Download or read book Electromagnetic Interference Modeling of Printed Circuit Boards Results and Analysis of Computer Simulation written by and published by . This book was released on 1998 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Electromagnetic Interference Modeling of Printed Circuit Boards Results of Theoretical and Computer Models written by and published by . This book was released on 1998 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book REDUCTION OF ELECTROMAGNETIC I written by Chun-Ming Angus Lee and published by Open Dissertation Press. This book was released on 2017-01-27 with total page 118 pages. Available in PDF, EPUB and Kindle. Book excerpt: This dissertation, "Reduction of Electromagnetic Interference Due to Electric Field Coupling on Printed Circuit Board" by Chun-ming, Angus, Lee, 李俊明, was obtained from The University of Hong Kong (Pokfulam, Hong Kong) and is being sold pursuant to Creative Commons: Attribution 3.0 Hong Kong License. The content of this dissertation has not been altered in any way. We have altered the formatting in order to facilitate the ease of printing and reading of the dissertation. All rights not granted by the above license are retained by the author. Abstract: ABSTRACT The broad applications of power electronic equipment improve the power factor and efficiency of the power converters, but they also generate electromagnetic noise to pollute the environment and the power system network. The development of power filter technology provides an effective solution towards the power frequency harmonics. Through its research, this thesis contributes to the development of high frequency electromagnetic interference (EMI) in switch mode power supply (SMPS). Traditional EMI reduction technologies relies on filtering and shielding, which are generally applied to the product by simple design rules or integrated simulation software. The high voltage switching characteristics of the switch mode power supply and the near field electric coupling between the PCB traces have a significant impact on the final EMI emission of the product. A novel approach technique to reduce such the electric coupling is mandatory. This thesis describes the measurement method used to assess the electric field coupling and the level of significance. The measurement result confirms the contribution of the electric coupling in the overall EMI generated from the SMPS. Extensive experiments verify the effectiveness of EMI reduction techniques. A thorough analysis on the electric field models of the PCB traces concludes the capacitance effect determines a high portion of the EMI generated from the SMPS. Nevertheless, the calculation of capacitance is time consuming. Any alternation in the geometry of the circuit requires the whole system to be re-calculated the whole system. During the experimental stage, a de-coupled field calculation closely resembles the mythesis.doc - iii - capacitance. The index of the electric field coupling is then defined as the "Coupling Index." It comprises the benefits fast calculation and independence of the changes in the PCB geometry. Utilising the "Coupling Index," a computer simulation tool is developed to provide a quantitative comparison on the noise coupling as well as the EMI as a result of electric field coupling. On the whole, the simulation tool combined with artificial intelligence forms an integrated simulation software with automatic trace routing. The software optimises the effects of the electric field coupling between the PCB traces to reduce the EMI generation. In summary, this thesis demonstrates the EMI due to electric field coupling in SMPS and develops an automatic software package to reduce the coupling effect with the aid of artificial software. This contributes to the ultimate PCB auto-routing tools with all EMI parameters taken into consideration. mythesis.doc - iv - DOI: 10.5353/th_b2995770 Subjects: Electromagnetic interference Electronic circuits - Noise

Download or read book Modeling and Design of Electromagnetic Compatibility for High speed Printed Circuit Boards and Packaging written by Xing-Chang Wei and published by CRC Press. This book was released on 2017 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: 7.2.2.1 Modeling of the Graphene Absorber -- 7.2.2.2 Fabrication and Measurement -- 7.2.2.3 Conclusion -- References -- Index

Download or read book Development Validation and Application of Semi Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates written by Renato Rimolo-Donadio and published by Logos Verlag Berlin GmbH. This book was released on 2011 with total page 226 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thesis deals with the development of semi-analytical models for the electrical behavior of vias and traces in chip packages and printed circuit boards. A framework for automated simulation of multilayer structures is also proposed. The validation and evaluation of the models are thoroughly addressed with several test structures and application studies. It is shown that the models can provide good results up to 40 GHz, whereas the numerical efficiency is at least two orders of magnitude higher in comparison to general-purpose numerical methods.

Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1995 with total page 994 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Modeling Strategies for Estimating and Suppressing Electromagnetic Interference and Improving Power Integrity written by Tamar Makharashvili and published by . This book was released on 2019 with total page 100 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Decoupling capacitors are used to suppress high-frequency noise in power distribution networks. The inductance associated with a mounted decoupling capacitor can vary by 26% depending on characteristics of the printed circuit board. Here, simple and accurate inductance models of 2- and 8-terminal capacitors including connections to the power and return plane are developed. Circuit models of the capacitors and layout are created using the partial equivalent element circuit method which provide options for circuit-level simulations as well as analytic estimation of inductance. The circuit solution matches results from the full-wave simulation model within 9% for the 8-terminal capacitor and within 15% the for the 2-terminal capacitor. System-level radiated emissions from a harness are primarily caused by common-mode currents on the harness. An approach is needed to predict system-level emissions early in the design process based on a relatively simple component-level measurements. A prediction technique estimates equivalent common-mode source voltages and impedances based on component-level measurements, which can be used to predict the common-mode current on a harness of arbitrary length or characteristic impedance. Shielding the victim or isolating the noise source can suppress electromagnetic interference. Numerical and analytical methods can accurately estimate shielding effectiveness if the conductivity and permeability of the shielding material is known. A measurement process for obtaining equivalent material properties at low frequencies (from than 0.01-1 MHz) is proposed. Comparison of measured and simulated shielding estimated using material properties found with this process agree within 1.6 dB"--Abstract, page iv.

Download or read book Electromagnetic Bandgap EBG Structures written by Antonio Orlandi and published by John Wiley & Sons. This book was released on 2017-05-31 with total page 237 pages. Available in PDF, EPUB and Kindle. Book excerpt: An essential guide to the background, design, and application of common-mode filtering structures in modern high-speed differential communication links Written by a team of experts in the field, Electromagnetic Bandgap (EBG) Structures explores the practical electromagnetic bandgap based common mode filters for power integrity applications and covers the theoretical and practical design approaches for common mode filtering in high-speed printed circuit boards, especially for boards in high data-rate systems. The authors describe the classic applications of electromagnetic bandgap (EBG) structures and the phenomena of common mode generation in high speed digital boards. The text also explores the fundamental electromagnetic mechanisms of the functioning of planar EBGs and considers the impact of planar EBGs on the digital signal propagation of single ended and differential interconnects routed on top or between EBGs. The authors examine the concept, design, and modeling of EBG common mode filters in their two forms: on-board and removable. They also provide several comparisons between measurement and electromagnetic simulations that validate the proposed EBG filters' design approach. This important resource: • Presents information on planar EBG based common mode filters for high speed differential digital systems • Provides systematic analysis of the fundamental mechanisms of planar EBG structures • Offers detailed design methodology to create EBG filters without the need for repeated full-wave electromagnetic analysis • Demonstrates techniques for use in practical real-world designs Electromagnetic Bandgap (EBG) Structures: Common Mode Filters for High Speed Digital Systems offers an introduction to the background, design, and application of common-mode filtering structures in modern high-speed differential communication links, a critical issue in high-speed and high-performance systems.

Download or read book Controlling Conducted Emissions by Design written by John C. Fluke and published by Springer. This book was released on 1991-01-17 with total page 360 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a useful way to "design in" electromagnetic compatibility (EM C). EMC design considerations are often an addendum to the design. These Band-Aid fixes are not the best approach most of the time but are all that is possible at a late stage in the design and development process. This book is not the classic "EMI fix cookbook"; it is intended for all electronics design engineers. The analytical tools presented enable the designer to address EMC considerations early in the design process. Power conversion engineers will find the enclosed information especially important because of the inherent conducted emissions problems in power conversion equipment. Switching power supplies are commonly the most significant noise generators in electronic systems. In most design work, if the conducted emission problem is addressed, good layout and packaging will ensure that the conducted and radiated electromagnetic interference (EM!) requirements are met. The EMI process involves three components: source, path, and victim. These elements are easily modeled on the computer. The methods of modeling and analysis on the computer are the essence of this book. The EMI source is analyzed using the FFr and the results are applied to a computer model of the path and victim (test setup). The resulting currents are measured and compared to a standard.

Download or read book Simulation and Modeling Techniques for Signal Integrity and Electromagnetic Interference on High Frequency Electronic Systems written by Luca Daniel and published by . This book was released on 2003 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book IBM Journal of Research and Development written by and published by . This book was released on 1993 with total page 764 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Electromagnetic Compatibility Modeling for Integrated Circuits written by Kuan Hsiang Nick Huang and published by Open Dissertation Press. This book was released on 2017-01-27 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: This dissertation, "Electromagnetic Compatibility Modeling for Integrated Circuits" by Kuan Hsiang, Nick, Huang, 黃冠翔, was obtained from The University of Hong Kong (Pokfulam, Hong Kong) and is being sold pursuant to Creative Commons: Attribution 3.0 Hong Kong License. The content of this dissertation has not been altered in any way. We have altered the formatting in order to facilitate the ease of printing and reading of the dissertation. All rights not granted by the above license are retained by the author. Abstract: The integrated circuit (IC) packaging electromagnetic compatibility (EMC)/signal integrity (SI)/power integrity (PI) problems have been broadly attested. But IC packaging electromagnetic interference (EMI) was seldom addressed. Because the electromagnetic emission from IC packagings becomes more critical as the data rate of digital system continues increasing. Its working mechanism and modeling technology are very important. In this thesis, EM emission behaviors of IC packaging are systematically studied for the first time. It was never seen from other literatures. The fundamental principles and properties of electromagnetic radiations caused by heat sinks, vias, traces, and pin maps in IC packaging structures are carefully investigated and modeled. Both theoretical analysis based on first principles and simulated results based on numerical full wave solvers are provided to find out critical impact factors to IC packaging EMI. This work establishes basic modeling components for comprehensive radiation studies. It directly benefits fundamental understandings and guideline development for the optimization of the packaging EMI reduction. Some measurement results are also included to support concluded characterizations and analysis. A summary for IC packaging EMI design rules is discussed in details to conclude the derived design guidelines. Second, a novel data pattern based electromagnetic superposition method is developed to model the IC packaging electromagnetic emission. It employs the equivalence principle to obtain the electromagnetic field response over a broad spectrum. Then it uses the linear property of the passive parasitic system to superimpose the contribution of different signals on the packaging. As a result, with certain pre-calculations, it is convenient to compute the electromagnetic emission efficiently from different signals with various signal pattern combinations, which benefits identifying the worst case scenario. The proposed method can be implemented between different tools for specific purposes. In addition, data reconstruction can be evaluated through the phase shift, and it benefits identifying the EMI of any pulse bit pattern. This work offers great convenience for the post-processing, and allows the flexibility of real digital pulse signals. It provides a basic modeling framework for comprehensive radiation studies for IC packaging and PCB EMI reductions. Third, the performance of IC interconnects has been stretched tremendously in recently years by high speed IC systems. Their EM emission and SI modelings have to consider the existence of I/O active devices, such as buffers and drivers. The I/O model is difficult to obtain due to the IP protection and limited information. We proposed to use the X-parameter to model the IC interconnect system. Based on the PHD formalism, X-parameter models provide an accurate frequency-domain method under large-signal operating points to characterize their nonlinear behaviors. Starting from modeling the CMOS inverter, the whole link modeling primarily based on X-parameter for the pulse digital signals was presented. I/O modeling can also be investigated by the proposed new method to understand the impedance effects at high speed serial links. It is the first complete examination of the X-parameter to IC interconnect SI analysis. The nonlinear I/O property represented by IBIS models is also investigated to model

Download or read book Aspects of Electromagnetic Interference on Printed Circuit Boards written by Marko Radojic̆ić and published by . This book was released on 1990 with total page 214 pages. Available in PDF, EPUB and Kindle. Book excerpt: General guidelines for the design of printed circuit boards have been developed for two important aspects of electromagnetic compatibility: cross-talk and radiated emissions.

Download or read book EMI EMC Computational Modeling Handbook written by Bruce R. Archambeault and published by Springer Science & Business Media. This book was released on 2013-04-17 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt: The application of computational electromagnetics to practical EMI/EMC engineering is an emerging technology. Because of the increased complexity in EMI/EMC issues resulting from advancements in electronics and telecommunications, it is no longer possible to rely exclusively on traditional techniques and tools to solve the growing list of electronic engineering design problems. EMI/EMC Computational Modeling Handbook introduces modeling and simulation of electromagnetics to real-world EMI/EMC engineering. It combines the essentials of electromagnetics, computational techniques, and actual EMI/EMC applications. Included are such popular full-wave computational modeling techniques as the Method of Moments, Finite-Difference Time Domain Technique, Finite Element Method, and several others. The authors have included a myriad of applications for computers, telecommunications, consumer electronics, medical electronics, and military uses. EMI/EMC Computational Modeling Handbook is an invaluable reference work for practicing EMI/EMC engineers, electronic design engineers, and any engineer involved in computational electromagnetics.

Download or read book Models Predicting the Performance of IC Component Or PCB Channel During Electromagnetic Interference written by Chunchun Sui and published by . This book was released on 2015 with total page 84 pages. Available in PDF, EPUB and Kindle. Book excerpt: "This dissertation is composed of three papers, which cover the prediction of the characteristics of jitter due to crosstalk and due to simultaneous switching noise, and covers susceptibility of delay locked loop (DLL) to electromagnetic interference. In the first paper, an improved tail-fit de-convolution method is proposed for characterizing the impact of deterministic jitter in the presence of random jitter. A Wiener filter de-convolution method is also presented for extracting the characteristics of crosstalk induced jitter from measurements of total jitter made when the crosstalk sources were and were not present. The proposed techniques are shown to work well both in simulations and in measurements of a high-speed link. In the second paper, methods are developed to predict the statistical distribution of timing jitter due to dynamic currents drawn by an integrated circuit (IC) and the resulting power supply noise on the PCB. Distribution of dynamic currents is found through vectorless methods. Results demonstrate the approach can rapidly determine the average and standard deviation of the power supply noise voltage and the peak jitter within 5~15% error, which is more than sufficient for predicting the performance impact on integrated circuits. In the third paper, a model is developed to predict the susceptibility of a DLL to electromagnetic noise on the power supply. With the proposed analytical noise transfer function, peak to peak jitter and cycle to cycle jitter at the DLL output can be estimated, which can be use to predict when soft failures will occur and to better understand how to fix these failures. Simulation and measurement results demonstrate the accuracy of the DLL delay model."--Abstract, page iv.

Download or read book International Symposium on Electromagnetic Compatibility written by and published by . This book was released on 1999 with total page 860 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Modelling sic and Analysis of High speed Sources and Serial Links for Signal Integrity written by Siming Pan and published by . This book was released on 2010 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt: "As the computer and electronics industry moves towards higher data rates, signal integrity and electromagnetic interference (EMI) problems always present challenges for designers for high-speed data communication systems. To characterize the entire link path between transmitters and receivers, accurate models for sources, passive link path (such as traces, vias, connectors, etc), and terminations should be built before simulations either in frequency or time domain. Due to the imperfection of model, data corrections are preferred before time-domain simulations to ensure stability. Moreover, data obtained from models should be compared with measurement results to judge the level of agreement for validations. This thesis presents a new approach to model via structures to help design signal link path while maintaining a low insertion loss and minimizing crosstalk, borrowing the concepts from the transmission line theories. For the models of sources, a dipole model is proposed to represent integrated circuit (IC) radiation emissions while a circuit model for I/O current source is proposed for IC conductive emissions. Passivity and causality are two important properties for passive networks. This thesis also presents detailed algorithm to check passivity and causality for networks with arbitrary port numbers. Data corrections in term of passivity and causality enforcement are applied based on matrix perturbation theory. Last but not least, Feature Selective Validation (FSV) technique is expanded in this thesis to quantify the comparisons of data sets and provide quantitative standard for data optimization"--Abstract, leaf iii.