading to nonstandard particulate dynamics, agglomeration and cluster formation, which can strongly affect manufactured product quality. This monograph also provides an introduction to the mathematically-related topic of the dynamics of swarms of interacting objects, which has gained the attention of a number of scientific communities. In summary, the following topics are discussed in detail: (1) Dynamics of an individual charged particle, (2) Dynamics of rigid clusters of charged particles, (3) Dynamics of flowing charged particles, (4) Dynamics of charged particle impact with electrified surfaces and (5) An introduction to the mechanistic modeling of swarms. The text can be viewed as a research monograph suitable for use in an upper division undergraduate or first year graduate course geared towards students in the applied sciences, mechanics and mathematics that have an interest in the analysis of particulate materials.

Download or read book Engineering of Submicron Particles written by Jayanta Chakraborty and published by John Wiley & Sons. This book was released on 2019-06-10 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt: Brings together in one place the fundamental theory and models, and the practical aspects of submicron particle engineering This book attempts to resolve the tricky aspects of engineering submicron particles by discussing the fundamental theories of frequently used research tools—both theoretical and experimental. The first part covers the Fundamental Models and includes sections on nucleation, growth, inter-molecular and inter-particle forces, colloidal stability, and kinetics. The second part examines the Modelling of a Suspension and features chapters on fundamental concepts of particulate systems, writing the number balance, modelling systems with particle breakage and aggregation, and Monte Carlo simulation. The book also offers plenty of diagrams, software, examples, brief experimental demonstrations, and exercises with answers. Engineering of Submicron Particles: Fundamental Concepts and Models offers a lengthy discussion of classical nucleation theory, and introduces other nucleation mechanisms like organizer mechanisms. It also looks at older growth models like diffusion controlled or surface nucleation controlled growth, along with new generation models like connected net analysis. Aggregation models and inter-particle potentials are touched upon in a prelude on intermolecular and surface forces. The book also provides analytical and numerical solutions of population balance models so readers can solve basic population balance equations independently. Presents the fundamental theory, practical aspects, and models of submicron particle engineering Teaches readers to write number balances for their own system of interest Provides software with open code for solution of population balance model through discretization Filled with diagrams, examples, demonstrations, and exercises Engineering of Submicron Particles: Fundamental Concepts and Models will appeal to researchers in chemical engineering, physics, chemistry, engineering, and mathematics concerned with particulate systems. It is also a good text for advanced students taking particle technology courses.

Download or read book Proceedings of the First International Symposium on Chemical Mechanical Planarization written by Iqbal Ali and published by The Electrochemical Society. This book was released on 1997 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Introduction to Particle Technology written by Martin J. Rhodes and published by John Wiley & Sons. This book was released on 2013-03-25 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: Particle technology is a term used to refer to the science and technology related to the handling and processing of particles and powders. The production of particulate materials, with controlled properties tailored to subsequent processing and applications, is of major interest to a wide range of industries, including chemical and process, food, pharmaceuticals, minerals and metals companies and the handling of particles in gas and liquid solutions is a key technological step in chemical engineering. This textbook provides an excellent introduction to particle technology with worked examples and exercises. Based on feedback from students and practitioners worldwide, it has been newly edited and contains new chapters on slurry transport, colloids and fine particles, size enlargement and the health effects of fine powders. Topics covered include: Characterization (Size Analysis) Processing (Granulation, Fluidization) Particle Formation (Granulation, Size Reduction) Storage and Transport (Hopper Design, Pneumatic Conveying, Standpipes, Slurry Flow) Separation (Filtration, Settling, Cyclones) Safety (Fire and Explosion Hazards, Health Hazards) Engineering the Properties of Particulate Systems (Colloids, Respirable Drugs, Slurry Rheology) This book is essential reading for undergraduate students of chemical engineering on particle technology courses. It is also valuable supplementary reading for students in other branches of engineering, applied chemistry, physics, pharmaceutics, mineral processing and metallurgy. Practitioners in industries in which powders are handled and processed may find it a useful starting point for gaining an understanding of the behavior of particles and powders. Review of the First Edition taken from High Temperatures - High pressures 1999 31 243 – 251 "..This is a modern textbook that presents clear-cut knowledge. It can be successfully used both for teaching particle technology at universities and for individual study of engineering problems in powder processing."

Download or read book Advances in CMP Polishing Technologies written by Toshiro Doi and published by William Andrew. This book was released on 2011-12-06 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt: CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan

Download or read book Processing of Particulate Solids written by J.P. Seville and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 384 pages. Available in PDF, EPUB and Kindle. Book excerpt: Over half of the products of the chemical and process industries are sold in a particulate form. The range of such products is vast: from agrochemicals to pigments, from detergents to foods, from plastics to pharmaceuticals. However, surveys of the performance of processes designed to produce particulate products have consistently shown inadequate design and poor reliability. `Particle technology' is a new subject facing new challenges. Chemical and process engineering is becoming less concerned with the design of plants to produce generic simple chemicals (which are often single phase fluids) and is now more concerned with speciality `effect' chemicals which may often be in particulate form. Chemical and process engineers are also being recruited in increasing numbers into areas outside their tranditional fields, such as the food industry, pharmaceuticals and the manufacture of a wide variety of consumer products. This book has been written to meet their needs. It provides comprehensive coverage of the technology of particulate solids, in a form which is both accessible and concise enough to be useful to engineering and science students in the final year of an undergraduate degree, and at Master's level. Although it was written with students of chemical engineering in mind, it will also be of use and interest to students of other disciplines. It comprises an account of the fundamentals of teh subject, illustrated by worked examples, and followed by a wide range of selected applications.