Download or read book Encapsulation of Electronic Devices and Components written by Edward R. Salmon and published by CRC Press. This book was released on 1986-10-31 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Encapsulation Technologies for Electronic Applications written by Haleh Ardebili and published by William Andrew. This book was released on 2018-10-23 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. - Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics - Includes coverage of environmentally friendly 'green encapsulants' - Presents coverage of faults and defects, and how to analyze and avoid them
Download or read book Flexible Electronic Packaging and Encapsulation Technology written by Hong Meng and published by John Wiley & Sons. This book was released on 2024-03-25 with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt: Flexible Electronic Packaging and Encapsulation Technology A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposes Guidelines for designing high-performance packaging materials with novel structures An authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.
Download or read book Encapsulation of Electronic Components for a Retinal Prosthesis written by Michael Evans and published by . This book was released on 2000 with total page 73 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Electronic Circuit Packaging written by Lawrence L. Rosine and published by Springer. This book was released on 2013-12-01 with total page 303 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electronic Components written by Morris A. Colwell and published by Elsevier. This book was released on 2016-02-09 with total page 113 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic Components provides a basic grounding in the practical aspects of using and selecting electronics components. The book describes the basic requirements needed to start practical work on electronic equipment, resistors and potentiometers, capacitance, and inductors and transformers. The text discusses semiconductor devices such as diodes, thyristors and triacs, transistors and heat sinks, logic and linear integrated circuits (I.C.s) and electromechanical devices. Common abbreviations applied to components are provided. Constructors and electronics engineers will find the book useful.
Download or read book Flexible Electronic Packaging and EncapsulationTechnology written by Wei Huang and published by John Wiley & Sons. This book was released on 2024-06-04 with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt: A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposes Guidelines for designing high-performance packaging materials with novel structures An authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.
Download or read book Solution Processable Components for Organic Electronic Devices written by Beata Luszczynska and published by John Wiley & Sons. This book was released on 2019-06-11 with total page 688 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides first-hand insights into advanced fabrication techniques for solution processable organic electronics materials and devices The field of printable organic electronics has emerged as a technology which plays a major role in materials science research and development. Printable organic electronics soon compete with, and for specific applications can even outpace, conventional semiconductor devices in terms of performance, cost, and versatility. Printing techniques allow for large-scale fabrication of organic electronic components and functional devices for use as wearable electronics, health-care sensors, Internet of Things, monitoring of environment pollution and many others, yet-to-be-conceived applications. The first part of Solution-Processable Components for Organic Electronic Devices covers the synthesis of: soluble conjugated polymers; solution-processable nanoparticles of inorganic semiconductors; high-k nanoparticles by means of controlled radical polymerization; advanced blending techniques yielding novel materials with extraordinary properties. The book also discusses photogeneration of charge carriers in nanostructured bulk heterojunctions and charge carrier transport in multicomponent materials such as composites and nanocomposites as well as photovoltaic devices modelling. The second part of the book is devoted to organic electronic devices, such as field effect transistors, light emitting diodes, photovoltaics, photodiodes and electronic memory devices which can be produced by solution-based methods, including printing and roll-to-roll manufacturing. The book provides in-depth knowledge for experienced researchers and for those entering the field. It comprises 12 chapters focused on: ? novel organic electronics components synthesis and solution-based processing techniques ? advanced analysis of mechanisms governing charge carrier generation and transport in organic semiconductors and devices ? fabrication techniques and characterization methods of organic electronic devices Providing coverage of the state of the art of organic electronics, Solution-Processable Components for Organic Electronic Devices is an excellent book for materials scientists, applied physicists, engineering scientists, and those working in the electronics industry.
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Download or read book Library of Congress Subject Headings written by Library of Congress. Cataloging Policy and Support Office and published by . This book was released on 2009 with total page 1688 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Library of Congress Subject Headings written by Library of Congress and published by . This book was released on 2012 with total page 1670 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Library of Congress Subject Headings written by Library of Congress. Office for Subject Cataloging Policy and published by . This book was released on 1992 with total page 1330 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book A E written by Library of Congress. Office for Subject Cataloging Policy and published by . This book was released on 1990 with total page 1548 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1969 with total page 1508 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Library of Congress Subject Headings A E written by Library of Congress. Subject Cataloging Division and published by . This book was released on 1989 with total page 1468 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Interfacing Bioelectronics and Biomedical Sensing written by Hung Cao and published by Springer Nature. This book was released on 2020-02-13 with total page 240 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book addresses the fundamental challenges underlying bioelectronics and tissue interface for clinical investigation. Appropriate for biomedical engineers and researchers, the authors cover topics ranging from retinal implants to restore vision, implantable circuits for neural implants, and intravascular electrochemical impedance to detect unstable plaques. In addition to these chapters, the authors also document the approaches and issues of multi-scale physiological assessment and monitoring in both humans and animal models for health monitoring and biological investigations; novel biomaterials such as conductive and biodegradable polymers to be used in biomedical devices; and the optimization of wireless power transfer via inductive coupling for batteryless and wireless implantable medical devices. In addition to engineers and researchers, this book is also an ideal supplementary or reference book for a number of courses in biomedical engineering programs, such as bioinstrumentation, MEMS/BioMEMS, bioelectronics and sensors, and more. Analyzes and discusses the electrode-tissue interfaces for optimization of biomedical devices. Introduces novel biomaterials to be used in next-generation biomedical devices. Discusses high-frequency transducers for biomedical applications.
Download or read book Fabrication and Characterization of Thin film Encapsulation for Organic Electronics written by Namsu Kim and published by . This book was released on 2009 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The rapid development of organic electronics is leading to a number of promising devices in the area of energy sources and conservation (e.g., solar cells and solid-state lighting), while also advancing display technology, sensors, and thin-film transistors. One obstacle to this development is the susceptibility of these devices to water vapor and oxygen, which are well known to cause rapid degradation in many organic electronic devices. In order to guarantee the minimum lifetime needed for various applications, high barrier performance encapsulation materials and structures must be developed and has been the object of much experimental research. However, there is a dearth of comprehensive studies which link the characterization, modeling, and integration of ultra-high barrier films with organic electronics. Such studies are necessary in order to advance the understanding of thin-film encapsulation and to find methodologies which greatly improve its performance.
