Download or read book Design of Highly Integrated Interface Electronics for Capacitive Micromachined Ultrasonic Transducers written by Prajith Kumar Poongodan and published by . This book was released on 2023 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Interface Engineering of Capacitive Micromachined Ultrasonic Transducers for Medical Applications written by Der-Song Lin and published by Stanford University. This book was released on 2011 with total page 168 pages. Available in PDF, EPUB and Kindle. Book excerpt: Capacitive micromachined ultrasonic transducers (CMUTs), have been widely studied in academia and industry over the last decade. CMUTs provide many benefits over traditional piezoelectric transducers including improvement in performance through wide bandwidth, and ease of electronics integration, with the potential to batch fabricate very large 2D arrays with low-cost and high-yield. Though many aspects of CMUT technology have been studied over the years, packaging the CMUT into a fully practical system has not been thoroughly explored. Two important interfaces of packaging that this thesis explores are device encapsulation (the interface between CMUTs and patients) and full electronic integration of large scale 2D arrays (the interface between CMUTs and electronics). In the first part of the work, I investigate the requirements for the CMUT encapsulation. For medical usage, encapsulation is needed to electrically insulate the device, mechanically protect the device, and maintain transducer performance, especially the access of the ultrasound energy. While hermetic sealing can protect many other MEMS devices, CMUTs require mechanical interaction to a fluid, which makes fulfilling the previous criterion very challenging. The proposed solution is to use a viscoelastic material with the glass-transition-temperature lower than room temperature, such as Polydimethylsiloxane (PDMS), to preserve the CMUT static and dynamic performance. Experimental implementation of the encapsulated imaging CMUT arrays shows the device performance was maintained; 95 % of efficiency, 85% of the maximum output pressure, and 91% of the fractional bandwidth (FBW) can be preserved. A viscoelastic finite element model was also developed and shows the performance effects of the coating can be accurately predicted. Four designs, providing acoustic crosstalk suppression, flexible substrate, lens focusing, and blood flow monitoring using PDMS layer were also demonstrated. The second part of the work, presents contributions towards the electronic integration and packaging of large-area 2-D arrays. A very large 2D array is appealing for it can enable advanced novel imaging applications, such as a reconfigurable array, and a compression plate for breast cancer screening. With these goals in mind, I developed the first large-scale fully populated and integrated 2D CMUTs array with 32 by 192 elements. In this study, I demonstrate a flexible and reliable integration approach by successfully combining a simple UBM preparation technique and a CMUTs-interposer-ASICs sandwich design. The results show high shear strength of the UBM (26.5 g), 100% yield of the interconnections, and excellent CMUT resonance uniformity ([lowercase Sigma] = 0.02 MHz). As demonstrated, this allows for a large-scale assembly of a tile-able array by using an interposer. Interface engineering is crucial towards the development of CMUTs into a practical ultrasound system. With the advances in encapsulation technique with a viscoelastic polymer and the combination of the UBM technique to the TSV fabrication for electronics integration, a fully integrated CMUT system can be realized.
Download or read book Interface Engineering of Capacitive Micromachined Ultrasonic Transducers for Medical Applications written by Der-Song Lin and published by . This book was released on 2011 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Capacitive micromachined ultrasonic transducers (CMUTs), have been widely studied in academia and industry over the last decade. CMUTs provide many benefits over traditional piezoelectric transducers including improvement in performance through wide bandwidth, and ease of electronics integration, with the potential to batch fabricate very large 2D arrays with low-cost and high-yield. Though many aspects of CMUT technology have been studied over the years, packaging the CMUT into a fully practical system has not been thoroughly explored. Two important interfaces of packaging that this thesis explores are device encapsulation (the interface between CMUTs and patients) and full electronic integration of large scale 2D arrays (the interface between CMUTs and electronics). In the first part of the work, I investigate the requirements for the CMUT encapsulation. For medical usage, encapsulation is needed to electrically insulate the device, mechanically protect the device, and maintain transducer performance, especially the access of the ultrasound energy. While hermetic sealing can protect many other MEMS devices, CMUTs require mechanical interaction to a fluid, which makes fulfilling the previous criterion very challenging. The proposed solution is to use a viscoelastic material with the glass-transition-temperature lower than room temperature, such as Polydimethylsiloxane (PDMS), to preserve the CMUT static and dynamic performance. Experimental implementation of the encapsulated imaging CMUT arrays shows the device performance was maintained; 95 % of efficiency, 85% of the maximum output pressure, and 91% of the fractional bandwidth (FBW) can be preserved. A viscoelastic finite element model was also developed and shows the performance effects of the coating can be accurately predicted. Four designs, providing acoustic crosstalk suppression, flexible substrate, lens focusing, and blood flow monitoring using PDMS layer were also demonstrated. The second part of the work, presents contributions towards the electronic integration and packaging of large-area 2-D arrays. A very large 2D array is appealing for it can enable advanced novel imaging applications, such as a reconfigurable array, and a compression plate for breast cancer screening. With these goals in mind, I developed the first large-scale fully populated and integrated 2D CMUTs array with 32 by 192 elements. In this study, I demonstrate a flexible and reliable integration approach by successfully combining a simple UBM preparation technique and a CMUTs-interposer-ASICs sandwich design. The results show high shear strength of the UBM (26.5 g), 100% yield of the interconnections, and excellent CMUT resonance uniformity ([lowercase Sigma] = 0.02 MHz). As demonstrated, this allows for a large-scale assembly of a tile-able array by using an interposer. Interface engineering is crucial towards the development of CMUTs into a practical ultrasound system. With the advances in encapsulation technique with a viscoelastic polymer and the combination of the UBM technique to the TSV fabrication for electronics integration, a fully integrated CMUT system can be realized.
Download or read book The Design Fabrication and Characterization of Capacitive Micromachined Ultrasonic Transducers for Imaging Applications written by Andrew Stephan Logan and published by . This book was released on 2010 with total page 155 pages. Available in PDF, EPUB and Kindle. Book excerpt: Capacitive micromachined ultrasonic transducers (CMUTs) have proven themselves to be excellent candidates for medical ultrasonic imaging applications. The use of semiconductor fabrication techniques facilitates the fabrication of high quality arrays of uniform cells and elements, broad acoustic bandwidth, the potential to integrate the transducers with the necessary electronics, and the opportunity to exploit the benefits of batch fabrication. In this thesis, the design, fabrication and testing of one- and two-dimensional CMUT arrays using a novel wafer bonding process whereby the membrane and the insulation layer are both silicon nitride is reported. A user-grown insulating membrane layer avoids the need for expensive SOI wafers, permits optimization of the electrode size, and allows more freedom in selecting the membrane thickness, while also enjoying the benefits of wafer bonding fabrication. Using a row-column addressing scheme for an NxN two-dimensional array permits three-dimensional imaging with a large reduction in the complexity of the array when compared to a conventional 2D array with connections to all N2 elements. Only 2N connections are required and the image acquisition rate has the potential to be greatly increased. A simplification of the device at the imaging end will facilitate the integration of a three-dimensional imaging CMUT array into either an endoscope or catheter which is the ultimate purpose of this research project. To date, many sizes of transducers which operate at different frequencies have been successfully fabricated. Initial characterization in terms of resonant frequency and, transmission and reception in immersion has been performed on most of the device types. Extensive characterization has been performed with a linear 32 element array transducer and a 32x32 element row-column transducer. Two- and three-dimensional phased array imaging has been demonstrated.
Download or read book Electronic Interfaces for Differential Capacitive Sensors written by Gianluca Barile and published by CRC Press. This book was released on 2022-09-01 with total page 149 pages. Available in PDF, EPUB and Kindle. Book excerpt: In a world where great efforts are spent designing and creating more complex, yet efficient systems, sensing elements and related readout circuits, which constitute an integral part of them, need to be designed fulfilling these constraints, beside the common key parameters, such as high sensitivity, resolution and accuracy. Capacitive sensors and their differential subset provide virtually no energy dissipation, show insensitivity to temperature variations and have the capability to be micromachined directly onto a silicon substrate, together with the readout interface. Designing a readout circuit that takes advantage of these benefits, according to any specific application, is thus of utmost importance. This volume introduces the reader to state-of-the-art techniques and research achievements in interfacing differential capacitance sensors. Technical topics discussed in the book include:▪ Switched capacitor based interfaces;▪ Voltage mode, differential capacitance to time, voltage, digital converters;▪ Current mode interfaces based on standard components;▪ Current mode interfaces based on CCIIs and VCIIs;▪ Principles of second generation current and voltage conveyors. This book gives the reader a comprehensive overview on the working principles, equivalent circuit models and most advanced interfacing techniques for differential capacitive transducers, highlighting benefits and downsides of each option. Electronic interfaces for differential capacitive sensors is an ideal text for academic staff and Masters/research students in electronic and microelectronic engineering.
Download or read book Interface Electronics for Ultrasonic Transducers written by Hao-Yen Tang and published by . This book was released on 2016 with total page 72 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ultrasound has long been used for medical imaging. Recent advances of miniaturized MEMS ultrasonic transducers new applications such as gesture recognition, personal fitness devices, and fingerprint sensors. These devices are considerably smaller than conventional transducers. To benefit from their lower excitation power requirements and address the reduced sensitivity requires the design of novel interface electronic circuits. The first part of this thesis describes new circuits capable of generating all the high voltage drive signals for MEMS transducers on-chip from a single low-voltage supply. A novel level shifter design lowers power dissipation by suppressing the crow-bar current of conventional designs. The techniques have been verified in a seven channel ASIC and applied to a personal fitness application. The second part of the thesis applies the new circuit ideas to the realization of an ultrasonic fingerprint sensor comprising over 6000 individual transducer elements in a 5x4 mm^2 area, each with drive and sense electronics. Unlike prevalent optical or capacitive fingerprint sensors, the ultrasonic solution is capable of recording both the surface and inner layers of the finger, resulting in reduced susceptibility to spoofing attacks.
Download or read book Capacitive Micromachined Ultrasonic Transducers written by Dilruba Zaman Jeba and published by . This book was released on 2014 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Capacitive micromachined ultrasonic transducers (CMUTs) have been developed as an alternative to piezoelectric transducers for ultrasonic imaging in non-destructive testing applications. These CMUTs offer substantial advantages over their piezoelectric counterparts, which include a highly miniaturized system, easy integration with electronic control circuitry, a wider bandwidth, and a higher sensitivity. In this thesis, the design, fabrication and characterization of several single and array CMUT devices are reported. Many sizes of CMUTs, aiming to operate at different resonant frequencies, were fabricated using a PolyMUMPs sacrificial technique. An analytical and finite element model was used to further understanding of the physical behaviour of the transducer. The basic functionality of the CMUT devices was investigated through capacitance and electrical impedance measurements. These devices showed greater change in the capacitance and impedance data while operating close to their collapse voltages. This higher change in both capacitance and impedance is a result of a larger membrane displacement. The acoustic output power is directly related to the magnitude of the membrane's displacement. The transducers performance thus can be enhanced by operating close to their collapse voltage and obtained higher sensitivity. The optical characterization, performed on the single devices and on the 1-D arrays, provided a better understanding of the membrane vibration modes and displacement profiles at different resonant frequency modes. Acoustic measurements were performed to demonstrate the transmission capability of the CMUTs. The generated acoustic signals were detected using a commercial detector. These acoustic experiments demonstrated that these CMUTs can potentially be used as ultrasonic transducers alternative to piezoelectric transducers.
Download or read book The Interface Electronics for a Capacitive Pressure Transducer Integrated Sensor written by William W. Leake III and published by . This book was released on 1982 with total page 148 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Integrated Microsystems written by Krzysztof Iniewski and published by CRC Press. This book was released on 2017-12-19 with total page 760 pages. Available in PDF, EPUB and Kindle. Book excerpt: As rapid technological developments occur in electronics, photonics, mechanics, chemistry, and biology, the demand for portable, lightweight integrated microsystems is relentless. These devices are getting exponentially smaller, increasingly used in everything from video games, hearing aids, and pacemakers to more intricate biomedical engineering and military applications. Edited by Kris Iniewski, a revolutionary in the field of advanced semiconductor materials, Integrated Microsystems: Electronics, Photonics, and Biotechnology focuses on techniques for optimized design and fabrication of these intelligent miniaturized devices and systems. Composed of contributions from experts in academia and industry around the world, this reference covers processes compatible with CMOS integrated circuits, which combine computation, communications, sensing, and actuation capabilities. Light on math and physics, with a greater emphasis on microsystem design and configuration and electrical engineering, this book is organized in three sections—Microelectronics and Biosystems, Photonics and Imaging, and Biotechnology and MEMs. It addresses key topics, including physical and chemical sensing, imaging, smart actuation, and data fusion and management. Using tables, figures, and equations to help illustrate concepts, contributors examine and explain the potential of emerging applications for areas including biology, nanotechnology, micro-electromechanical systems (MEMS), microfluidics, and photonics.
Download or read book Micromachined Ultrasonic Transducers written by and published by . This book was released on 1997 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microfabricated ultrasonic transducers have been generated which operate in both liquids and gases. Air coupled through transmission of aluminum was observed for the first time using a pair of 2.3 MHz transducers. The dynamic range of the transducers was 110 dB, and the received signal had an SNR of 30 dB. Air coupled through transmission of steel and glass has also been observed. A theoretical model for the transducers has been refined and agrees well with experimental results. A robust microfabrication process has been developed and was used to generate air transducers which resonate from 2 to 12 MHz, as well as immersion transducers that operate in water from 1 to 20 MHz with a 60 dB dynamic range. Optimized immersion and air transducers have been designed and a dynamic range above 110 dB is anticipated. This development effort finds applications in hydrophones, medical ultrasound, nondestructive evaluation, ranging, flow metering, and scanning tip force sensing and lithography.
Download or read book Capacitive Micromachined Ultrasonic Transducers for Non destructive Testing Applications written by Lawrence Lai Pong Wong and published by . This book was released on 2014 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Ultrasound is a popular technique for industrial non-destructive testing (NDT) applications. By sending ultrasonic waves into an object and observing the amplitude and the delay of the reflected or transmitted waves, one can characterize the material, measure the thickness of the object, and detect discontinuities (flaws) as well as the size, location, and orientation of the defects in the object. Traditionally, ultrasonic transducers for NDT are made with piezoelectric crystals. Meanwhile, another class of ultrasonic transducers known as capacitive micromachined ultrasonic transducers (CMUTs) have become popular in medical ultrasound research because of their large bandwidths and other attributes that allow them to be integrated into the tip of a catheter. However, CMUTs have not been widely adopted in ultrasonic NDT applications. In this thesis, three important CMUTs characteristics that could potentially make them attractive for NDT applications are introduced and demonstrated. First, CMUTs can be beneficial to NDT because the fabrication techniques of CMUTs can easily be used to implement high-frequency, high-density phased arrays, which are essential for high resolution scanning. Surface scanning using a 2-D row-column addressed CMUT array was demonstrated. Secondly, CMUTs can be integrated with supporting microelectronic circuits, thus one can implement a highly integrated transducer system, which can be useful in structural health monitoring NDT applications. Front-end microelectronic circuits that include a transmit pulser and a receive amplifier were designed, tested, and characterized. Thirdly, CMUTs are suitable for air-coupled applications because of their low acoustic impedance at resonance. Air-coupled CMUTs fabricated in a standard RF-MEMS process were characterized and tested. This thesis concludes with an analysis of the potential usefulness of CMUTs for ultrasonic NDT. While many ultrasonic NDT applications are better off being performed using conventional piezoelectric transducers, CMUTs can and should be used in certain NDT applications that can take advantage of the beneficial characteristics of this exciting transducer technology.
Download or read book Medical Imaging written by Troy Farncombe and published by CRC Press. This book was released on 2017-12-19 with total page 857 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book has two intentions. First, it assembles the latest research in the field of medical imaging technology in one place. Detailed descriptions of current state-of-the-art medical imaging systems (comprised of x-ray CT, MRI, ultrasound, and nuclear medicine) and data processing techniques are discussed. Information is provided that will give interested engineers and scientists a solid foundation from which to build with additional resources. Secondly, it exposes the reader to myriad applications that medical imaging technology has enabled.
Download or read book Novel Architectures for Capacitive Micromachined Sensors and Actuators written by Hani Tawfik and published by . This book was released on 2019 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: "This work presents novel architectures for improving the performance of capacitive-based micromachined thermal detectors, ultrasonic transducers, and multiplexers. The proposed designs are implemented in a pure-play commercial process, which is known for its reliability and cost-effectiveness. In addition, several performance-limitation issues are tackled. Furthermore, a novel approach is proposed for implementing standalone MEMS arrays, to avoid the complicated and expensive post-processing of complementary metal-oxide-semiconductor (CMOS) wafers.The first part of this work presents a novel dual-level capacitive bimorphous thermal detector architecture that is prototyped in the commercial PolyMUMPs by MEMSCAP. The dual-level design exhibits a 6.5 fF/°C sensitivity which is over 3 times higher than traditional single-level designs and it has a base capacitance that is over twice as large. The proposed architecture mitigates an inherent trade-off between thermal sensitivity and base capacitance. Other challenges facing bimorphous thermal detectors are addressed as well. This work also presents, a compensation mechanism for shocks and the ambient temperature. In addition, a material selection study for the bimorph layers concluded a significant performance enhancement of using silicon-carbide (SiC) with polyimide. Moreover, a method was developed for utilizing a positive photoresist as a sacrificial layer that alleviates the restrictions on material-selection for the layers of the bimorphs.The second part of this study presents a reduced-gap implementation of a 3.33-MHz capacitive micromachined ultrasonic transducer (CMUT) in the PolyMUMPs technology. The design provides a bias voltage supply reduction that is four times less compared to the traditional architecture to achieve a sufficient acoustic pressure. Also, a novel operation mechanism is demonstrated for ultrasonic testing underwater, and this mechanism employs the surface-tension forces between the surfaces of the water and the ultrasonic probe. The proposed meniscus-mode mechanism amplifies the ultrasonic signal more than the traditional fully-immersed setup by a factor of 2.6; this is demonstrated experimentally in the study.The final part proposes a novel switching design for multiplexing, and it targets low-frequency applications. The inline torsional electrostatic MEMS multiplexer (ITEM2) architecture is presented. In the study, a theoretical analysis of the structure's snap-down voltage is derived. By combining the novel architectures for thermal detectors and CMUTs presented with the proposed ITEM2 design, a stand-alone MEMS array solution can be a low-cost alternative to the traditional monolithic and hybrid integration with the electronics. The study presents an implementation of an 8 × 8 thermal detectors array that is routed using micromachined bypass-bridges and MEMS multiplexers." --
Download or read book CMOS Integrated Lab on a chip System for Personalized Biomedical Diagnosis written by Hao Yu and published by John Wiley & Sons. This book was released on 2018-04-04 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt: A thorough examination of lab-on-a-chip circuit-level operations to improve system performance A rapidly aging population demands rapid, cost-effective, flexible, personalized diagnostics. Existing systems tend to fall short in one or more capacities, making the development of alternatives a priority. CMOS Integrated Lab-on-a-Chip System for Personalized Biomedical Diagnosis provides insight toward the solution, with a comprehensive, multidisciplinary reference to the next wave of personalized medicine technology. A standard complementary metal oxide semiconductor (CMOS) fabrication technology allows mass-production of large-array, miniaturized CMOS-integrated sensors from multi-modal domains with smart on-chip processing capability. This book provides an in-depth examination of the design and mechanics considerations that make this technology a promising platform for microfluidics, micro-electro-mechanical systems, electronics, and electromagnetics. From CMOS fundamentals to end-user applications, all aspects of CMOS sensors are covered, with frequent diagrams and illustrations that clarify complex structures and processes. Detailed yet concise, and designed to help students and engineers develop smaller, cheaper, smarter lab-on-a-chip systems, this invaluable reference: Provides clarity and insight on the design of lab-on-a-chip personalized biomedical sensors and systems Features concise analyses of the integration of microfluidics and micro-electro-mechanical systems Highlights the use of compressive sensing, super-resolution, and machine learning through the use of smart SoC processing Discusses recent advances in complementary metal oxide semiconductor-integrated lab-on-a-chip systems Includes guidance on DNA sequencing and cell counting applications using dual-mode chemical/optical and energy harvesting sensors The conventional reliance on the microscope, flow cytometry, and DNA sequencing leaves diagnosticians tied to bulky, expensive equipment with a central problem of scale. Lab-on-a-chip technology eliminates these constraints while improving accuracy and flexibility, ushering in a new era of medicine. This book is an essential reference for students, researchers, and engineers working in diagnostic circuitry and microsystems.
Download or read book Capacitive Micromachined Ultrasonic Transducers with Substrate embedded Springs written by Byung Chul Lee and published by . This book was released on 2015 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: After the first capacitive micromachined ultrasonic transducer (CMUT) was invented in 1994, it became one of the candidate technologies to advance the state-of-the-art of medical ultrasound imaging. Benefiting from its fabrication technique based on the semiconductor industry, CMUT technology has broadened the medical and therapeutic applications such as real-time volumetric ultrasound imaging, catheter-based forward-looking intravascular ultrasound (IVUS), photoacoustic imaging, high-intensity focused ultrasound (HIFU) and so on. In spite of many advantages, however, CMUT technology has been criticized with its relatively low transmit sensitivity (~10 kPa/V) or low average volume displacement efficiency (0.1 nm/V) as well as large drive and bias voltage requirements (in a range of a few hundreds of volts). In order to resolve these issues and open up new potential of clinical applications, this dissertation describes the design, fabrication, and system implementation of CMUTs with substrate-embedded springs, so-called post-CMUT (PCMUT). Since PCMUT structure resembles an ideal piston transducer, the improvements in performance mainly stem from the higher average displacement of the top plate for a given gap height. The overview of the first generation PCMUT is introduced and two main issues in simulation and fabrication aspects of the first generation PCMUT is discussed. To further improve the PCMUT device, a 3D finite element analysis (FEA) model of the PCMUT is demonstrated to predict the performance of the first generation PCMUT. In addition, the design guideline of the second generation PCMUT is proposed for achieving the maximum fractional bandwidth (100 %) as well as with the highest transmit sensitivity (~28 kPa/V). The second generation PCMUT is fabricated by using three combination MEMS processes: usage of two silicon-on-insulator (SOI) wafers, wafer bonding process, and wafer polishing process. The second generation PCMUT achieves high transmit sensitivity (~21 kPa/V) or large average volume displacement efficiency (1.1 nm/V) with a low bias voltage (55 V). Compared to a commercial piezoelectric transducer, the second generation PCMUT improves 2.75 times of the maximum output pressure and 5.25 times of the average volume displacement efficiency with respect to the same voltage. After fabrication and performance characterization of the second generation PCMUT, this dissertation demonstrates the feasibility of PCMUT to use it in medical imaging system by integrating PCMUT with a custom-built integrated circuit (IC). Photoacoustic imaging is also presented for one of its application examples.
Download or read book Handbook of Modern Sensors written by Jacob Fraden and published by Springer Science & Business Media. This book was released on 2006-04-29 with total page 596 pages. Available in PDF, EPUB and Kindle. Book excerpt: Seven years have passed since the publication of the previous edition of this book. During that time, sensor technologies have made a remarkable leap forward. The sensitivity of the sensors became higher, the dimensions became smaller, the sel- tivity became better, and the prices became lower. What have not changed are the fundamental principles of the sensor design. They are still governed by the laws of Nature. Arguably one of the greatest geniuses who ever lived, Leonardo Da Vinci, had his own peculiar way of praying. He was saying, “Oh Lord, thanks for Thou do not violate your own laws. ” It is comforting indeed that the laws of Nature do not change as time goes by; it is just our appreciation of them that is being re?ned. Thus, this new edition examines the same good old laws of Nature that are employed in the designs of various sensors. This has not changed much since the previous edition. Yet, the sections that describe the practical designs are revised substantially. Recent ideas and developments have been added, and less important and nonessential designs were dropped. Probably the most dramatic recent progress in the sensor technologies relates to wide use of MEMS and MEOMS (micro-electro-mechanical systems and micro-electro-opto-mechanical systems). These are examined in this new edition with greater detail. This book is about devices commonly called sensors. The invention of a - croprocessor has brought highly sophisticated instruments into our everyday lives.
Download or read book Electronics Communications and Networks IV written by Amir Hussain and published by CRC Press. This book was released on 2015-07-01 with total page 1868 pages. Available in PDF, EPUB and Kindle. Book excerpt: The 4th International Conference on Electronic, Communications and Networks (CECNet2014) inherits the fruitfulness of the past three conferences and lays a foundation for the forthcoming next year in Shanghai. CECNet2014 was hosted by Hubei University of Science and Technology, China, with the main objective of providing a comprehensive global foru
