Download or read book Characterization of Integrated Circuit Packaging Materials written by Thomas Moore and published by Elsevier. This book was released on 2013-10-22 with total page 293 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.
Download or read book Characterizing Ceramic Integrated Circuit Packaging Materials written by Mary Beth Lange and published by . This book was released on 1992 with total page 202 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Integrated Circuit Packaging Assembly and Interconnections written by William Greig and published by Springer Science & Business Media. This book was released on 2007-04-24 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
Download or read book Characterization in Silicon Processing written by Yale Strausser and published by Elsevier. This book was released on 2013-10-22 with total page 255 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume is devoted to the consideration of the use use of surface, thin film and interface characterization tools in support of silicon-based semiconductor processing. The approach taken is to consider each of the types of films used in silicon devices individually in its own chapter and to discuss typical problems seen throughout that films' history, including characterization tools which are most effectively used to clarifying and solving those problems.
Download or read book Characterization of Metals and Alloys written by Paul Holloway and published by Momentum Press. This book was released on 2010 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt: A better understanding of the microstructure of metals and alloys has led to great advances in the performance and useful applications of these, the oldest of mankind's engineered materials. This book in the Materials Characterizations series focuses on the particular molecular and atomistic properties of metals insofar as how they affect the different techniques for measuring and analyzing internal structure, surface structure, and chemical/physical properties. It provides a vital connection between commonly used characterization techniques like Scanning Electron Microscopy and how such can be used in the various ways that metals are processed, machined, and used. Review of relevant mechanical and chemical properties of metals and how they affect characterization techniques Characterization techniques used for melting and casting, machining, and metallic thin films processes Concise summaries of major characterization technologies for metals and alloys, including Auger Electron Spectroscopy, Energy-Dispersive X-Ray Spectroscopy, Neutron Activation Analysis, Scanning Electron Microscopy, and Transmission Electron Spectroscopy
Download or read book Encyclopedia of Materials Characterization written by Charles A. Evans and published by Gulf Professional Publishing. This book was released on 1992 with total page 784 pages. Available in PDF, EPUB and Kindle. Book excerpt: "This is a comprehensive volume on analytical techniques used in materials science for the characterization of surfaces, interfaces and thin films. This flagship volume is a unique, stand-alone reference for materials science practitioners, process engineers, students and anyone with a need to know about the capabilities available in materials analysis. An encyclopedia of 50 concise articles, this book will also be a practical companion to the forthcoming books in the series."--Knovel.
Download or read book Managing for Ethical Organizational Integrity written by Abe J. Zakhem and published by Momentum Press. This book was released on 2012 with total page 228 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides guidelines for ethical decision making in business that are philosophically sound and strategically advantageous. This title explains the concepts of basic and derivative rights in a way that can enable managers to identify those ethical duties that must be met in order to morally justify the pursuit of profit.
Download or read book Characterization of Ceramics written by Ronald E. Loehman and published by Momentum Press. This book was released on 2010 with total page 316 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ceramics are, in a general definition, materials that consist of man-made, inorganic, non-metallic solid material - either existing in a crystalline state or non-crystalline state (i.e., glasses). Materials characterization techniques are used to ensure the structural and surface integrity of ceramics for their use in a wide variety of applications, from thermal resistance to advanced electronic and optical technologies like fiber optics to structural uses. This book presents those techniques along with views on future trends in ceramics processing and advanced characterization technologies particularly appropriate to ceramics materials. Readers will find more on: Ceramic Materials preparation routes, including powder preparation by solution techniques and gas-phase techniques Formation techniques for ceramic films and coatings, thick films and bulk ceramics A review of ceramic microstructure, reactions, phase behavior, mechanical properties and electronic and magnetic ceramics
Download or read book Materials for Information Technology written by Ehrenfried Zschech and published by Springer Science & Business Media. This book was released on 2006-07-02 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.
Download or read book Mems Nems written by Cornelius T. Leondes and published by Springer Science & Business Media. This book was released on 2007-10-08 with total page 2142 pages. Available in PDF, EPUB and Kindle. Book excerpt: This significant and uniquely comprehensive five-volume reference is a valuable source for research workers, practitioners, computer scientists, students, and technologists. It covers all of the major topics within the subject and offers a comprehensive treatment of MEMS design, fabrication techniques, and manufacturing methods. It also includes current medical applications of MEMS technology and provides applications of MEMS to opto-electronic devices. It is clearly written, self-contained, and accessible, with helpful standard features including an introduction, summary, extensive figures and design examples with comprehensive reference lists.
Download or read book Advanced Materials for Thermal Management of Electronic Packaging written by Xingcun Colin Tong and published by Springer Science & Business Media. This book was released on 2011-01-05 with total page 633 pages. Available in PDF, EPUB and Kindle. Book excerpt: The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer Science & Business Media. This book was released on 2008-12-17 with total page 723 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Download or read book Microcircuit Reliability Bibliography written by and published by . This book was released on 1974 with total page 888 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Millimeter wave Technologies written by Duixian Liu and published by John Wiley & Sons. This book was released on 2009-04-06 with total page 866 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains one of the hottest topics in wireless and electronic devices community, namely the wireless communication at mmWave frequencies, especially at the 60 GHz ISM band. It provides the reader with knowledge and techniques for mmWave antenna design, evaluation, antenna and chip packaging. Addresses practical engineering issues such as RF material evaluation and selection, antenna and packaging requirements, manufacturing tolerances, antenna and system interconnections, and antenna One of the first books to discuss the emerging research and application areas, particularly chip packages with integrated antennas, wafer scale mmWave phased arrays and imaging Contains a good number of case studies to aid understanding Provides the antenna and packaging technologies for the latest and emerging applications with the emphases on antenna integrations for practical applications such as wireless USB, wireless video, phase array, automobile collision avoidance radar, and imaging
Download or read book Materials Characterization by Thermomechanical Analysis written by Alan T. Riga and published by ASTM International. This book was released on 1991 with total page 198 pages. Available in PDF, EPUB and Kindle. Book excerpt: Fifteen papers from the symposium held in Philadelphia, March 1990, examine the uses of thermomechanical analysis and thermodilatometry in materials science, addressing instrumentation, techniques, and applications. Annotation copyright Book News, Inc. Portland, Or.
Download or read book High Frequency Characterization of Electronic Packaging written by Luc Martens and published by Springer Science & Business Media. This book was released on 1998-10-31 with total page 174 pages. Available in PDF, EPUB and Kindle. Book excerpt: High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.
Download or read book Semiconductor International written by and published by . This book was released on 1992 with total page 768 pages. Available in PDF, EPUB and Kindle. Book excerpt:
