Download or read book Efficient Modeling of Interconnects and Capacitive Discontinuities in High speed Digital Circuits written by Kyung Suk Oh and published by . This book was released on 1995 with total page 270 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Efficient Modeling of Interconnects and Capacitative Discontinuities in High speed Digital Circuits written by Kyung Suk Oh and published by . This book was released on 1995 with total page 135 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the recent advances in high-speed digital circuits, modeling of interconnects and associated discontinuities has gained a considerable interest over the last decade although the theoretical bases for analyzing these structures were well-established as early as the 1960s. Ongoing research at the present time is focused on devising methods which can be applied to more general geometries than the ones considered in earlier days and, at the same time, improving the computational efficiency and accuracy of these methods. In this thesis, numerically efficient methods to compute the transmission line parameters of a multiconductor system and the equivalent capacitances of various strip discontinuities are presented based on the quasi-static approximation. The presented techniques are applicable to conductors embedded in an arbitrary number of dielectric layers with two possible locations of ground planes at the top and bottom of the dielectric layers. The cross-sections of conductors can be arbitrary as long as they can be described with polygons. An integral equation approach in conjunction with the collocation method is used in the presented methods. A closed-form Green's function is derived based on weighted real images thus avoiding nested infinite summations in the exact Green's function; therefore, this closed-form Green's function is numerically more efficient than the exact Green's function. All elements associated with the moment matrix are computed using the closed-form formulas. Various numerical examples are considered to verify the presented methods, and a comparison of the computed results with other published results showed good agreement.
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1995 with total page 602 pages. Available in PDF, EPUB and Kindle. Book excerpt: Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.
Download or read book Electrical Characterization and Circuit Modeling of Interconnections and Packages for High Speed Circuits by Time Domain Measurements written by Jyh-ming Jong and published by . This book was released on 1995 with total page 254 pages. Available in PDF, EPUB and Kindle. Book excerpt: With edge rates of high speed digital devices pushing into the sub-nano second range, interconnections with the associated packages play a major role in determining the speed, size and performance of digital circuits and systems. The purpose of this study is to develop experimental techniques based on time domain peeling algorithms (dynamic deconvolution) for accurate electrical characterization and circuit modeling of general interconnection structures. This thesis describes the basic principles and computational procedure of these time domain peeling algorithms, accompanied by many illustrations and examples of practical interconnection structures in high speed electronic packages. These include general single (isolated) interconnections with nonuniform cross section, general uniformly/ nonuniformly coupled interconnection structures with discontinuities, power/ ground systems with the associated parallel plane structures, resistive lossy interconnections in thin film single and multi-chip modules, and multilayer high-pin-count packages. It is shown that the distributed circuit models consisting of cascaded transmission line sections lead to an accurate evaluation of the time domain response of high speed interconnection structures. These distributed models are synthesized from the time domain reflection and transmission (TDRIT) measurements, and the impedance profiles of the distributed model are extracted by using scattering matrix-based peeling algorithms By direct time domain integration or frequency domain optimization, the distributed circuit model can also be used to construct the lumped element circuit model as well as the proposed hybrid element model consisting of transmission lines and lumped elements. The hybrid model is intended to combine the efficiency of the lumped element model with the accuracy of the distributed circuit model leading to efficient accurate simulation of circuits in general CAD tools. The accuracy of these circuit models is also confirmed by comparing the simulated data with the measured data for the test fixtures on printed circuit boards (PCBs) and chip-to-chip level interconnections. The techniques developed in this thesis can help to assure the signal fidelity of high speed circuits in the early design stage by incorporating interconnect models into integrated circuit design and simulation.
Download or read book High Speed Signaling written by Kyung Suk (Dan) Oh and published by Prentice Hall. This book was released on 2011-10-07 with total page 608 pages. Available in PDF, EPUB and Kindle. Book excerpt: New System-Level Techniques for Optimizing Signal/Power Integrity in High-Speed Interfaces--from Pioneering Innovators at Rambus, Stanford, Berkeley, and MIT As data communication rates accelerate well into the multi-gigahertz range, ensuring signal integrity both on- and off-chip has become crucial. Signal integrity can no longer be addressed solely through improvements in package or board-level design: Diverse engineering teams must work together closely from the earliest design stages to identify the best system-level solutions. In High-Speed Signaling, several of the field’s most respected practitioners and researchers introduce cutting-edge modeling, simulation, and optimization techniques for meeting this challenge. Edited by pioneering experts Drs. Dan Oh and Chuck Yuan, these contributors explain why noise and jitter are no longer separable, demonstrate how to model their increasingly complex interactions, and thoroughly introduce a new simulation methodology for predicting link-level performance with unprecedented accuracy. The authors address signal integrity from architecture through high-volume production, thoroughly discussing design, implementation, and verification. Coverage includes New advances in passive-channel modeling, power-supply noise and jitter modeling, and system margin prediction Methodologies for balancing system voltage and timing budgets to improve system robustness in high-volume manufacturing Practical, stable formulae for converting key network parameters Improved solutions for difficult problems in the broadband modeling of interconnects Equalization techniques for optimizing channel performance Important new insights into the relationships between jitter and clocking topologies New on-chip measurement techniques for in-situ link performance testing Trends and future directions in signal integrity engineering High-Speed Signaling thoroughly introduces new techniques pioneered at Rambus and other leading high-tech companies and universities: approaches that have never before been presented with this much practical detail. It will be invaluable to everyone concerned with signal integrity, including signal and power integrity engineers, high-speed I/O circuit designers, and system-level board design engineers.
Download or read book Compact Models and Measurement Techniques for High Speed Interconnects written by Rohit Sharma and published by Springer Science & Business Media. This book was released on 2012-02-17 with total page 81 pages. Available in PDF, EPUB and Kindle. Book excerpt: Compact Models and Measurement Techniques for High-Speed Interconnects provides detailed analysis of issues related to high-speed interconnects from the perspective of modeling approaches and measurement techniques. Particular focus is laid on the unified approach (variational method combined with the transverse transmission line technique) to develop efficient compact models for planar interconnects. This book will give a qualitative summary of the various reported modeling techniques and approaches and will help researchers and graduate students with deeper insights into interconnect models in particular and interconnect in general. Time domain and frequency domain measurement techniques and simulation methodology are also explained in this book.
Download or read book Design of High speed Communication Circuits written by Ramesh Harjani and published by World Scientific. This book was released on 2006 with total page 233 pages. Available in PDF, EPUB and Kindle. Book excerpt: MOS technology has rapidly become the de facto standard for mixed-signal integrated circuit design due to the high levels of integration possible as device geometries shrink to nanometer scales. The reduction in feature size means that the number of transistor and clock speeds have increased significantly. In fact, current day microprocessors contain hundreds of millions of transistors operating at multiple gigahertz. Furthermore, this reduction in feature size also has a significant impact on mixed-signal circuits. Due to the higher levels of integration, the majority of ASICs possesses some analog components. It has now become nearly mandatory to integrate both analog and digital circuits on the same substrate due to cost and power constraints. This book presents some of the newer problems and opportunities offered by the small device geometries and the high levels of integration that is now possible.The aim of this book is to summarize some of the most critical aspects of high-speed analog/RF communications circuits. Attention is focused on the impact of scaling, substrate noise, data converters, RF and wireless communication circuits and wireline communication circuits, including high-speed I/O.
Download or read book High Speed Digital System Design written by Stephen H. Hall and published by Wiley-IEEE Press. This book was released on 2000-09-08 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: A cutting-edge guide to the theory and practice of high-speed digital system design An understanding of high-speed interconnect phenomena is essential for digital designers who must deal with the challenges posed by the ever-increasing operating speeds of today's microprocessors. This book provides a much-needed, practical guide to the state of the art of modern digital system design, combining easily accessible explanations with immensely useful problem-solving strategies. Written by three leading Intel engineers, High-Speed Digital System Design clarifies difficult and often neglected topics involving the effects of high frequencies on digital buses and presents a variety of proven techniques and application examples. Extensive appendices, formulas, modeling techniques as well as hundreds of figures are also provided. Coverage includes: * A thorough introduction to the digital aspects of basic transmission line theory * Crosstalk and nonideal transmission line effects on signal quality and timings * The impact of packages, vias, and connectors on signal integrity * The effects of nonideal return current paths, high frequency power delivery, and simultaneous switching noise * Explanations of how driving circuit characteristics affect the quality of the digital signal * Digital timing analysis at the system level that incorporates high-speed signaling effects into timing budgets * Methodologies for designing high-speed buses and handling the very large number of variables that affect interconnect performance * Radiated emission problems and how to minimize system noise * The practical aspects of making measurements in high-speed digital systems
Download or read book Engineering Documents Center Index written by University of Illinois at Urbana-Champaign. Engineering Documents Center and published by . This book was released on 1995 with total page 138 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Monthly Catalog of United States Government Publications written by and published by . This book was released on 1996 with total page 936 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Modeling and Simulation of High speed Digital Circuit Interconnections written by Jose Emmanuel Schutt-Aine and published by . This book was released on 1988 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Government Reports Announcements Index written by and published by . This book was released on 1995 with total page 806 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Modeling of high speed digital interconnects written by Emre Tuncer and published by . This book was released on 1992 with total page 104 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Modeling of High Speed Interconnects for Mixed signal Circuits written by Srikanth Surapaneni and published by . This book was released on 2005 with total page 134 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Signal Integrity and Radiated Emission of High Speed Digital Systems written by Spartaco Caniggia and published by John Wiley & Sons. This book was released on 2008-11-20 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: Before putting digital systems for information technology or telecommunication applications on the market, an essential requirement is to perform tests in order to comply with the limits of radiated emission imposed by the standards. This book provides an investigation into signal integrity (SI) and electromagnetic interference (EMI) problems. Topics such as reflections, crosstalk, switching noise and radiated emission (RE) in high-speed digital systems are covered, which are essential for IT and telecoms applications. The highly important topic of modelling is covered which can reduce costs by enabling simulation data to demonstrate that a product meets design specifications and regulatory limits. According to the new European EMC directive, this can help to avoid the expensive use of large semi-anechoic chambers or open area test sites for radiated emission assessments. Following a short introduction to signalling and radiated interference in digital systems, the book provides a detailed characterization of logic families in terms of static and dynamic characteristic useful for modelling techniques. Crosstalk in multi-coupled line structures are investigated by analytical, graphical and circuit-based methods, and techniques to mitigate these phenomena are provided. Grounding, filtering and shielding with multilayer PCBs are also examined and design rules given. Written by authors with extensive experience in industry and academia. Explains basic conceptual problems from a theoretical and practical point of view by using numerous measurements and simulations. Presents models for mathematical and SPICE-like circuit simulators. Provides examples of using full-wave codes for SI and RE investigations. Companion website containing lists of codes and sample material. Signal Integrity and Radiated Emission of High-Speed Digital Systems is a valuable resource to industrial designers of information technology, telecommunication equipment and automation equipment as well as to development engineers. It will also be of interest to managers and designers of consumer electronics, and researchers in electronics.
Download or read book Dissertation Abstracts International written by and published by . This book was released on 1996 with total page 1006 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Time Domain Characterization of Interconnect Discontinuities written by Jyh-ming Jong and published by . This book was released on 1991 with total page 218 pages. Available in PDF, EPUB and Kindle. Book excerpt: The purpose of this study is to develop experimental techniques to characterize typical interconnect discontinuities, including bends, steps, T junctions, vias and pads, which are the most commonly encountered interconnections in high speed digital integrated circuits, hybrid and monolithic microwave circuits and electronic packages. The time domain reflection response of these elements is used to classify the interconnect discontinuities as distributed discontinuity elements or as lumped elements depending upon the reflected waveform. For the cases of general distributed discontinuities including bends, steps and T junctions, the distributed equivalent circuit model is characterized by the time dependent impedance profile which is extracted from the time domain reflection measurements. By using known inverse scattering techniques implemented in terms of a new algorithm based on the transfer scattering matrix method of incremental uniform sections, this nonuniform impedance profile is extracted and is used to construct distributed element circuit models to represent the interconnect discontinuities. A circuit model consisting of lumped/distributed elements, is also developed for the interconnect discontinuities which is intended to combine the accuracy of the distributed model with the simulation efficiency of the lumped models. This hybrid mode reduces computer simulation time when used as a net list for general purpose circuit simulators, such as SPICE. For the case of discontinuities modelled as lumped elements, such as vias and wiring pads, closed form equations based on the transfer scattering matrix solution are derived and used to extract the lumped electrical parameters of these elements from the time domain reflection waveform. All of these lumped, distributed and hybrid models are validated by comparing the time domain simulation results with Time Domain Reflectrometer (TDR) measurements. A procedure for extracting the excess inductances and capacitances associated with the general discontinuities from the synthesized nonuniform impedance profile or the distributed model is also presented in this report. These results for excess lumped inductances and capacitances show close agreement with the published results for these structures which are based on the electromagnetic computation of excess currents and charges and frequency domain measurements. Finally, some typical cases demonstrating the effects of interconnect discontinuities in high speed clocking systems are presented and the procedure for reducing the reflections and transmission noise voltage by chamfering the bends and junctions is described.
