Download or read book Effects of Microstructural Control on the Failure Kinetics and the Reliability Improvement of Al and Al alloy Interconnects written by and published by . This book was released on 1996 with total page 146 pages. Available in PDF, EPUB and Kindle. Book excerpt: The reliability of microelectronic systems is often limited by electromigration failure in Al-based thin-film conducting lines which interconnect devices to form an integrated circuit. Under an applied electric field Al atoms migrate with the electron flow, causing a counterflow of vacancies that accumulate into voids, eventually leading to an open circuit failure. The work reported here is concerned with clarifying the microstructural mechanism of electromigration failure, and with developing a metallurgical method to improve the electromigration resistance of Al-based interconnects. Pure Al, Al-2Cu, and Al-2Cu-1Si lines with quasi-bamboo microstructures are explored as a function of heat treatment conditions and current density. The {open_quotes}weakest{close_quotes} microstructural unit that causes failure is identified by electron microscopy; with rare exceptions, failure occurs at the upstream end of the longest polygranular segment in a given line. This microstructural characteristic of electromigration failure is even observed in lines whose maximum segment lengths are less than a few microns. The time to failure appears to increase exponentially with decreasing longest polygranular segment length. A simple constitutive equation is reported to describe the failure kinetics as a function of the polygranular segment length that leads to failure. Given correct values of the kinetic constants included in the equation, this microstructure-based constitutive relation will provide a way to assess interconnect reliability. An effective metallurgical method that can eliminate relatively long polygranular segments is post-pattern annealing. This heat treatment particularly narrows the distribution of the longest polygranular segment lengths over a large set of lines. As a consequence, the time-to-failure distribution narrows as well, so that the time to first failure increases more substantially than the median time to failure.
Download or read book Effects of Microstructural Control on the Failure Kinetics and the Reliability Improvement of Al and Al alloy Interconnects written by Seung Hyuk Kang and published by . This book was released on 1996 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Chemical Abstracts written by and published by . This book was released on 2002 with total page 2540 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Effect of Microstructure of Aluminum Alloys on the Electromigration limited Reliability of VLSI Interconnects written by Jaeshin Cho and published by . This book was released on 1990 with total page 444 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Effect of Microstructure of Aluminum Alloys on the Electromigration limited Reliability of VLSI Interconnects written by and published by . This book was released on 1990 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: By Jaeshin Cho.
Download or read book American Doctoral Dissertations written by and published by . This book was released on 1996 with total page 872 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Materials Reliability in Microelectronics V Volume 391 written by Anthony S. Oates and published by . This book was released on 1995-10-24 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: This long-standing proceedings series is highly regarded as a premier forum for the discussion of microelectronics reliability issues. In this fifth book, emphasis is on the fundamental understanding of failure phenomena in thin-film materials. Special attention is given to electromigration and mechanical stress effects. The reliability of thin dielectrics and hot carrier degradation of transistors are also featured. Topics include: modeling and simulation of failure mechanisms; reliability issues for submicron IC technologies and packaging; stresses in thin films/lines; gate oxides; barrier layers; electromigration mechanisms; reliability issues for Cu metallizations; electromigration and microstructure; electromigration and stress voiding in circuit interconnects; and resistance measurements of electromigration damage.
Download or read book Microstructural Control in Aluminum Alloys written by E. Henry Chia and published by . This book was released on 1986 with total page 248 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Metals Abstracts written by and published by . This book was released on 1998-04 with total page 1176 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book The Effects of Geometry and Microstructure on the Reliability of Al and Cu Interconnects written by Christine Sung-An Hau-Riege and published by . This book was released on 2000 with total page 314 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book The Effects of Microstructural Features on the Response of Aluminum Alloys to Cyclic Deformation written by Edgar A Starke (Jr) and published by . This book was released on 1978 with total page 16 pages. Available in PDF, EPUB and Kindle. Book excerpt: This program has been designed to isolate and determine the various parameters which control the mechanical behavior during monotonic and cyclic loading of alloys containing various microstructural features developed during the decomposition of 7XXX type aluminum alloys. In addition, limited studies of the stress-corrosion resistance and corrosion-fatigue resistance has been made. The primary goal has been to understand the fundamentals of the deformation processes involved in monotonic and cyclic loading. The results obtained from this study should lead to improvements in the properties of existing alloy systems through control of the microstructure and suggest ways of developing fatigue resistant age-hardenable aluminum alloys. (Author).
Download or read book The Microstructural Mechanism of Electromigration Failure in Narrow Interconnects of A1 Alloys written by Choongun Kim and published by . This book was released on 1993 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electrical Electronics Abstracts written by and published by . This book was released on 1997 with total page 2304 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Effect of Microstructural Variables on the Kinetic Stability of Aluminium and Its Alloys written by Xian Zhou and published by . This book was released on 2014 with total page 178 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microstructure plays a major role in the corrosion of engineering metals and alloys, particularly for aluminium alloys. For any alloy system, microstructure is not well-accounted for when considering electrochemical stability, which is typically described in terms of equilibrium thermodynamics, i.e. Pourbaix diagrams. However, in an engineering context, a likelihood of corrosion as predicted by thermodynamics is not as useful as knowing the kinetic response of reactive metals such as aluminium (i.e. how fast a metal reacts in a certain environment). This work presents a first step towards developing a physical, mechanistic, understanding and representation of kinetic stability for aluminium-based metals, as an engineering alternative to Pourbaix diagrams. The rationale for this is to be able to subsequently compare the impact of 'structural' features, which are not presently considered in equilibrium thermodynamics - however such features are critical to engineering materials. Three key microstructural heterogeneities are studied as model structural variables. This includes: the presence of differing grain boundary density, different number density of precipitates, and varying degrees of crystallinity. To accompany the electrochemical studies, a range of careful specimen preparation and microstructural characterisation has been carried out.
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1994 with total page 892 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book RLE Progress Report written by Massachusetts Institute of Technology. Research Laboratory of Electronics and published by . This book was released on 1985 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Submicrometer Metallization written by Takamaro Kikkawa and published by . This book was released on 1993 with total page 364 pages. Available in PDF, EPUB and Kindle. Book excerpt:
