Download or read book Electronic Packaging Materials Science written by and published by . This book was released on 1993 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electronic Packaging Materials Science IV written by Ralph Jaccodine and published by Cambridge University Press. This book was released on 2014-06-05 with total page 520 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Download or read book Electronic Packaging Materials Science V Volume 203 written by Edwin D. Lillie and published by . This book was released on 1991-06-07 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Download or read book Multichip Module Technologies and Alternatives The Basics written by Daryl Ann Doane and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 895 pages. Available in PDF, EPUB and Kindle. Book excerpt: Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.
Download or read book Advanced Electronic Packaging Materials Volume 167 written by Andrew T. Barfknecht and published by . This book was released on 1990-04-11 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Download or read book Handbook of Semiconductor Interconnection Technology written by Geraldine Cogin Shwartz and published by CRC Press. This book was released on 1997-11-24 with total page 598 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering materials, processes, equipment, methodologies, characterization techniques, clean room practices, and ways to control contamination-related defects, this work offers up-to-date information on the application of interconnection technology to semiconductors. It offers an integration of technical, patent and industry literature.
Download or read book Energy Research Abstracts written by and published by . This book was released on 1990 with total page 946 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Thermal Stress and Strain in Microelectronics Packaging written by John Lau and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 904 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.
Download or read book Metallized Plastic written by K.L. Mittal and published by CRC Press. This book was released on 1997-11-06 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Integrates the latest findings on metallized plastics and their far-reaching applications by more than 80 recognized experts from North America, Europe, the Middle East, and Asia. Addresses both basic and applied aspects of the subject."
Download or read book Electronics Packaging Forum written by James E. Morris and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1993 with total page 410 pages. Available in PDF, EPUB and Kindle. Book excerpt: Important topics covered include building long-term reliability by increasing polyimide stability, recent discoveries in the field of soldering phenomena relating to fundamental fluid mechanical processes, circuit and electromagnetic solutions to problems of modeling highspeed electrical interconnections, how to use the finite-difference time-domain approach in electromagnetic modeling, and the development of dedicated test chips for package evaluation in varied field conditions.
Download or read book High Temperature Superconductors Volume 156 written by James D. Jorgensen and published by Mrs Proceedings. This book was released on 1989-11-15 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Symposium held April 25-28, 1989, San Diego, California, U.S.A."
Download or read book Interfaces Between Polymers Metals and Ceramics Volume 153 written by Benjamin Michael DeKoven and published by . This book was released on 1989-10-17 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Download or read book Chemistry and Defects in Semiconductor Heterostructures Volume 148 written by Mitsuo Kawabe and published by Mrs Proceedings. This book was released on 1989-11-15 with total page 496 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Download or read book Alloy Phase Stability and Design Volume 186 written by G. Malcolm Stocks and published by Mrs Proceedings. This book was released on 1991 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Download or read book Electronic Packaging Materials Science VII Volume 323 written by Peter Børgesen and published by . This book was released on 1994-03-21 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Download or read book Epitaxial Heterostructures Volume 198 written by Don W. Shaw and published by Mrs Proceedings. This book was released on 1990-11-20 with total page 678 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Download or read book Thin Films Volume 188 written by M. Doerner and published by Cambridge University Press. This book was released on 1990-10-29 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
