Download or read book Electromigration in Metallic Microstructures written by Richard S. Sorbello and published by . This book was released on 1990 with total page 55 pages. Available in PDF, EPUB and Kindle. Book excerpt: Theoretical studies of electromigration in metallic microstructures have been performed in atomic dynamics and electronic aspects of driving forces. A general formulation of electrical conductivity and electromigration in bulk systems, thin films, and other low-dimensional systems has been constructed. Electromigration driving forces can be calculated from consideration of elastic scattering, although it is the inelastic part of the electron scattering that propels the migrating atom. However, non-adiabatic recoil effects play an important role in the atomic migration of light interstitials at lower temperatures. Model calculations for electromigration at grain boundaries, dislocations and surfaces show substantial variation in driving forces as an interface is approached. This variation is caused by the form of the current distribution near an interface and in multiple scattering resonances between an interface and the impurity. Keywords: Electromigration; Quantum mechanics; Thermomigration; Mesoscopic structures; Crystals. (jes).

Download or read book Fundamentals of Electromigration Aware Integrated Circuit Design written by Jens Lienig and published by Springer. This book was released on 2018-02-23 with total page 171 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.

Download or read book Electromigration in Metals written by Paul S. Ho and published by Cambridge University Press. This book was released on 2022-05-12 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.

Download or read book Microforces in Electromigration written by and published by . This book was released on 1993 with total page 53 pages. Available in PDF, EPUB and Kindle. Book excerpt: Theoretical description of electromigration (EM) in metallic microstructures. How EM in a small metallic system is affected by surfaces, interfaces, and extended defects e.g. grain boundaries and dislocations. Electronic aspects of EM and dynamical atom response to current; emphasizing mesoscopic systems. Calculated local transport field in very small structures: near grain boundary or dislocation; and probeability by scanning tunneling microscope. Investigated inelastic scattering effects on electrical conductivity and EM of migrating impurity. Pauli-blocking effects induce nonlinearities in the electron and atom response. Mesoscopic systems show this more strongly than bulk systems because Fermi-distribution can be strongly perturbed in state with current. Investigated impurity heating by electron current, quantummechanical dynamics of interacting atom-lattice-electron system included; found effective temperature as function of time. Net atom flux expressed in terms of effective driving force in Nernst-Einstein relation; in phonon-assisted diffusion of light interstitials driving force can be much smaller than from previous theories. Generalization to non-adiabatic effects on electron screening and direct force for EM. Investigated dynamics in complementary classical diffusion processes; First numerical simulations of atomic level EM. Significant enhancement of light interstitial EM from. Electromigration, Quantum mechanics, Mesoscopic, Transport fields.

Download or read book Proceedings of the Symposium on Electromigration of Metals and First International Symposium on Multilevel Metallization and Packaging written by James R. Lloyd and published by . This book was released on 1985 with total page 214 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Studying the Effect of Cu Microstructure on Electromigration Reliability Using Statistical Simulation written by Matthias Kraatz and published by . This book was released on 2011 with total page 162 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book The Microstructural Mechanism of Electromigration Failure in Narrow Interconnects of A1 Alloys written by Choongun Kim and published by . This book was released on 1993 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Thermal and Electromigration Induced Strain and Microstructure Evolution in Metal Conductor Lines written by Hongqing Zhang and published by ProQuest. This book was released on 2009 with total page 115 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal strains in Al and Cu conductor lines were found to show similar behavior. Rather than forming biaxial strains after heating, compressive strains formed along the line, and tensile strains formed in the other two directions, which was explained by an anisotropic partial relaxation model.

Download or read book Electromigration in ULSI Interconnections written by Cher Ming Tan and published by World Scientific. This book was released on 2010 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electromigration in ULSI Interconnections provides a comprehensive description of the electro migration in integrated circuits. It is intended for both beginner and advanced readers on electro migration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electro migration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electro migration in both Al- and Cu-based Interconnections, in the form of theoretical, experimental and numerical modeling studies. The differences in the electro migration of Al- and Cu-based interconnections and the corresponding underlying physical mechanisms for these differences are explained. The test structures, testing methodology, failure analysis methodology and statistical analysis of the test data for the experimental studies on electro migration are presented in a concise and rigorous manner.Methods of numerical modeling for the interconnect electro migration and their applications to the understanding of electro migration physics are described in detail with the aspects of material properties, interconnection design, and interconnect process parameters on the electro migration performances of interconnects in ULSI further elaborated upon. Finally, the extension of the studies to narrow interconnections is introduced, and future challenges on the study of electro migration are outlined and discussed.

Download or read book Evolving Microstructure written by and published by . This book was released on 1996 with total page 4 pages. Available in PDF, EPUB and Kindle. Book excerpt: We report on a collective body of work wherein we have studied the mass transport phenomena which are likely to be operative during stress driven changes in microstructure arising from electromigration and stress voiding. Our goal is to understand such microstructural evolution leading to failure of the metal lines or interconnects associated with integrated electronic circuits or chips. This work, when complete, will lead to improved electronics performance and reliability and faster product development arising from accurate and predictive models of wearout phenomena. We report on the role of thermal induced strain leading to hole and hillock formation, the influence of grains structure on the reliability of Al- based interconnects, and the observation of counter-current electromigration of Ua in Al grain boundaries.

Download or read book Stability of Microstructure in Metallic Systems written by J. W. Martin and published by Cambridge University Press. This book was released on 1997-03-06 with total page 450 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second edition of this textbook, popular amongst students and faculty alike, investigates the various causes of thermodynamic instability in metallic microstructures. Materials theoretically well designed for a particular application may prove inefficient or even useless unless stable under normal working conditions. The authors examine current experimental and theoretical understanding of the kinetics behind structural change in metals. The entire text has been updated in this new edition, and a completely new chapter on highly metastable alloys has been added. The degree to which kinetic stability of the material outweighs its thermodynamic instability is very important, and dictates the useful working life of the material. If the structure is initially produced to an optimum, such changes will degrade the properties of the material. This comprehensive and well-illustrated text, accompanied by ample references, will allow final year undergraduates, graduate students and research workers to investigate in detail the stability of microstructure in metallic systems.

Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1995 with total page 426 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Electro and Thermo transport in Metals Alloys written by Rolf E. Hummel and published by . This book was released on 1977 with total page 174 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Electromigration and Electronic Device Degradation written by A. Christou and published by Wiley-Interscience. This book was released on 1994 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt: Addresses electromigration failure modes in electronics covering both theory and experiments. Reviews silicon and GaAs technologies. Various rate controlling details are summarized including an investigation of temperature dependence. Concludes with a discussion regarding current status and future plans for electromigration resistant advanced metallization systems for VLSI.

Download or read book Elements of Electromigration written by King-Ning Tu and published by CRC Press. This book was released on 2024-01-19 with total page 162 pages. Available in PDF, EPUB and Kindle. Book excerpt: In this invaluable resource for graduate students and practicing professionals, Tu and Liu provide a comprehensive account of electromigration and give a practical guide on how to manage its effects in microelectronic devices, especially newer devices that make use of 3D architectures. In the era of big data and artificial intelligence, next-generation microelectronic devices for consumers must be smaller, consume less power, cost less, and, most importantly, have higher functionality and reliability than ever before. However, with miniaturization, the average current density increases, and so does the probability of electromigration failure. This book covers all critical elements of electromigration, including basic theory, various failure modes induced by electromigration, methods to prevent failure, and equations for predicting mean-time-to-failure. Furthermore, effects such as stress, Joule heating, current crowding, and oxidation on electromigration are covered, and the new and modified mean-time-to-failure equations based on low entropy production are given. Readers will be able to apply this information to the design and application of microelectronic devices to minimize the risk of electromigration-induced failure in microelectronic devices. This book essential for anyone who wants to understand these critical elements and minimize their effects. It is particularly valuable for both graduate students of electrical engineering and materials science engineering and engineers working in the semiconductor and electronic packaging technology industries.

Download or read book Electromigration in Thin Films and Electronic Devices written by Choong-Un Kim and published by Elsevier. This book was released on 2011-08-28 with total page 353 pages. Available in PDF, EPUB and Kindle. Book excerpt: Understanding and limiting electromigration in thin films is essential to the continued development of advanced copper interconnects for integrated circuits. Electromigration in thin films and electronic devices provides an up-to-date review of key topics in this commercially important area.Part one consists of three introductory chapters, covering modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation and x-ray microbeam studies of electromigration. Part two deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure. Finally, part three covers electromigration in solder, with chapters discussing topics such as electromigration-induced microstructural evolution and electromigration in flip-chip solder joints.With its distinguished editor and international team of contributors, Electromigration in thin films and electronic devices is an essential reference for materials scientists and engineers in the microelectronics, packaging and interconnects industries, as well as all those with an academic research interest in the field. - Provides up-to-date coverage of the continued development of advanced copper interconnects for integrated circuits - Comprehensively reviews modelling of electromigration phenomena, modelling electromigration using the peridynamics approach and simulation, and x-ray microbeam studies of electromigration - Deals with electromigration issues in copper interconnects, including x-ray microbeam analysis, voiding, microstructural evolution and electromigration failure

Download or read book Submicrometer Metallization written by Takamaro Kikkawa and published by . This book was released on 1993 with total page 364 pages. Available in PDF, EPUB and Kindle. Book excerpt: