Download or read book Design Guidelines for Surface Mount Technology written by John Traister and published by Elsevier. This book was released on 2012-12-02 with total page 326 pages. Available in PDF, EPUB and Kindle. Book excerpt: Design Guidelines for Surface Mount Technology covers the basics and the mechanics of surface mounted design technology. Surface mount technology (SMT) embodies an automated circuit assembly process, using a generation of electronic components called surface mounted devices (SMDs). Organized into eight chapters, the book discusses the component selection, space planning, materials and processes, and total concept needed to ensure a manufacturable design. The opening chapters of the book examine the significant requirements and variables affecting SMT and SMDs. The book then deals with the substrate materials specifications, including fabrication and material planning, assembly, design rules, layout guidelines, package outlines, and bar code labeling. The next chapters describe the manufacturing and assembly processes in SMDs and process-proven footprint patterns for each of the component types used, as well as guidelines for creating a suitable pattern on future products. Other chapters discuss the component spacing requirements for SMT and the generation of footprint patterns for passive and active components of SMDs. The concluding chapter describes the design criteria for maximizing machine insertion of leaded electronic components into printed circuit boards (PCBs). These criteria aid the PCB designer by detailing the considerations and some of the trade-offs that will provide reliable insertion in a production environment. Supplementary texts on surface mount equipment, supplies, and services are also provided. Design engineers and researchers will find this book invaluable.

Download or read book Wear In Advanced Engineering Applications And Materials written by Luis Rodriguez-tembleque and published by World Scientific. This book was released on 2022-03-10 with total page 255 pages. Available in PDF, EPUB and Kindle. Book excerpt: Wear is one of the main reasons mechanical components and materials become inoperable, rendering enormous costs to society over time. Estimating wear allows engineers to predict the useful life of modern mechanical elements, reduce the costs of inoperability, or obtain optimal designs (i.e. selecting proper materials, shapes, and surface finishing according to mechanical conditions and durability) to reduce the impact of wear.Wear in Advanced Engineering Applications and Materials presents recent computational and practical research studying damage and wear in advanced engineering applications and materials. As such, this book covers numerical formulations based on the finite element method (FEM) — and the boundary element method (BEM) — as well as theoretical and experimental research to predict the wear response or life-limiting failure of engineering applications.

Download or read book Superalloys 2020 written by Sammy Tin and published by Springer Nature. This book was released on 2020-08-28 with total page 1098 pages. Available in PDF, EPUB and Kindle. Book excerpt: The 14th International Symposium on Superalloys (Superalloys 2020) highlights technologies for lifecycle improvement of superalloys. In addition to the traditional focus areas of alloy development, processing, mechanical behavior, coatings, and environmental effects, this volume includes contributions from academia, supply chain, and product-user members of the superalloy community that highlight technologies that contribute to improving manufacturability, affordability, life prediction, and performance of superalloys.

Download or read book Microelectronics Packaging Handbook written by Rao Tummala and published by Springer Science & Business Media. This book was released on 1997-01-31 with total page 662 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.

Download or read book Handbook of Superconducting Materials written by David A. Cardwell and published by CRC Press. This book was released on 2003 with total page 1120 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the advent of High Temperature Superconductivity and the increasing reliability of fabrication techniques, superconductor technology has moved firmly into the mainstream of academic and industrial research. There is currently no single source of practical information giving guidance on which technique to use for any particular category of superconductor. An increasing number of materials scientists and electrical engineers require easy access to practical information, sensible advice and guidance on 'best-practice' and reliable, proven fabrication and characterisation techniques.The Handbook will be the definitive collection of material describing techniques for the fabrication and analysis of superconducting materials. In addition to the descriptions of techniques, authoritative discussions written by leading researchers will give guidance on the most appropriate technique for a particular situation.Characterisation and measurement techniques will form an important part of the Handbook, providing researchers with a standard reference for experimental techniques. The tutorial style description of these techniques makes the Handbook particularly suitable for use by graduate students.The Handbook will be supported by a comprehensive web site which will be updated with new data as it emerges.The Handbook has six main sections: -- Fundamentals of Superconductivity - characteristic properties, elementary theory, critical current of type II superconductors-- Processing - bulk materials, wires and tapes, thick and think films, contact techniques-- Characterisation Techniques - structure/microstructure, measurement and interpretation of electromagnetic properties,measurement of physics properties-- Materials - characteristic properties of low and high Tc materials-- Applications - high current applications, trapped flux devices, high frequency devices, josephson junction devic

Download or read book Preparation and Properties of Thin Films written by K. N. Tu and published by Elsevier. This book was released on 2013-10-22 with total page 351 pages. Available in PDF, EPUB and Kindle. Book excerpt: Treatise on Materials Science and Technology, Volume 24: Preparation and Properties of Thin Films covers the progress made in the preparation of thin films and the corresponding study of their properties. The book discusses the preparation and property correlations in thin film; the variation of microstructure of thin films; and the molecular beam epitaxy of superlattices in thin film. The text also describes the epitaxial growth of silicon structures (thermal-, laser-, and electron-beam-induced); the characterization of grain boundaries in bicrystalline thin films; and the mechanical properties of thin films on substrates. The ion beam modification of thin film; the use of thin alloy films for metallization in microelectronic devices; and the fabrication and physical properties of ultrasmall structures are also encompassed. Materials scientists and materials engineers will find the book invaluable.

Download or read book Light Emitting Diodes 4th Edition 2023 written by E. Fred Schubert and published by E. Fred Schubert. This book was released on 2023-03-11 with total page 592 pages. Available in PDF, EPUB and Kindle. Book excerpt: The 1st edition of the book “Light-Emitting Diodes” was published in 2003. The 2nd edition was published in 2006. The 3rd edition was published in 2018. The current edition, the 2023 edition, is the most recent update of the book. The book is a thorough discussion of LEDs, particularly its semiconductor physics, electrical, optical, material science, thermal, mechanical, and chemical foundations. The book presents many fundamental aspects of LED technology and includes an in-depth discussion of white light-emitting diodes (LEDs), phosphor materials used in white LEDs, packaging technology, and the various efficiencies and efficacies encountered in the context of LEDs. The background of light, color science, and human vision is provided as well. The fully colored illustrations of the current edition are beneficial given the prominent role of light and color in the field of LEDs. The current edition is published in electronic PDF format in order to make the book affordable and easily accessible to a wide readership.

Download or read book Small Fatigue Cracks written by K.S. Ravichandran and published by Elsevier. This book was released on 1999-09-30 with total page 511 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains the fully peer-reviewed papers presented at the Third Engineering Foundation Conference on Small Fatigue Cracks, held under the chairmanship of K.S. Ravichandran and Y. Murakami during December 6-11, 1998, at the Turtle Bay Hilton, Oahu, Hawaii. This book presents a state-of-the-art description of the mechanics, mechanisms and applications of small fatigue cracks by most of the world's leading experts in this field. Topics ranging from the mechanisms of crack initiation, small crack behavior in metallic, intermetallic, ceramic and composite materials, experimental measurement, mechanistic and theoretical models, to the role of small cracks in fretting fatigue and the application of small crack results to the aging aircraft and high-cycle fatigue problems, are covered.

Download or read book RF and Time domain Techniques for Evaluating Novel Semiconductor Transistors written by Keith A. Jenkins and published by Springer Nature. This book was released on 2021-12-15 with total page 173 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a variety of techniques using high-frequency (RF) and time-domain measurements to understand the electrical performance of novel, modern transistors made of materials such as graphene, carbon nanotubes, and silicon-on-insulator, and using new transistor structures. The author explains how to use conventional RF and time- domain measurements to characterize the performance of the transistors. In addition, he explains how novel transistors may be subject to effects such as self-heating, period-dependent output, non-linearity, susceptibility to short-term degradation, DC-invisible structural defects, and a different response to DC and transient inputs. Readers will understand that in order to fully understand and characterize the behavior of a novel transistor, there is an arsenal of dynamic techniques available. In addition to abstract concepts, the reader will learn of practical tips required to achieve meaningful measurements, and will understand the relationship between these measurements and traditional, conventional DC characteristics.

Download or read book The Electronic Packaging Handbook written by Glenn R. Blackwell and published by CRC Press. This book was released on 2017-12-19 with total page 648 pages. Available in PDF, EPUB and Kindle. Book excerpt: The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Download or read book Advances in Fracture and Damage Mechanics IX written by Akihide Saimoto and published by Trans Tech Publications Ltd. This book was released on 2010-11-11 with total page 914 pages. Available in PDF, EPUB and Kindle. Book excerpt: Selected, peer reviewed papers from the 9th International Conference on Fracture and Damage Mechanics, FDM 2010, 20-22 September, 2009, Nagasaki, Japan

Download or read book Advances in Asset Management and Condition Monitoring written by Andrew Ball and published by Springer Nature. This book was released on 2020-08-27 with total page 1566 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gathers select contributions from the 32nd International Congress and Exhibition on Condition Monitoring and Diagnostic Engineering Management (COMADEM 2019), held at the University of Huddersfield, UK in September 2019, and jointly organized by the University of Huddersfield and COMADEM International. The aim of the Congress was to promote awareness of the rapidly emerging interdisciplinary areas of condition monitoring and diagnostic engineering management. The contents discuss the latest tools and techniques in the multidisciplinary field of performance monitoring, root cause failure modes analysis, failure diagnosis, prognosis, and proactive management of industrial systems. There is a special focus on digitally enabled asset management and covers several topics such as condition monitoring, maintenance, structural health monitoring, non-destructive testing and other allied areas. Bringing together expert contributions from academia and industry, this book will be a valuable resource for those interested in latest condition monitoring and asset management techniques.

Download or read book Chemical Mechanical Planarization of Semiconductor Materials written by M.R. Oliver and published by Springer Science & Business Media. This book was released on 2013-03-14 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Download or read book The Evolution of the Primate Foot written by Angel Zeininger and published by Springer Nature. This book was released on 2022-12-07 with total page 527 pages. Available in PDF, EPUB and Kindle. Book excerpt: The human foot is a unique and defining characteristic of our anatomy. Most primates have grasping, prehensile feet, whereas the human foot stands out as a powerful non-grasping propulsive lever that is central to our evolution as adept bipedal walkers and runners and defines our lineage. Very few books have compiled and evaluated key research on the primate foot and provided a perspective on what we know and what we still need to know. This book serves as an essential companion to “The Evolution of the Primate Hand” volume, also in the Developments in Primatology series. This book includes chapters written by experts in the field of morphology and mechanics of the primate foot, the role of the foot in different aspects of primate locomotion (including but not limited to human bipedalism), the “hard evidence” of primate foot evolution including fossil foot bones and fossil footprints, and the relevance of our foot’s evolutionary history to modern human foot pathology. This volume addresses three fundamental questions: (1) What makes the human foot so different from that of other primates? (2) How does the anatomy, biomechanics, and ecological context of the foot and foot use differ among primates and why? (3) how did foot anatomy and function change throughout primate and human evolution, and why is this evolutionary history relevant in clinical contexts today? This co-edited volume, which relies on the insights of leading scholars in primate foot anatomy and evolution provides for the first time a comprehensive review and scholarly discussion of the primate foot from multiple perspectives. It is accessible to readers at different levels of inquiry (e.g., undergraduate/graduate students, postdoctoral research, other scholars outside of biological anthropology). This volume provides an all-in‐one resource for research on the comparative and functional morphology and evolution of the primate foot.

Download or read book Electronic Transport in Doped CVD Diamond Microcrystals written by Michael D. Jaeger and published by . This book was released on 1996 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Foldable Flex and Thinned Silicon Multichip Packaging Technology written by John W. Balde and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 357 pages. Available in PDF, EPUB and Kindle. Book excerpt: Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

Download or read book Band Theory and Electronic Properties of Solids written by John Singleton and published by OUP Oxford. This book was released on 2001-08-30 with total page 239 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides an introduction to band theory and the electronic properties of materials at a level suitable for final-year undergraduates or first-year graduate students. It sets out to provide the vocabulary and quantum-mechanical training necessary to understand the electronic, optical and structural properties of the materials met in science and technology and describes some of the experimental techniques which are used to study band structure today. In order to leave space for recent developments, the Drude model and the introduction of quantum statistics are treated synoptically. However, Bloch's theorem and two tractable limits, a very weak periodic potential and the tight-binding model, are developed rigorously and in three dimensions. Having introduced the ideas of bands, effective masses and holes, semiconductor and metals are treated in some detail, along with the newer ideas of artificial structures such as super-lattices and quantum wells, layered organic substances and oxides. Some recent `hot topics' in research are covered, e.g. the fractional Quantum Hall Effect and nano-devices, which can be understood using the techniques developed in the book. In illustrating examples of e.g. the de Haas-van Alphen effect, the book focuses on recent experimental data, showing that the field is a vibrant and exciting one. References to many recent review articles are provided, so that the student can conduct research into a chosen topic at a deeper level. Several appendices treating topics such as phonons and crystal structure make the book self-contained introduction to the fundamentals of band theory and electronic properties in condensed matter physic today.