Download or read book Design and Test of Integrated Inductors for RF Applications written by Jaime Aguilera and published by Springer Science & Business Media. This book was released on 2007-05-08 with total page 203 pages. Available in PDF, EPUB and Kindle. Book excerpt: Intended for engineers who are starting out in the design of integrated inductors, this book describes the whole design flow, basic selection of the geometry and optimisation of the quality by redesigning the geometry, measurement and de-embedding and characterisation.

Download or read book Integrated Inductors and Transformers written by Egidio Ragonese and published by CRC Press. This book was released on 2010-11-15 with total page 172 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the ability to improve performance, reduce fabrication costs, and increase integration levels of both RX and TX sections of the RF/mm-wave front-end, passive inductive components have experienced extraordinary growth in ICs. Therefore, a fundamental understanding of monolithic inductors and transformers has become essential for all process eng

Download or read book Design and Characterization of Integrated Varactors for RF Applications written by Inigo Gutierrez and published by John Wiley & Sons. This book was released on 2007-04-30 with total page 180 pages. Available in PDF, EPUB and Kindle. Book excerpt: Varactors are passive semiconductor devices used in electronic circuits, as a voltage-controlled way of storing energy in order to boost the amount of electric charge produced. In the past, the use of low-cost fabrication processes such as complementary metal oxide semiconductor (CMOS) and silicon germanium (SiGe) were kept for integrated circuits working in frequency ranges below the GHz. Now, the increased working frequency of radio frequency integrated circuits (RF ICs) for communication devices, and the trend of system-on-chip technology, has pushed the requirements of varactors to the limit. As the frequency of RF applications continues to rise, it is essential that passive devices such as varactors are of optimum quality, making this a critical design issue. Initially describing the physical phenomena that occur in passive devices within standard IC fabrication processes, Design and Characterization of Integrated Varactors for RF Applications goes on to: present information on the design of wide band electrical varactor models (up to 5 GHz) which enable the accurate prediction of device performance; propose a specific methodology for the measurement of integrated varactors, covering on-wafer measurement structures, the calibration process, and detailed descriptions of the required equipment; explain de-embedding techniques and also analyse confidence level and uncertainty linked to the test set-up; examine the design of a voltage controlled oscillator (VCO) circuit as a practical example of the employment of methods discussed in the book. Providing the reader with the necessary technical knowledge for dealing with challenging VCO designs, this book is an essential guide for practising RF and microwave engineers working on the design of electronic devices for integrated circuits. It is also a useful reference for postgraduate students and researchers interested in electronic design for RF applications.

Download or read book Design Simulation and Applications of Inductors and Transformers for Si RF ICs written by Ali M. Niknejad and published by Springer Science & Business Media. This book was released on 2005-12-15 with total page 193 pages. Available in PDF, EPUB and Kindle. Book excerpt: The modern wireless communication industry has put great demands on circuit designers for smaller, cheaper transceivers in the gigahertz frequency range. One tool which has assisted designers in satisfying these requirements is the use of on-chip inductiveelements (inductors and transformers) in silicon (Si) radio-frequency (RF) integrated circuits (ICs). These elements allow greatly improved levels of performance in Si monolithic low-noise amplifiers, power amplifiers, up-conversion and down-conversion mixers and local oscillators. Inductors can be used to improve the intermodulation distortion performance and noise figure of small-signal amplifiers and mixers. In addition, the gain of amplifier stages can be enhanced and the realization of low-cost on-chip local oscillators with good phase noise characteristics is made feasible. In order to reap these benefits, it is essential that the IC designer be able to predict and optimize the characteristics of on-chip inductiveelements. Accurate knowledge of inductance values, quality factor (Q) and the influence of ad- cent elements (on-chip proximity effects) and substrate losses is essential. In this book the analysis, modeling and application of on-chip inductive elements is considered. Using analyses based on Maxwells equations, an accurate and efficient technique is developed to model these elements over a wide frequency range. Energy loss to the conductive substrate is modeled through several mechanisms, including electrically induced displacement and conductive c- rents and by magnetically induced eddy currents. These techniques have been compiled in a user-friendly software tool ASITIC (Analysis and Simulation of Inductors and Transformers for Integrated Circuits).

Download or read book Design Methodology for RF CMOS Phase Locked Loops written by Carlos Quemada and published by Artech House. This book was released on 2009 with total page 243 pages. Available in PDF, EPUB and Kindle. Book excerpt: After a review of PLL essentials, this uniquely comprehensive workbench guide takes you step-by-step through operation principles, design procedures, phase noise analysis, layout considerations, and CMOS realizations for each PLL building block. You get full details on LC tank oscillators including modeling and optimization techniques, followed by design options for CMOS frequency dividers covering flip-flop implementation, the divider by 2 component, and other key factors. The book includes design alternatives for phase detectors that feature methods to minimize jitter caused by the dead zone effect. You also find a sample design of a fully integrated PLL for WLAN applications that demonstrates every step and detail right down to the circuit schematics and layout diagrams. Supported by over 150 diagrams and photos, this one-stop toolkit helps you produce superior PLL designs faster, and deliver more effective solutions for low-cost integrated circuits in all RF applications.

Download or read book Linear CMOS RF Power Amplifiers written by Hector Solar Ruiz and published by Springer Science & Business Media. This book was released on 2013-09-14 with total page 191 pages. Available in PDF, EPUB and Kindle. Book excerpt: The work establishes the design flow for the optimization of linear CMOS power amplifiers from the first steps of the design to the final IC implementation and tests. The authors also focuses on design guidelines of the inductor’s geometrical characteristics for power applications and covers their measurement and characterization. Additionally, a model is proposed which would facilitate designs in terms of transistor sizing, required inductor quality factors or minimum supply voltage. The model considers limitations that CMOS processes can impose on implementation. The book also provides different techniques and architectures that allow for optimization.

Download or read book RF Power Amplifiers written by Marian K. Kazimierczuk and published by John Wiley & Sons. This book was released on 2014-12-15 with total page 686 pages. Available in PDF, EPUB and Kindle. Book excerpt: This second edition of the highly acclaimed RF Power Amplifiers has been thoroughly revised and expanded to reflect the latest challenges associated with power transmitters used in communications systems. With more rigorous treatment of many concepts, the new edition includes a unique combination of class-tested analysis and industry-proven design techniques. Radio frequency (RF) power amplifiers are the fundamental building blocks used in a vast variety of wireless communication circuits, radio and TV broadcasting transmitters, radars, wireless energy transfer, and industrial processes. Through a combination of theory and practice, RF Power Amplifiers, Second Edition provides a solid understanding of the key concepts, the principle of operation, synthesis, analysis, and design of RF power amplifiers. This extensive update boasts: up to date end of chapter summaries; review questions and problems; an expansion on key concepts; new examples related to real-world applications illustrating key concepts and brand new chapters covering ‘hot topics’ such as RF LC oscillators and dynamic power supplies. Carefully edited for superior readability, this work remains an essential reference for research & development staff and design engineers. Senior level undergraduate and graduate electrical engineering students will also find it an invaluable resource with its practical examples & summaries, review questions and end of chapter problems. Key features: • A fully revised solutions manual is now hosted on a companion website alongside new simulations. • Extended treatment of a broad range of topologies of RF power amplifiers. • In-depth treatment of state-of-the art of modern transmitters and a new chapter on oscillators. • Includes problem-solving methodology, step-by-step derivations and closed-form design equations with illustrations.

Download or read book Emerging Trends in Technological Innovation written by Luis M. Camarinha-Matos and published by Springer. This book was released on 2010-02-26 with total page 560 pages. Available in PDF, EPUB and Kindle. Book excerpt: Identifying Emerging Trends in Technological Innovation Doctoral programs in science and engineering are important sources of innovative ideas and techniques that might lead to new products and technological innovation. Certainly most PhD students are not experienced researchers and are in the process of learning how to do research. Nevertheless, a number of empiric studies also show that a high number of technological innovation ideas are produced in the early careers of researchers. The combination of the eagerness to try new approaches and directions of young doctoral students with the experience and broad knowledge of their supervisors is likely to result in an important pool of innovation potential. The DoCEIS doctoral conference on Computing, Electrical and Industrial En- neering aims at creating a space for sharing and discussing ideas and results from doctoral research in these inter-related areas of engineering. Innovative ideas and hypotheses can be better enhanced when presented and discussed in an encouraging and open environment. DoCEIS aims to provide such an environment, releasing PhD students from the pressure of presenting their propositions in more formal contexts.

Download or read book Novel Advances in Microsystems Technologies and Their Applications written by Laurent A. Francis and published by CRC Press. This book was released on 2017-07-28 with total page 637 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microsystems technologies have found their way into an impressive variety of applications, from mobile phones, computers, and displays to smart grids, electric cars, and space shuttles. This multidisciplinary field of research extends the current capabilities of standard integrated circuits in terms of materials and designs and complements them by creating innovative components and smaller systems that require lower power consumption and display better performance. Novel Advances in Microsystems Technologies and their Applications delves into the state of the art and the applications of microsystems and microelectronics-related technologies. Featuring contributions by academic and industrial researchers from around the world, this book: Examines organic and flexible electronics, from polymer solar cell to flexible interconnects for the co-integration of micro-electromechanical systems (MEMS) with complementary metal oxide semiconductors (CMOS) Discusses imaging and display technologies, including MEMS technology in reflective displays, the fabrication of thin-film transistors on glass substrates, and new techniques to display and quickly transmit high-quality images Explores sensor technologies for sensing electrical currents and temperature, monitoring structural health and critical industrial processes, and more Covers biomedical microsystems, including biosensors, point-of-care devices, neural stimulation and recording, and ultra-low-power biomedical systems Written for researchers, engineers, and graduate students in electrical and biomedical engineering, this book reviews groundbreaking technology, trends, and applications in microelectronics. Its coverage of the latest research serves as a source of inspiration for anyone interested in further developing microsystems technologies and creating new applications.

Download or read book Design and Analysis of Spiral Inductors written by Genemala Haobijam and published by Springer Science & Business Media. This book was released on 2013-09-07 with total page 116 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book addresses the critical challenges faced by the ever-expanding wireless communication market and the increasing frequency of operation due to continuous innovation of high performance integrated passive devices. The challenges like low quality factor, design complexity, manufacturability, processing cost, etc., are studied with examples and specifics. Silicon on-chip inductor was first reported in 1990 by Nguyen and Meyer in a 0.8 μm silicon bipolar complementary metal oxide semiconductor technology (BiCMOS). Since then, there has been an enormous progress in the research on the performance trends, design and optimization, modeling, quality factor enhancement techniques, etc., of spiral inductors and significant results are reported in literature for various applications. This book introduces an efficient method of determining the optimized layout of on chip spiral inductor. The important fundamental tradeoffs of the design like quality factor and area, quality factor and inductance, quality factor and operating frequency, maximum quality factor and the peak frequency is also explored. The authors proposed an algorithm for accurate design and optimization of spiral inductors using a 3D electromagnetic simulator with minimum number of inductor structure simulations and thereby reducing its long computation time. A new multilayer pyramidal symmetric inductor structure is also proposed in this book. Being multilevel, the proposed inductor achieves high inductance to area ratio and hence occupies smaller silicon area.

Download or read book Integrated Inductors with Micro patterned Magnetic Thin Films for RF and Power Applications written by Hao Wu and published by . This book was released on 2013 with total page 73 pages. Available in PDF, EPUB and Kindle. Book excerpt: With increasing demand for System on Chip (SoC) and System in Package (SiP) design in computer and communication technologies, integrated inductor which is an essential passive component has been widely used in numerous integrated circuits (ICs) such as in voltage regulators and RF circuits. In this work, soft ferromagnetic core material, amorphous Co-Zr-Ta-B, was incorporated into on-chip and in-package inductors in order to scale down inductors and improve inductors performance in both inductance density and quality factor. With two layers of 500 nm Co-Zr-Ta-B films a 3.5X increase in inductance and a 3.9X increase in quality factor over inductors without magnetic films were measured at frequencies as high as 1 GHz. By laminating technology, up to 9.1X increase in inductance and more than 5X increase in quality factor (Q) were obtained from stripline inductors incorporated with 50 nm by 10 laminated films with a peak Q at 300 MHz. It was also demonstrated that this peak Q can be pushed towards high frequency as far as 1GHz by a combination of patterning magnetic films into fine bars and laminations. The role of magnetic vias in magnetic flux and eddy current control was investigated by both simulation and experiment using different patterning techniques and by altering the magnetic via width. Finger-shaped magnetic vias were designed and integrated into on-chip RF inductors improving the frequency of peak quality factor from 400 MHz to 800 MHz without sacrificing inductance enhancement. Eddy current and magnetic flux density in different areas of magnetic vias were analyzed by HFSS 3D EM simulation. With optimized magnetic vias, high frequency response of up to 2 GHz was achieved. Furthermore, the effect of applied magnetic field on on-chip inductors was investigated for high power applications. It was observed that as applied magnetic field along the hard axis (HA) increases, inductance maintains similar value initially at low fields, but decreases at larger fields until the magnetic films become saturated. The high frequency quality factor showed an opposite trend which is correlated to the reduction of ferromagnetic resonant absorption in the magnetic film. In addition, experiments showed that this field-dependent inductance change varied with different patterned magnetic film structures, including bars/slots and fingers structures. Magnetic properties of Co-Zr-Ta-B films on standard organic package substrates including ABF and polyimide were also characterized. Effects of substrate roughness and stress were analyzed and simulated which provide strategies for integrating Co-Zr-Ta-B into package inductors and improving inductors performance. Stripline and spiral inductors with Co-Zr-Ta-B films were fabricated on both ABF and polyimide substrates. Maximum 90% inductance increase in hundreds MHz frequency range were achieved in stripline inductors which are suitable for power delivery applications. Spiral inductors with Co-Zr-Ta-B films showed 18% inductance increase with quality factor of 4 at frequency up to 3 GHz.

Download or read book High Frequency Magnetic Components written by Marian K. Kazimierczuk and published by John Wiley & Sons. This book was released on 2011-08-24 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: If you are looking for a complete study of the fundamental concepts in magnetic theory, read this book. No other textbook covers magnetic components of inductors and transformers for high-frequency applications in detail. This unique text examines design techniques of the major types of inductors and transformers used for a wide variety of high-frequency applications including switching-mode power supplies (SMPS) and resonant circuits. It describes skin effect and proximity effect in detail to provide you with a sound understanding of high-frequency phenomena. As well as this, you will discover thorough coverage on: integrated inductors and the self-capacitance of inductors and transformers, with expressions for self-capacitances in magnetic components; criteria for selecting the core material, as well as core shape and size, and an evaluation of soft ferromagnetic materials used for magnetic cores; winding resistance at high frequencies; expressions for winding and core power losses when non-sinusoidal inductor or transformer current waveforms contain harmonics. Case studies, practical design examples and procedures (using the area product method and the geometry coefficient method) are expertly combined with concept-orientated explanations and student-friendly analysis. Supplied at the end of each chapter are summaries of the key concepts, review questions, and problems, the answers to which are available in a separate solutions manual. Such features make this a fantastic textbook for graduates, senior level undergraduates and professors in the area of power electronics in addition to electrical and computer engineering. This is also an inimitable reference guide for design engineers of power electronics circuits, high-frequency transformers and inductors in areas such as (SMPS) and RF power amplifiers and circuits.

Download or read book GPS and Galileo Dual RF Front end receiver and Design Fabrication Test written by Jaizki Mendizabal Samper and published by McGraw Hill Professional. This book was released on 2008-10-31 with total page 209 pages. Available in PDF, EPUB and Kindle. Book excerpt: Design State-of-the-Art GPS/Galileo Dual RF Receivers This authoritative guide walks you through the process of designing, fabricating, and testing a highly integrated, low-noise, low-power, and low-cost RF front-end for GPS and Galileo, the leading satellite-based global navigation systems. Everything from standards analysis to characterization of the design is covered in the book. GPS & Galileo focuses on developing seamlessly interoperable receivers that can access the wide variety of new services offered by these systems, such as increased service availability, centimeter-sensitive accuracy, emergency management, and data confidentiality. By the end of the book, you will have a prototype that achieves peak performance in terms of gain, NF, and current consumption, making it suitable for any high-accuracy, portable application. Discover how to: Determine the specifications of an interoperable dual GPS/Galileo RF front-end Design all RFIC blocks, including the receiver chain, PLL, control logic, and PADs Select the required external components Implement optimal floor planning Perform validation testing of the integrated RF front-end Understand real-world fields of application Gauge the performance of the front-end within a receiver linked to a full-solution platform

Download or read book On Wafer Microwave Measurements and De embedding written by Errikos Lourandakis and published by Artech House. This book was released on 2016-07-31 with total page 251 pages. Available in PDF, EPUB and Kindle. Book excerpt: This new authoritative resource presents the basics of network analyzer measurement equipment and troubleshooting errors involved in the on-wafer microwave measurement process. This book bridges the gap between theoretical and practical information using real-world practices that address all aspects of on-wafer passive device characterization in the microwave frequency range up to 60GHz. Readers find data and measurements from silicon integrated passive devices fabricated and tested in advance CMOS technologies. Basic circuit equations, terms and fundamentals of time and frequency domain analysis are covered. This book also explores the basics of vector network analyzers (VNA), two port S-parameter measurement routines, signal flow graphs, network theory, error models and VNA calibrations with the use of calibration standards.

Download or read book E field Tunable RF Integrated Multiferroic Inductors and Transformers for RFIC Applications written by Yuan Gao and published by . This book was released on 2015 with total page 116 pages. Available in PDF, EPUB and Kindle. Book excerpt: As one of the three fundamental components for electronic circuits, inductors have been extensively used in a variety of applications such as power delivery, voltage regulation, microwave and RF (radio-frequency) integrated circuits. A lot of research was implemented to achieve high inductance density, low resistance and high quality factor. Compact inductors with high quality factor in radio frequency (RF) applications are of great interest nowadays. Most of the integrated inductors in RF integrated circuits (RFICs) consist of a spiral geometry without magnetic material and show inductances ranging between 1 and 10nH with low quality factors of 10. These spiral inductors typically have a low inductance areal density, which leads to large inductor area and strong electromagnetic interference that limit the RFIC performance. Increased inductance density and/or quality factor can be achieved using a magnetic material as the inductor core. However, the large loss tangent of these thick metallic magnetic thin films at MHz or GHz frequencies severely limited any quality factor enhancement to 100 MHz or less. It has been challenging to achieve simultaneous enhanced inductance and quality factor at RFs, particularly for GHz frequencies. On the other hand, the still growing demand to integrate more applications in mobile communication terminals comes along with the need to cover an increasingly larger frequency band, as these services are subjected to different standards. Electronic tunability becomes a main research issue since this will allow reducing the number of components in the terminal. Voltage tunable capacitors have been widely used in many different circuit applications. However, voltage tunable inductors have not been readily available, which severely limits their applications and the achievable tunable RF frequency range of LC tank circuits. The goals of this dissertation are designing and fabricating magnetic inductors with characteristic high quality factor and high tunability potential by E-field on Si substrate. The research work includes three parts which are summarized below. Firstly, integrated RF inductors with high quality factor have been designed, fabricated, measured and analyzed. In this part, the details of magnetic material selection will be discussed and multilayer FeGaB/Al2O3 films have been finally employed because of the demonstrated eddy-current loss reduction, lower out of plane anisotropy and higher permeability in comparison with a single FeGaB layer with the same thickness. Two model analysis about solenoid inductors that are useful for parameter determination have been presented followed by design matrix with over 20 different sets of dimensions. The fabricated inductors exhibit excellent high-frequency performance with a wide operation frequency range of DC-2.5GHz, in which the inductance of the integrated magnetic inductors show 100% enhancement compared with that of the same size air core inductor, as well as a high quality factor of over 20, showing great promise for RFIC applications. Secondly, based on the fabricated high Q inductors, a new type of tunable RF multiferroic inductors have been made on 0.5mm thick ferroelectric (011) cut lead magnetsium niobate - lead titanate (PMN-PT) slab. Under an applied voltage on the PMN-PT heterostructure, the inductance and quality factor can be both tuned through a strain mediated magnetoelectric coupling due to the change of E-field. By using this phenomena and removing back side Si of our devices to enhance magnetoelectric coupling between PMNPT and magnetic layer we have been able to show more than 100% tunability in frequency of GHz. DRIE inducing giant E-field tenability of magnetism and narrow linewidth in multiferroic laminates will also be discussed in detail. Last but not least, with the same magnetic material and fabrication process, we present a micromachined implementation of embedded magnetic solenoid transformers with high quality factor (Q) and low insertion loss. Transformers with excellent performance have been demonstrated, including a high quality factor of 14, flat inductance across a wide frequency range of 0.5–5 GHz, as well as high mutual coupling and low insertion loss, which make them great potential candidates for RFIC applications.

Download or read book Modeling of Integrated Inductors for RF Circuit Design written by Fábio Passos and published by LAP Lambert Academic Publishing. This book was released on 2014-07-15 with total page 112 pages. Available in PDF, EPUB and Kindle. Book excerpt: Integrated Inductors are a fundamental element in voltage-controlled oscillators, low noise amplifiers and LC filters. In this work a model based in lumped elements is presented for the characterization of integrated inductors. With this model, it is possible to design integrated inductors with different topologies, for a wide range of frequencies, by granting the evaluation of important design parameters such as inductance, quality factor and self-resonance frequency. The model used is based on analytical equations and this equations will be explained in detail. In order to validate the model, some comparisons are made against electromagnetic (EM) simulations in two different technologies, a 0.13 um and 0.35 um CMOS technology. Also, a statistic analysis is presented in order to validate the model over a wide range of geometric variables and the validation is done against electromagnetic simulations for a 0.35 um CMOS technology. Variable width integrated inductors are also studied as a way of increasing the quality factor of inductors. In the end, the model is integrated into two different optimizations processes. Both single and multi-objective optimization.

Download or read book TSV 3D RF Integration written by Shenglin Ma and published by Elsevier. This book was released on 2022-04-27 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt: TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology. Provides a detailed demonstration of the design and process development of HR-Si (High-Resistivity Silicon) interposer technology Presents a series of implementation case studies that detail modeling and simulation, integration, qualification and testing methods Offers a systematic and comparative literature review of HR-Si interposer technology by topic Offers solutions to problems with TSV (through silicon via) interposer technology, including high frequency loss and cooling problems Gives a systematic and accessible accounting on this leading technology