Download or read book 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems EPEPS written by and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems EPEPS written by IEEE Staff and published by . This book was released on 2016-10-23 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: A forum for the latest advances in the electrical design, analysis, modeling, and characterization of interconnections and packaging structures of electronic systems covering all the application families and frequency ranges namely, digital, RF, microwave, and mm wave applications
Download or read book 2008 Ieee epep Electrical Performance of Electronic Packaging written by and published by IEEE. This book was released on 2008 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems written by and published by . This book was released on 2016 with total page 226 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems EPEPS written by and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electrical Performance of Electronic Packaging written by IEEE Microwave Theory and Techniques Society and published by IEEE. This book was released on 1998 with total page 300 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume covers the topics of this meeting, the general topic of which is electrical design, analysis, and characterization of electronic interconnections and packaging structures for performance-driven, high-speed/high complexity electronic systems.
Download or read book 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems EPEPS 2012 written by and published by . This book was released on 2012 with total page 353 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electrical Performance of Electronic Packaging written by and published by . This book was released on 2006 with total page 350 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems EPEPS written by IEEE Staff and published by . This book was released on 2018-10-14 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: A forum for the latest advances in the electrical design, analysis, modeling, and characterization of interconnections and packaging structures of electronic systems covering all the application families and frequency ranges namely, digital, RF, microwave, and mm wave applications
Download or read book IEEE 5th Topical Meeting on Electrical Performance of Electronic Packaging written by IEEE Microwave Theory and Techniques Society and published by IEEE. This book was released on 1996 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the fifth meeting in this topical series. The general subject of this meeting is electrical design, analysis, and characterization of electronic interconnections and packaging structures for performance-driven, high-speed/high complexity electronic systems.
Download or read book 2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems EPEPS written by IEEE Staff and published by . This book was released on 2015-10-25 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high speed designs EPEPS is jointly sponsored by the IEEE Components, Packaging and Manufacturing Technology Society and IEEE Microwave Theory and Techniques Society
Download or read book 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems EPEPS 2014 written by and published by . This book was released on 2014 with total page 245 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems written by and published by . This book was released on 2011 with total page 314 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electrical Performance of Electronic Packaging written by and published by . This book was released on 2007 with total page 367 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electrical Performance of Electronic Packaging written by IEEE Microwave Theory and Techniques Society and published by IEEE. This book was released on 1997-01-01 with total page 264 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume covers the topics of this meeting, the general topic of which is electrical design, analysis, and characterization of electronic interconnections and packaging structures for performance-driven, high-speed/high complexity electronic systems.
Download or read book EPEPS 2010 written by and published by . This book was released on 2010 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electrical Performance of Electronic Packaging written by IEEE Microwave Theory and Techniques Society and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1999 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: This text constitutes proceedings from the Topical Meeting on Electrical Performance of Electronic Packaging, which took place in 1999. Topics covered include system design issues, modelling and power distribution.
