Download or read book Contribution L tude Du Transport Ambipolaire Dans Les Ofets written by Nénon Sébastien and published by Omniscriptum. This book was released on 2010-11 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt: L' lectronique plastique est devenue en une dizaine d'ann es un domaine actif, tant en recherche fondamentale qu'en application. La compr hension et le contr le des forces motrices du transport ambipolaire est un objectif cl de la recherche dans le domaine de l' lectronique organique, et plus particuli rement des transistors. Le premier chapitre pr sente les r sultats obtenus avec des transistors r alis s par vaporation sous vide de phthalocyanines de cuivre. Dans un premier temps la stabilit et les performances des deux semi-conducteurs isol s ont t caract ris s, puis une tude morphologique, lectrique et structurelle a t men e sur des dispositifs en structure bicouche ou interp n tr e. Le deuxi me chapitre pr sente une nouvelle m thode d' laboration de transistors: le LIFT (Laser Induced Forward Transfer). Cette m thode r cente peut permettre de d poser des films une tr s grande cadence menant des dispositifs microstructur s de grande pr cision. Le dernier chapitre pr sente une approche par voie liquide. En conclusion, les diff rentes m thodes sont valu es et compar es afin de d terminer leur utilit et applicabilit respectives.
Download or read book Organic Semiconducting Polymers written by J. E. Katon and published by . This book was released on 1968 with total page 340 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Influence of Temperature on Microelectronics and System Reliability written by Pradeep Lall and published by CRC Press. This book was released on 2020-07-09 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
