Download or read book Index to IEEE Publications written by Institute of Electrical and Electronics Engineers and published by . This book was released on 1998 with total page 1270 pages. Available in PDF, EPUB and Kindle. Book excerpt: Issues for 1973- cover the entire IEEE technical literature.

Download or read book Electrical Performance of Electronic Packaging written by and published by . This book was released on 2004 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings of 3rd Electronics Packaging Technology Conference EPTC 2000 written by Thiam Beng Lim and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2000 with total page 492 pages. Available in PDF, EPUB and Kindle. Book excerpt: Topics covered by this title include: packaging materials; packaging trends; thermal design and modelling; solder joint metallurgy; process and reliability modelling; thermal characterization; materials characterization techniques; and assembly/manufacturing technologies.

Download or read book Publications of the National Institute of Standards and Technology Catalog written by National Institute of Standards and Technology (U.S.) and published by . This book was released on 1994 with total page 1162 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book 1994 IEEE MTT S European Topical Congress on Technologies for Wireless Applications written by IEEE Microwave Theory and Techniques Society and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1994 with total page 180 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Power Integrity Modeling and Design for Semiconductors and Systems written by Madhavan Swaminathan and published by Pearson Education. This book was released on 2007-11-19 with total page 599 pages. Available in PDF, EPUB and Kindle. Book excerpt: The First Comprehensive, Example-Rich Guide to Power Integrity Modeling Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art. Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications. The authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.

Download or read book Power Distribution Network Design Methodologies written by Istvan Novak and published by Intl. Engineering Consortiu. This book was released on 2008 with total page 578 pages. Available in PDF, EPUB and Kindle. Book excerpt: A series of cogently written articles by 49 industry experts, this collection fills the void on Power Distribution Network (PDN) design procedures, and addresses such related topics as DC–DC converters, selection of bypass capacitors, DDR2 memory systems, powering of FPGAs, and synthesis of impedance profiles. Through these contributions from such leading companies as Sun Microsystems, Sanyo, IBM, Hewlett-Packard, Intel, and Rambus, readers will come to understand why books on power integrity are only now becoming available to the public and can relate these topics to current industry trends.

Download or read book Signal Integrity Effects in Custom IC and ASIC Designs written by Raminderpal Singh and published by John Wiley & Sons. This book was released on 2001-12-12 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt: "...offers a tutorial guide to IC designers who want to move to the next level of chip design by unlocking the secrets of signal integrity." —Jake Buurma, Senior Vice President, Worldwide Research & Development, Cadence Design Systems, Inc. Covers signal integrity effects in high performance Radio Frequency (RF) IC Brings together research papers from the past few years that address the broad range of issues faced by IC designers and CAD managers now and in the future A Wiley-IEEE Press publication

Download or read book Design and Test for Multiple Gbps Communication Devices and Systems written by Mike Peng Li and published by Intl. Engineering Consortiu. This book was released on 2005 with total page 534 pages. Available in PDF, EPUB and Kindle. Book excerpt: Focuses on the multiple Gbps communication technologies and applications - from design to test - and covers the useful elements of device and system development (architecture, simulation and modeling, design techniques, and testing). This title helps you to choose the right methods and tools for your designs and tests.

Download or read book Robust Electronic Design Reference Book no special title written by John R. Barnes and published by Springer Science & Business Media. This book was released on 2004 with total page 1356 pages. Available in PDF, EPUB and Kindle. Book excerpt: If you design electronics for a living, you need Robust Electronic Design Reference Book. Written by a working engineer, who has put over 115 electronic products into production at Sycor, IBM, and Lexmark, Robust Electronic Design Reference covers all the various aspects of designing and developing electronic devices and systems that: -Work. -Are safe and reliable. -Can be manufactured, tested, repaired, and serviced. -May be sold and used worldwide. -Can be adapted or enhanced to meet new and changing requirements.

Download or read book IBM Journal of Research and Development written by and published by . This book was released on 2002 with total page 854 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Simulation Symposium SS 2000 33rd Annual written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2000 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: An international array of simulation specialists in industry and academia contributed papers to the this April 2000 symposium which covered a variety of topics in the field. A sampling of paper topics includes: simulation of telecommunication systems using SimML; optimal resource allocation for multi-service networks; specifying truck movements in traffic models using cell DEVs; and flow control and dynamic load balancing in Time Warp. Annotation copyrighted by Book News, Inc., Portland, OR.

Download or read book Foundations for Microstrip Circuit Design written by Terry C. Edwards and published by John Wiley & Sons. This book was released on 2016-02-01 with total page 688 pages. Available in PDF, EPUB and Kindle. Book excerpt: Building on the success of the previous three editions, Foundations for Microstrip Circuit Design offers extensive new, updated and revised material based upon the latest research. Strongly design-oriented, this fourth edition provides the reader with a fundamental understanding of this fast expanding field making it a definitive source for professional engineers and researchers and an indispensable reference for senior students in electronic engineering. Topics new to this edition: microwave substrates, multilayer transmission line structures, modern EM tools and techniques, microstrip and planar transmision line design, transmission line theory, substrates for planar transmission lines, Vias, wirebonds, 3D integrated interposer structures, computer-aided design, microstrip and power-dependent effects, circuit models, microwave network analysis, microstrip passive elements, and slotline design fundamentals.

Download or read book Proceedings written by and published by . This book was released on 2000 with total page 362 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Electromagnetics and Network Theory and their Microwave Technology Applications written by Stefan Lindenmeier and published by Springer Science & Business Media. This book was released on 2011-07-13 with total page 378 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume provides a discussion of the challenges and perspectives of electromagnetics and network theory and their microwave applications in all aspects. It collects the most interesting contribution of the symposium dedicated to Professor Peter Russer held in October 2009 in Munich.

Download or read book Signal Propagation on Interconnects written by Hartmut Grabinski and published by Springer Science & Business Media. This book was released on 1998-10-31 with total page 168 pages. Available in PDF, EPUB and Kindle. Book excerpt: A selection of contributions to a May 1997 workshop, surveying issues in signal propagation on interconnects. Papers report on results dealing with simulation and measurement of noise and radiated emissions on boards, describe ground bounce effects as well as inductance calculations in multilayer packages, discuss timing simulation techniques, and illustrate ways to overcome performance problems. For researchers in chip and package design, circuit design, and signal integrity. No index. Annotation copyrighted by Book News, Inc., Portland, OR

Download or read book 1995 IEEE MTT S International Microwave Symposium Digest written by Lynn Kirby and published by . This book was released on 1995 with total page 752 pages. Available in PDF, EPUB and Kindle. Book excerpt: