Download or read book Design and Crosstalk Analysis in Carbon Nanotube Interconnects written by P. Uma Sathyakam and published by Springer Nature. This book was released on 2020-10-31 with total page 134 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a single-source reference on carbon nanotubes for interconnect applications. It presents the recent advances in modelling and challenges of carbon nanotube (CNT)-based VLSI interconnects. Starting with a background of carbon nanotubes and interconnects, this book details various aspects of CNT interconnect models, the design metrics of CNT interconnects, crosstalk analysis of recently proposed CNT interconnect structures, and geometries. Various topics covered include the use of semiconducting CNTs around metallic CNTs, CNT interconnects with air gaps, use of emerging ultra low-k materials and their integration with CNT interconnects, and geometry-based crosstalk reduction techniques. This book will be useful for researchers and design engineers working on carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
Download or read book Crosstalk in Modern On Chip Interconnects written by B.K. Kaushik and published by Springer. This book was released on 2016-04-06 with total page 126 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book provides accurate FDTD models for on-chip interconnects, covering most recent advancements in materials and design. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for CNT and GNR based interconnects are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR-based interconnects are also discussed in the book. The proposed models are validated with the HSPICE simulations. The book introduces the current research scenario in the modeling of on-chip interconnects. It presents the structure, properties, and characteristics of graphene based on-chip interconnects and the FDTD modeling of Cu based on-chip interconnects. The model considers the non-linear effects of CMOS driver as well as the transmission line effects of interconnect line that includes coupling capacitance and mutual inductance effects. In a more realistic manner, the proposed model includes the effect of width-dependent MFP of the MLGNR while taking into account the edge roughness.
Download or read book Carbon Nanotubes for Interconnects written by Aida Todri-Sanial and published by Springer. This book was released on 2016-07-09 with total page 340 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
Download or read book Carbon Nanotube Based VLSI Interconnects written by Brajesh Kumar Kaushik and published by Springer. This book was released on 2014-11-01 with total page 94 pages. Available in PDF, EPUB and Kindle. Book excerpt: The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.
Download or read book Carbon Nanotube and Graphene Nanoribbon Interconnects written by Debaprasad Das and published by CRC Press. This book was released on 2017-12-19 with total page 197 pages. Available in PDF, EPUB and Kindle. Book excerpt: An Alternative to Copper-Based Interconnect Technology With an increase in demand for more circuit components on a single chip, there is a growing need for nanoelectronic devices and their interconnects (a physical connecting medium made of thin metal films between several electrical nodes in a semiconducting chip that transmit signals from one point to another without any distortion). Carbon Nanotube and Graphene Nanoribbon Interconnects explores two new important carbon nanomaterials, carbon nanotube (CNT) and graphene nanoribbon (GNR), and compares them with that of copper-based interconnects. These nanomaterials show almost 1,000 times more current-carrying capacity and significantly higher mean free path than copper. Due to their remarkable properties, CNT and GNR could soon replace traditional copper interconnects. Dedicated to proving their benefits, this book covers the basic theory of CNT and GNR, and provides a comprehensive analysis of the CNT- and GNR-based VLSI interconnects at nanometric dimensions. Explore the Potential Applications of CNT and Graphene for VLSI Circuits The book starts off with a brief introduction of carbon nanomaterials, discusses the latest research, and details the modeling and analysis of CNT and GNR interconnects. It also describes the electrical, thermal, and mechanical properties, and structural behavior of these materials. In addition, it chronicles the progression of these fundamental properties, explores possible engineering applications and growth technologies, and considers applications for CNT and GNR apart from their use in VLSI circuits. Comprising eight chapters this text: Covers the basics of carbon nanotube and graphene nanoribbon Discusses the growth and characterization of carbon nanotube and graphene nanoribbon Presents the modeling of CNT and GNR as future VLSI interconnects Examines the applicability of CNT and GNR in terms of several analysis works Addresses the timing and frequency response of the CNT and GNR interconnects Explores the signal integrity analysis for CNT and GNR interconnects Models and analyzes the applicability of CNT and GNR as power interconnects Considers the future scope of CNT and GNR Beneficial to VLSI designers working in this area, Carbon Nanotube and Graphene Nanoribbon Interconnects provides a complete understanding of carbon-based materials and interconnect technology, and equips the reader with sufficient knowledge about the future scope of research and development for this emerging topic.
Download or read book Nano Interconnect Materials and Models for Next Generation Integrated Circuit Design written by Sandip Bhattacharya and published by CRC Press. This book was released on 2023-12-22 with total page 251 pages. Available in PDF, EPUB and Kindle. Book excerpt: Aggressive scaling of device and interconnect dimensions has resulted in many low dimensional issues in the nanometer regime. This book deals with various new generation interconnect materials and interconnect modeling and highlights the significance of novel nano interconnect materials for 3D integrated circuit design. It provides information about advanced nanomaterials like carbon nanotube (CNT) and graphene nanoribbon (GNR) for the realization of interconnects, interconnect models, and crosstalk noise analysis. Features: Focusses on materials and nanomaterials utilization in next generation interconnects based on Carbon nanotubes (CNT) and Graphene nanoribbons (GNR). Helps readers realize interconnects, interconnect models, and crosstalk noise analysis. Describes Hybrid CNT and GNR based interconnects. Presents the details of power supply voltage drop analysis in CNT and GNR interconnects. Overviews pertinent RF performance and stability analysis. This book is aimed at graduate students and researchers in electrical and materials engineering, nano/microelectronics.
Download or read book Carbon Nanotube and Graphene Nanoribbon Interconnects written by Debaprasad Das and published by CRC Press. This book was released on 2017-12-19 with total page 200 pages. Available in PDF, EPUB and Kindle. Book excerpt: An Alternative to Copper-Based Interconnect Technology With an increase in demand for more circuit components on a single chip, there is a growing need for nanoelectronic devices and their interconnects (a physical connecting medium made of thin metal films between several electrical nodes in a semiconducting chip that transmit signals from one point to another without any distortion). Carbon Nanotube and Graphene Nanoribbon Interconnects explores two new important carbon nanomaterials, carbon nanotube (CNT) and graphene nanoribbon (GNR), and compares them with that of copper-based interconnects. These nanomaterials show almost 1,000 times more current-carrying capacity and significantly higher mean free path than copper. Due to their remarkable properties, CNT and GNR could soon replace traditional copper interconnects. Dedicated to proving their benefits, this book covers the basic theory of CNT and GNR, and provides a comprehensive analysis of the CNT- and GNR-based VLSI interconnects at nanometric dimensions. Explore the Potential Applications of CNT and Graphene for VLSI Circuits The book starts off with a brief introduction of carbon nanomaterials, discusses the latest research, and details the modeling and analysis of CNT and GNR interconnects. It also describes the electrical, thermal, and mechanical properties, and structural behavior of these materials. In addition, it chronicles the progression of these fundamental properties, explores possible engineering applications and growth technologies, and considers applications for CNT and GNR apart from their use in VLSI circuits. Comprising eight chapters this text: Covers the basics of carbon nanotube and graphene nanoribbon Discusses the growth and characterization of carbon nanotube and graphene nanoribbon Presents the modeling of CNT and GNR as future VLSI interconnects Examines the applicability of CNT and GNR in terms of several analysis works Addresses the timing and frequency response of the CNT and GNR interconnects Explores the signal integrity analysis for CNT and GNR interconnects Models and analyzes the applicability of CNT and GNR as power interconnects Considers the future scope of CNT and GNR Beneficial to VLSI designers working in this area, Carbon Nanotube and Graphene Nanoribbon Interconnects provides a complete understanding of carbon-based materials and interconnect technology, and equips the reader with sufficient knowledge about the future scope of research and development for this emerging topic.
Download or read book Nano Interconnects written by Afreen Khursheed and published by CRC Press. This book was released on 2021-12-23 with total page 187 pages. Available in PDF, EPUB and Kindle. Book excerpt: This textbook comprehensively covers on-chip interconnect dimension and application of carbon nanomaterials for modeling VLSI interconnect and buffer circuits. It provides analysis of ultra-low power high speed nano-interconnects based on different facets such as material modeling, circuit modeling and the adoption of repeater insertion strategies and measurement techniques. It covers important topics including on-chip interconnects, interconnect modeling, electrical impedance modeling of on-chip interconnects, modeling of repeater buffer and variability analysis. Pedagogical features including solved problems and unsolved exercises are interspersed throughout the text for better understanding. Aimed at senior undergraduate and graduate students in the field of electrical engineering, electronics and communications engineering for courses on Advanced VLSI Interconnects/Advanced VLSI Design/VLSI Interconnects/VLSI Design Automation and Techniques, this book: Provides comprehensive coverage of fundamental concepts related to nanotube transistors and interconnects. Discusses properties and performance of practical nanotube devices and related applications. Covers physical and electrical phenomena of carbon nanotubes, as well as applications enabled by this nanotechnology. Discusses the structure, properties, and characteristics of graphene-based on-chip interconnect. Examines interconnect power and interconnect delay issues arising due to downscaling of device size.
Download or read book Progress in VLSI Design and Test written by Hafizur Rahaman and published by Springer. This book was released on 2012-06-26 with total page 427 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 16th International Symposium on VSLI Design and Test, VDAT 2012, held in Shibpur, India, in July 2012. The 30 revised regular papers presented together with 10 short papers and 13 poster sessions were carefully selected from 135 submissions. The papers are organized in topical sections on VLSI design, design and modeling of digital circuits and systems, testing and verification, design for testability, testing memories and regular logic arrays, embedded systems: hardware/software co-design and verification, emerging technology: nanoscale computing and nanotechnology.
Download or read book Carbon Based Electronics written by Ashok Srivastava and published by CRC Press. This book was released on 2015-03-19 with total page 153 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discovery of one-dimensional material carbon nanotubes in 1991 by the Japanese physicist Dr. Sumio Iijima has resulted in voluminous research in the field of carbon nanotubes for numerous applications, including possible replacement of silicon used in the fabrication of CMOS chips. One interesting feature of carbon nanotubes is that these can be me
Download or read book Through Silicon Vias written by Brajesh Kumar Kaushik and published by CRC Press. This book was released on 2016-11-30 with total page 165 pages. Available in PDF, EPUB and Kindle. Book excerpt: Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.
Download or read book Interconnect Technologies for Integrated Circuits and Flexible Electronics written by Yash Agrawal and published by Springer Nature. This book was released on 2023-10-17 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.
Download or read book Electronic Properties of Carbon Nanotubes written by Jose Mauricio Marulanda and published by BoD – Books on Demand. This book was released on 2011-07-27 with total page 700 pages. Available in PDF, EPUB and Kindle. Book excerpt: Carbon nanotubes (CNTs), discovered in 1991, have been a subject of intensive research for a wide range of applications. These one-dimensional (1D) graphene sheets rolled into a tubular form have been the target of many researchers around the world. This book concentrates on the semiconductor physics of carbon nanotubes, it brings unique insight into the phenomena encountered in the electronic structure when operating with carbon nanotubes. This book also presents to reader useful information on the fabrication and applications of these outstanding materials. The main objective of this book is to give in-depth understanding of the physics and electronic structure of carbon nanotubes. Readers of this book should have a strong background on physical electronics and semiconductor device physics. This book first discusses fabrication techniques followed by an analysis on the physical properties of carbon nanotubes, including density of states and electronic structures. Ultimately, the book pursues a significant amount of work in the industry applications of carbon nanotubes.
Download or read book Proceedings of 2nd International Conference on Micro Electronics Electromagnetics and Telecommunications written by Suresh Chandra Satapathy and published by Springer. This book was released on 2017-09-06 with total page 674 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book is a collection of best papers presented in the Second International Conference on Microelectronics Electromagnetics and Telecommunication (ICMEET 2016), an international colloquium, which aims to bring together academic scientists, researchers and research scholars to discuss the recent developments and future trends in the fields of microelectronics, electromagnetics and telecommunication. Microelectronics research investigates semiconductor materials and device physics for developing electronic devices and integrated circuits with data/energy efficient performance in terms of speed, power consumption, and functionality. The book discusses various topics like analog, digital and mixed signal circuits, bio-medical circuits and systems, RF circuit design, microwave and millimeter wave circuits, green circuits and systems, analog and digital signal processing, nano electronics and giga scale systems, VLSI circuits and systems, SoC and NoC, MEMS and NEMS, VLSI digital signal processing, wireless communications, cognitive radio, and data communication.
Download or read book Carbon Nanotubes Interconnects for Nanoelectronics Circuits written by A.G. Chiarello and published by . This book was released on 2010 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: This Chapter has analyzed the use of carbon nanotubes as possible innovative material to fabricate high-speed interconnects at various hierarchical levels of the future nanoelectronics technology. The electromagnetic model presented here to describe the electrical propagation along CNT interconnects is derived from a semi-classical solution of the transport equation. All the quantistic and kinetic effects affecting the electrodynamics of charge carriers are taken into account through global parameters (kinetic inductance and quantum capacitance) which have been simply related to the number of effective conducting channel per CNT shell. Both the rigorous approach and a simple approximation have been provided to evaluate this number for CNT shells of arbitrary chirality, hence allowing the modelling of either single-wall and multi-wall CNTs. The electrodynamical model provides a constitutive equation for the CNT interconnect, which is coupled to the Maxwell equation: the problem is then solved in the frame of the classical transmission line theory, so obtaining simple equivalent RLC circuits for single CNTs and bundles of CNTs. These models are consistent with those used in literature for metallic CNTs, but introduce the possibility to deal with arbitrary chiralities and CNT diameters. The analysis of CNT transmission lines highlights unusual behaviours with respect to the Cu lines, mainly due to the strong influence of the kinetic and quantistic terms over the classical electromagnetic inductance and capacitance parameters. Some case-studies have been carried out referring to a realistic use of CNTs to build interconnects for wiring and for packaging nanotechnology ICs. In the considered examples typical values of the future 22nm technology nodes have been assumed. A signal integrity analysis is performed with reference to an on-chip interconnect arrangement, where the conventional Cu material is replaced by a bundle of CNTs. Next, the EMC behaviour of two adjacent traces in a stripline is analyzed, checking the high-frequency effects and the crosstalk noise. Finally the use of CNTs as pillars for nanopackaging is studied and the introduced parasitics are compared to conventional material realization. Carbon nanotube interconnects are shown to have better behaviour with respect to conventional Cu ones in terms of SI and EMC performances, introduced parasitics and response to temperature variations. From a practical point of view, these simulated performances may be achieved provided that good quality bundles are realized, i.e. bundles of high density, good direction control and good terminal contacts.
Download or read book Proceedings of the 2015 International Conference on Electrical and Information Technologies for Rail Transportation written by Yong Qin and published by Springer. This book was released on 2016-03-10 with total page 785 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proceedings collect the latest research trends, methods and experimental results in the field of electrical and information technologies for rail transportation. The topics cover intelligent computing, information processing, communication technology, automatic control, and their applications in rail transportation etc. The proceedings can be a valuable reference work for researchers and graduate students working in rail transportation, electrical engineering and information technologies.
Download or read book Proceedings of Fifth International Conference on Soft Computing for Problem Solving written by Millie Pant and published by Springer. This book was released on 2016-03-19 with total page 1030 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proceedings of SocProS 2015 will serve as an academic bonanza for scientists and researchers working in the field of Soft Computing. This book contains theoretical as well as practical aspects using fuzzy logic, neural networks, evolutionary algorithms, swarm intelligence algorithms, etc., with many applications under the umbrella of ‘Soft Computing’. The book will be beneficial for young as well as experienced researchers dealing across complex and intricate real world problems for which finding a solution by traditional methods is a difficult task. The different application areas covered in the proceedings are: Image Processing, Cryptanalysis, Industrial Optimization, Supply Chain Management, Newly Proposed Nature Inspired Algorithms, Signal Processing, Problems related to Medical and Health Care, Networking Optimization Problems, etc.
