Download or read book Designer s Handbook of Integrated Circuits written by Arthur Bernard Williams and published by McGraw-Hill Companies. This book was released on 1984 with total page 862 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Variation Aware Design of Custom Integrated Circuits A Hands on Field Guide written by Trent McConaghy and published by Springer Science & Business Media. This book was released on 2012-09-28 with total page 198 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book targets custom IC designers who are encountering variation issues in their designs, especially for modern process nodes at 45nm and below, such as statistical process variations, environmental variations, and layout effects. It teaches them the state-of-the-art in Variation-Aware Design tools, which help the designer to analyze quickly the variation effects, identify the problems, and fix the problems. Furthermore, this book describes the algorithms and algorithm behavior/performance/limitations, which is of use to designers considering these tools, designers using these tools, CAD researchers, and CAD managers.

Download or read book Electronic Designer s Handbook written by Thomas Keith Hemingway and published by . This book was released on 1979 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Digital Integrated Circuits written by John E. Ayers and published by CRC Press. This book was released on 2018-09-03 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt: Exponential improvement in functionality and performance of digital integrated circuits has revolutionized the way we live and work. The continued scaling down of MOS transistors has broadened the scope of use for circuit technology to the point that texts on the topic are generally lacking after a few years. The second edition of Digital Integrated Circuits: Analysis and Design focuses on timeless principles with a modern interdisciplinary view that will serve integrated circuits engineers from all disciplines for years to come. Providing a revised instructional reference for engineers involved with Very Large Scale Integrated Circuit design and fabrication, this book delves into the dramatic advances in the field, including new applications and changes in the physics of operation made possible by relentless miniaturization. This book was conceived in the versatile spirit of the field to bridge a void that had existed between books on transistor electronics and those covering VLSI design and fabrication as a separate topic. Like the first edition, this volume is a crucial link for integrated circuit engineers and those studying the field, supplying the cross-disciplinary connections they require for guidance in more advanced work. For pedagogical reasons, the author uses SPICE level 1 computer simulation models but introduces BSIM models that are indispensable for VLSI design. This enables users to develop a strong and intuitive sense of device and circuit design by drawing direct connections between the hand analysis and the SPICE models. With four new chapters, more than 200 new illustrations, numerous worked examples, case studies, and support provided on a dynamic website, this text significantly expands concepts presented in the first edition.

Download or read book Three Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and published by Newnes. This book was released on 2017-07-04 with total page 768 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization

Download or read book The Designer s Guide to Spice and Spectre written by Ken Kundert and published by Springer Science & Business Media. This book was released on 2006-04-11 with total page 397 pages. Available in PDF, EPUB and Kindle. Book excerpt: Engineering productivity in integrated circuit product design and - velopment today is limited largely by the effectiveness of the CAD tools used. For those domains of product design that are highly dependent on transistor-level circuit design and optimization, such as high-speed logic and memory, mixed-signal analog-digital int- faces, RF functions, power integrated circuits, and so forth, circuit simulation is perhaps the single most important tool. As the complexity and performance of integrated electronic systems has increased with scaling of technology feature size, the capabilities and sophistication of the underlying circuit simulation tools have correspondingly increased. The absolute size of circuits requiring transistor-level simulation has increased dramatically, creating not only problems of computing power resources but also problems of task organization, complexity management, output representation, initial condition setup, and so forth. Also, as circuits of more c- plexity and mixed types of functionality are attacked with simu- tion, the spread between time constants or event time scales within the circuit has tended to become wider, requiring new strategies in simulators to deal with large time constant spreads.

Download or read book Analog Circuit Design written by Bob Dobkin and published by Elsevier. This book was released on 2011-09-26 with total page 960 pages. Available in PDF, EPUB and Kindle. Book excerpt: Analog circuit and system design today is more essential than ever before. With the growth of digital systems, wireless communications, complex industrial and automotive systems, designers are challenged to develop sophisticated analog solutions. This comprehensive source book of circuit design solutions will aid systems designers with elegant and practical design techniques that focus on common circuit design challenges. The book’s in-depth application examples provide insight into circuit design and application solutions that you can apply in today’s demanding designs. Covers the fundamentals of linear/analog circuit and system design to guide engineers with their design challenges Based on the Application Notes of Linear Technology, the foremost designer of high performance analog products, readers will gain practical insights into design techniques and practice Broad range of topics, including power management tutorials, switching regulator design, linear regulator design, data conversion, signal conditioning, and high frequency/RF design Contributors include the leading lights in analog design, Robert Dobkin, Jim Williams and Carl Nelson, among others

Download or read book Digital Integrated Circuit Design written by Hubert Kaeslin and published by Cambridge University Press. This book was released on 2008-04-28 with total page 878 pages. Available in PDF, EPUB and Kindle. Book excerpt: This practical, tool-independent guide to designing digital circuits takes a unique, top-down approach, reflecting the nature of the design process in industry. Starting with architecture design, the book comprehensively explains the why and how of digital circuit design, using the physics designers need to know, and no more.

Download or read book Electronic Circuits written by Ulrich Tietze and published by Springer. This book was released on 2015-12-09 with total page 1543 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic Circuits covers all important aspects and applications of modern analog and digital circuit design. The basics, such as analog and digital circuits, on operational amplifiers, combinatorial and sequential logic and memories, are treated in Part I, while Part II deals with applications. Each chapter offers solutions that enable the reader to understand ready-made circuits or to proceed quickly from an idea to a working circuit, and always illustrated by an example. Analog applications cover such topics as analog computing circuits. The digital sections deal with AD and DA conversion, digital computing circuits, microprocessors and digital filters. This editions contains the basic electronics for mobile communications. The accompanying CD-ROM contains PSPICE software, an analog-circuit-simulation package, plus simulation examples and model libraries related to the book topics.

Download or read book Integrated Circuit Failure Analysis written by Friedrich Beck and published by John Wiley & Sons. This book was released on 1998-02-04 with total page 198 pages. Available in PDF, EPUB and Kindle. Book excerpt: Funktionstests an integrierten Schaltungen sind für deren Zuverlässigkeit von herausragender Bedeutung. Erstmals werden in diesem Werk die speziellen Präparationstechniken für die Fehleranalyse beschrieben. Ausgehend von den theoretischen Grundlagen erläutert der Autor in praxisnahem Stil die verschiedenen Techniken, die das Zurückverfolgen von Ausfällen ermöglichen.

Download or read book Nonlinear Circuits Handbook written by Analog Devices, inc and published by . This book was released on 1974 with total page 550 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Integrated Circuit Hybrid and Multichip Module Package Design Guidelines written by Michael Pecht and published by John Wiley & Sons. This book was released on 1994-03-31 with total page 470 pages. Available in PDF, EPUB and Kindle. Book excerpt: Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals. Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to: * Define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost * Define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data * Identify potential failure modes, sites, mechanisms, and architecture-stress interactions--PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures * Characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved * Use experiment, step-stress, and accelerated methods to ensure optimum design before production begins Detailed design guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. Detailed guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. of related interest... PHYSICAL ARCHITECTURE OF VLSI SYSTEMS --Allan D. Kraus, Robert Hannemann and Michael Pecht For the professional engineer involved in the design and manufacture of products containing electronic components, here is a comprehensive handbook to the theory and methods surrounding the assembly of microelectronic and electronic components. The book focuses on computers and consumer electronic products with internal subsystems that reflect mechanical design constraints, cost limitations, and aesthetic and ergonomic concerns. Taking a total system approach to packaging, the book systematically examines: basic chip and computer architecture; design and layout; interassembly and interconnections; cooling scheme; materials selection, including ceramics, glasses, and metals; stress, vibration, and acoustics; and manufacturing and assembly technology. 1994 (0-471-53299-1) pp. SOLDERING PROCESSES AND EQUIPMENT --Michael G. Pecht This comprehensive, fundamentals first handbook outlines the soldering methods and techniques used in the manufacture of microelectronic chips and electronic circuit boards. In a clear, easy-to-access format, the book discusses: soldering processes and classification; the material dynamics of heat soldering when assembling differing materials; wave and reflow soldering; controlling contamination during manufacturing cleanings; techniques for assuring reliability and quality control during manufacturing; rework, repair, and manual assembly; the modern assembly / repair station; and more. The book also provides clear guidelines on assembly techniques as well as an appendix of various solder equipment manufacturers. 1993 (0-471-59167-X) 312 pp.

Download or read book Fast Techniques for Integrated Circuit Design written by Mikael Sahrling and published by Cambridge University Press. This book was released on 2019-08-15 with total page 257 pages. Available in PDF, EPUB and Kindle. Book excerpt: Learn how to use estimation techniques to solve real-world IC design problems and accelerate design processes with this practical guide.

Download or read book Electronic Design Automation for Integrated Circuits Handbook written by Lou Scheffer and published by . This book was released on 2006 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Integrated Circuit Design for Radiation Environments written by Stephen J. Gaul and published by John Wiley & Sons. This book was released on 2019-12-03 with total page 491 pages. Available in PDF, EPUB and Kindle. Book excerpt: A practical guide to the effects of radiation on semiconductor components of electronic systems, and techniques for the designing, laying out, and testing of hardened integrated circuits This book teaches the fundamentals of radiation environments and their effects on electronic components, as well as how to design, lay out, and test cost-effective hardened semiconductor chips not only for today’s space systems but for commercial terrestrial applications as well. It provides a historical perspective, the fundamental science of radiation, and the basics of semiconductors, as well as radiation-induced failure mechanisms in semiconductor chips. Integrated Circuits Design for Radiation Environments starts by introducing readers to semiconductors and radiation environments (including space, atmospheric, and terrestrial environments) followed by circuit design and layout. The book introduces radiation effects phenomena including single-event effects, total ionizing dose damage and displacement damage) and shows how technological solutions can address both phenomena. Describes the fundamentals of radiation environments and their effects on electronic components Teaches readers how to design, lay out and test cost-effective hardened semiconductor chips for space systems and commercial terrestrial applications Covers natural and man-made radiation environments, space systems and commercial terrestrial applications Provides up-to-date coverage of state-of-the-art of radiation hardening technology in one concise volume Includes questions and answers for the reader to test their knowledge Integrated Circuits Design for Radiation Environments will appeal to researchers and product developers in the semiconductor, space, and defense industries, as well as electronic engineers in the medical field. The book is also helpful for system, layout, process, device, reliability, applications, ESD, latchup and circuit design semiconductor engineers, along with anyone involved in micro-electronics used in harsh environments.

Download or read book Linear IC Applications written by Joseph Carr and published by Newnes. This book was released on 1996-12-19 with total page 366 pages. Available in PDF, EPUB and Kindle. Book excerpt: Linear IC Applications is about practical applications of linear IC circuits. Although most of the circuits are based on the ubiquitous operational amplifier, other devices are examined as well. The material in this book will allow you to design circuits for the applications covered. But more than that, the principles of design for each class of circuit are transferable to other projects that are similar in function, if not in detail. A fiction voiced by the less perceptive observer of the electronics world is that analog electronics, i.e. the domain of linear IC devices, is dead, and that digital electronics is taking over every task. While it is true that digital electronics is growing rapidly, and has already taken over many functions previously performed in analog circuits, that doesn't mean that analog electronics is ready to die. There are still jobs that are either best done in analog circuits, or are more cost- effective when done in analog circuits rather than computers. Many digital instruments, for example, require a relatively extensive analog subsystem in order to work properly. In fact, demand for analog electronics, and for people well versed in it, is increasing. There is a worldwide shortage of skilled personnel. This book addresses that shortfall and equips the reader to apply linear ICs in a wide range of settings. Joseph J. Carr is a prolific writer and working scientist in the field of radar engineering and avionics architecture. He has written over 25 books and regularly contributes to electronics magazines. Another recent Carr title, Linear Integrated Circuits, also published by Newnes, is a perfect companion to this designer's guide, providing as it does a primer and first reference on linear IC technology. Companion to Linear Integrated Circuits by the same author Practical guide for designers Covers op amps and other linear devices

Download or read book Handbook of 3D Integration Volume 1 written by Philip Garrou and published by John Wiley & Sons. This book was released on 2011-09-22 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.