Download or read book Characterization and Metrology for ULSI Technology 2003 written by David G. Seiler and published by American Institute of Physics. This book was released on 2003-10-08 with total page 868 pages. Available in PDF, EPUB and Kindle. Book excerpt: The worldwide semiconductor community faces increasingly difficult challenges as it moves into the manufacturing of chips with feature sizes approaching 100 nm and beyond. The magnitude of these challenges demands special attention from the metrology and analytical measurements community. New paradigms must be found. Adequate research and development for new metrology concepts are urgently needed. Topics include: integrated circuit history, challenges and overviews, front end, lithography, interconnect and back end, and critical analytical techniques. Characterization and metrology are key enablers for developing new semiconductor technology and in improving manufacturing. This book summarizes major issues and gives critical reviews of important measurement techniques that are crucial to continue the advances in semiconductor technology. It covers major aspects of process technology and most characterization techniques for silicon research, including development, manufacturing, and diagnostics. The editors believe that this book of collected papers provides a concise and effective portrayal of industry characterization needs and the way they are being addressed by industry, academia, and government to continue the dramatic progress in semiconductor technology. Hopefully, it will also provide a basis for stimulating advances in metrology and new ideas for research and development.
Download or read book Istfa 2003 written by ASM International and published by ASM International. This book was released on 2003-01-01 with total page 534 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Characterization and Metrology for ULSI Technology 2005 written by David G. Seiler and published by American Institute of Physics. This book was released on 2005-09-29 with total page 714 pages. Available in PDF, EPUB and Kindle. Book excerpt: The worldwide semiconductor community faces increasingly difficult challenges in the era of silicon nanotechnology and beyond. The magnitude of these challenges demands special attention from the metrology and analytical measurements community. New paradigms must be found. Adequate research and development for new metrology concepts are urgently needed. Characterization and metrology are key enablers for developing new semiconductor technology and in improving manufacturing. This book summarizes major issues and gives critical reviews of important measurement techniques that are crucial to continuing the advances in semiconductor technology. It covers major aspects of process technology and most characterization techniques for silicon research, including development, manufacturing, and diagnostics. The book also covers emerging nano-devices and the corresponding metrology challenges that arise.
Download or read book Characterization and Metrology for ULSI Technology 2000 written by David G. Seiler and published by . This book was released on 2001 with total page 734 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Semiconductor Material and Device Characterization written by Dieter K. Schroder and published by John Wiley & Sons. This book was released on 2015-06-29 with total page 800 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Third Edition updates a landmark text with the latest findings The Third Edition of the internationally lauded Semiconductor Material and Device Characterization brings the text fully up-to-date with the latest developments in the field and includes new pedagogical tools to assist readers. Not only does the Third Edition set forth all the latest measurement techniques, but it also examines new interpretations and new applications of existing techniques. Semiconductor Material and Device Characterization remains the sole text dedicated to characterization techniques for measuring semiconductor materials and devices. Coverage includes the full range of electrical and optical characterization methods, including the more specialized chemical and physical techniques. Readers familiar with the previous two editions will discover a thoroughly revised and updated Third Edition, including: Updated and revised figures and examples reflecting the most current data and information 260 new references offering access to the latest research and discussions in specialized topics New problems and review questions at the end of each chapter to test readers' understanding of the material In addition, readers will find fully updated and revised sections in each chapter. Plus, two new chapters have been added: Charge-Based and Probe Characterization introduces charge-based measurement and Kelvin probes. This chapter also examines probe-based measurements, including scanning capacitance, scanning Kelvin force, scanning spreading resistance, and ballistic electron emission microscopy. Reliability and Failure Analysis examines failure times and distribution functions, and discusses electromigration, hot carriers, gate oxide integrity, negative bias temperature instability, stress-induced leakage current, and electrostatic discharge. Written by an internationally recognized authority in the field, Semiconductor Material and Device Characterization remains essential reading for graduate students as well as for professionals working in the field of semiconductor devices and materials. An Instructor's Manual presenting detailed solutions to all the problems in the book is available from the Wiley editorial department.
Download or read book Microscopy of Semiconducting Materials 2003 written by A.G. Cullis and published by CRC Press. This book was released on 2018-01-10 with total page 705 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modern electronic devices rely on ever-greater miniaturization of components, and semiconductor processing is approaching the domain of nanotechnology. Studies of devices in this regime can only be carried out with the most advanced forms of microscopy. Accordingly, Microscopy of Semiconducting Materials focuses on international developments in semiconductor studies carried out by all forms of microscopy. It provides an overview of the latest instrumentation, analysis techniques, and state-of-the-art advances in semiconducting materials science for solid state physicists, chemists, and material scientists.
Download or read book Electron Microscopy and Analysis 2003 written by S McVitie and published by CRC Press. This book was released on 2004-02-19 with total page 520 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electron microscopy is now a mainstay characterization tool for solid state physicists and chemists as well as materials scientists. Containing the proceedings from the Electron Microscopy and Analysis Group (EMAG) conference in September 2003, this volume covers current developments in the field, primarily in the UK. These conferences are biennial events organized by the EMAG of the Institute of Physics to provide a forum for discussion of the latest developments in instrumentation, techniques, and applications of electron and scanning probe microscopies.
Download or read book Measurement of 100 nm and 60 nm Particle Standards by Differential Mobility Analysis written by and published by DIANE Publishing. This book was released on with total page 56 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Handbook of Silicon Wafer Cleaning Technology written by Karen Reinhardt and published by William Andrew. This book was released on 2008-12-10 with total page 749 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included. - Focused on silicon wafer cleaning techniques including wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits - As this book covers the major technologies for removing contaminants, it is a reliable reference for anyone that manufactures integrated circuits, or supplies the semiconductor and microelectronics industries - Covers processes and equipment, as well as new materials and changes required for the surface conditioning process - Editors are two of the top names in the field and are both extensively published - Discusses next generation processing techniques including supercritical fluid, laser, and cryoaerosol
Download or read book Handbook of Nanoscopy written by Gustaaf van Tendeloo and published by John Wiley & Sons. This book was released on 2012-12-21 with total page 1484 pages. Available in PDF, EPUB and Kindle. Book excerpt: This completely revised successor to the Handbook of Microscopy supplies in-depth coverage of all imaging technologies from the optical to the electron and scanning techniques. Adopting a twofold approach, the book firstly presents the various technologies as such, before going on to cover the materials class by class, analyzing how the different imaging methods can be successfully applied. It covers the latest developments in techniques, such as in-situ TEM, 3D imaging in TEM and SEM, as well as a broad range of material types, including metals, alloys, ceramics, polymers, semiconductors, minerals, quasicrystals, amorphous solids, among others. The volumes are divided between methods and applications, making this both a reliable reference and handbook for chemists, physicists, biologists, materials scientists and engineers, as well as graduate students and their lecturers.
Download or read book Mass Spectrometry Handbook written by Mike S. Lee and published by John Wiley & Sons. This book was released on 2012-04-16 with total page 1362 pages. Available in PDF, EPUB and Kindle. Book excerpt: Due to its enormous sensitivity and ease of use, mass spectrometry has grown into the analytical tool of choice in most industries and areas of research. This unique reference provides an extensive library of methods used in mass spectrometry, covering applications of mass spectrometry in fields as diverse as drug discovery, environmental science, forensic science, clinical analysis, polymers, oil composition, doping, cellular research, semiconductor, ceramics, metals and alloys, and homeland security. The book provides the reader with a protocol for the technique described (including sampling methods) and explains why to use a particular method and not others. Essential for MS specialists working in industrial, environmental, and clinical fields.
Download or read book High Purity Silicon VIII written by Cor L. Claeys and published by The Electrochemical Society. This book was released on 2004 with total page 454 pages. Available in PDF, EPUB and Kindle. Book excerpt: "This Proceedings Volume includes papers that were presented at the Eighth Symposium on High Purity Silicon held in Honolulu, Hawaii at the 206th Meeting of the Electrochemical Society, October 3-8, 2004"--Pref.
Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-04-02 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Download or read book ISTFA 2010 written by and published by ASM International. This book was released on 2010-01-01 with total page 487 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Interfaces in Electronic Materials written by L. Cook and published by The Electrochemical Society. This book was released on 2006 with total page 362 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electrochemical Processes in ULSI and MEMS written by Hariklia Deligianni and published by The Electrochemical Society. This book was released on 2005 with total page 494 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book A Practical Guide to Optical Metrology for Thin Films written by Michael Quinten and published by John Wiley & Sons. This book was released on 2012-09-24 with total page 212 pages. Available in PDF, EPUB and Kindle. Book excerpt: A one-stop, concise guide on determining and measuring thin film thickness by optical methods. This practical book covers the laws of electromagnetic radiation and interaction of light with matter, as well as the theory and practice of thickness measurement, and modern applications. In so doing, it shows the capabilities and opportunities of optical thickness determination and discusses the strengths and weaknesses of measurement devices along with their evaluation methods. Following an introduction to the topic, Chapter 2 presents the basics of the propagation of light and other electromagnetic radiation in space and matter. The main topic of this book, the determination of the thickness of a layer in a layer stack by measuring the spectral reflectance or transmittance, is treated in the following three chapters. The color of thin layers is discussed in chapter 6. Finally, in chapter 7, the author discusses several industrial applications of the layer thickness measurement, including high-reflection and anti-reflection coatings, photolithographic structuring of semiconductors, silicon on insulator, transparent conductive films, oxides and polymers, thin film photovoltaics, and heavily doped silicon. Aimed at industrial and academic researchers, engineers, developers and manufacturers involved in all areas of optical layer and thin optical film measurement and metrology, process control, real-time monitoring, and applications.
