Download or read book Challenges in Manufacturing Submicron Ultra large Scale Integrated Circuits written by Richard B. Fair and published by . This book was released on 1989 with total page 44 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Introduction to VLSI Systems written by Ming-Bo Lin and published by CRC Press. This book was released on 2011-11-28 with total page 917 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the advance of semiconductors and ubiquitous computing, the use of system-on-a-chip (SoC) has become an essential technique to reduce product cost. With this progress and continuous reduction of feature sizes, and the development of very large-scale integration (VLSI) circuits, addressing the harder problems requires fundamental understanding of circuit and layout design issues. Furthermore, engineers can often develop their physical intuition to estimate the behavior of circuits rapidly without relying predominantly on computer-aided design (CAD) tools. Introduction to VLSI Systems: A Logic, Circuit, and System Perspective addresses the need for teaching such a topic in terms of a logic, circuit, and system design perspective. To achieve the above-mentioned goals, this classroom-tested book focuses on: Implementing a digital system as a full-custom integrated circuit Switch logic design and useful paradigms that may apply to various static and dynamic logic families The fabrication and layout designs of complementary metal-oxide-semiconductor (CMOS) VLSI Important issues of modern CMOS processes, including deep submicron devices, circuit optimization, interconnect modeling and optimization, signal integrity, power integrity, clocking and timing, power dissipation, and electrostatic discharge (ESD) Introduction to VLSI Systems builds an understanding of integrated circuits from the bottom up, paying much attention to logic circuit, layout, and system designs. Armed with these tools, readers can not only comprehensively understand the features and limitations of modern VLSI technologies, but also have enough background to adapt to this ever-changing field.
Download or read book On and Off Chip Crosstalk Avoidance in VLSI Design written by Chunjie Duan and published by Springer Science & Business Media. This book was released on 2010-01-08 with total page 250 pages. Available in PDF, EPUB and Kindle. Book excerpt: Deep Sub-Micron (DSM) processes present many changes to Very Large Scale Integration (VLSI) circuit designers. One of the greatest challenges is crosstalk, which becomes significant with shrinking feature sizes of VLSI fabrication processes. The presence of crosstalk greatly limits the speed and increases the power consumption of the IC design. This book focuses on crosstalk avoidance with bus encoding, one of the techniques that selectively mitigates the impact of crosstalk and improves the speed and power consumption of the bus interconnect. This technique encodes data before transmission over the bus to avoid certain undesirable crosstalk conditions and thereby improve the bus speed and/or energy consumption.
Download or read book Vertically Integrated Design and Fabrication Using Submicron Digital Technology for Ultra Large Scale Integrated Systems written by Stanford Electronics Laboratory and published by . This book was released on 1979 with total page 64 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Plasma Processing of Materials written by National Research Council and published by National Academies Press. This book was released on 1991-02-01 with total page 88 pages. Available in PDF, EPUB and Kindle. Book excerpt: Plasma processing of materials is a critical technology to several of the largest manufacturing industries in the worldâ€"electronics, aerospace, automotive, steel, biomedical, and toxic waste management. This book describes the relationship between plasma processes and the many industrial applications, examines in detail plasma processing in the electronics industry, highlights the scientific foundation underlying this technology, and discusses education issues in this multidisciplinary field. The committee recommends a coordinated, focused, and well-funded research program in this area that involves the university, federal laboratory, and industrial sectors of the community. It also points out that because plasma processing is an integral part of the infrastructure of so many American industries, it is important for both the economy and the national security that America maintain a strong leadership role in this technology.
Download or read book Microelectronic Manufacturing Yield Reliability and Failure Analysis written by and published by . This book was released on 1997 with total page 218 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability and Risk Assessment in Engineering written by Vijay Kumar Gupta and published by Springer Nature. This book was released on 2020-05-08 with total page 523 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume is a collection of articles on reliability and safety engineering presented during INCRS 2018. The articles cover a variety of topics such as big data analytics and their applications in reliability assessment and condition monitoring, health monitoring, management, diagnostics and prognostics of mechanical systems, design for reliability and optimization, and machine learning for industrial applications. A special aspect of this volume is the coverage of performance, failure and reliability issues in electrical distribution systems. This book will be a useful reference for graduate students, researchers and professionals working in the area of reliability assessment, condition monitoring and predictive maintenance.
Download or read book Rapid Thermal Processing written by Richard B. Fair and published by Academic Press. This book was released on 2012-12-02 with total page 441 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the first definitive book on rapid thermal processing (RTP), an essential namufacturing technology for single-wafer processing in highly controlled environments. Written and edited by nine experts in the field, this book covers a range of topics for academics and engineers alike, moving from basic theory to advanced technology for wafer manufacturing. The book also provides new information on the suitability or RTP for thin film deposition, junction formation, silicides, epitaxy, and in situ processing. Complete discussions on equipment designs and comparisons between RTP and other processing approaches also make this book useful for supplemental information on silicon processing, VLSI processing, and integrated circuit engineering.
Download or read book Innovation And Entrepreneurship Choice And Challenge written by Otto Chui Chau Lin and published by World Scientific. This book was released on 2018-02-26 with total page 347 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses practical issues of innovation and entrepreneurship. It first outlines the basic factors contributing to economic growth in the knowledge-based economy. Portraying wealth creation as taking scientific research results from lab to market, it identifies two interlinking components of the innovation process: turning scientific research to industrial technology and nurturing an eco-system conducive to technology business. Thus, it clarifies the position and role of four institutional players of the national innovation system: university (U), technology institute (T), government (G) and business (B). Making these players interact synergistically provides a fertile environment for innovation and entrepreneurship. The development of Silicon Valley, Hsinchu, Shenzhen and Singapore are illustrated as examples.For the technology entrepreneur, having a novel technology or unique product does not guarantee commercial success. It requires an effective business model, ability to execute business plan and entrepreneurial culture, all related to the soft power attributes of the entrepreneur team. The competitiveness of innovation and management of entrepreneurship are analyzed based on the concepts of Laozi and Confucius.Every entrepreneurship must learn to manage the challenges brought about by the changing business environment. The competitiveness and sustainability of a business is reflected by its ability to manage the change, both in bad and in good times. Every choice it makes will bring about new challenge. This is a definite, continuous and cyclic phenomenon occurring to all types of business. Some case examples of success or failure in managing challenges are given. They include: Alibaba Group, Ardentec IC testing, Cisco Systems, Delta Electronics, Eastman Kodak, Epistar HBLED, Fairchild Semiconductors, General Motors, GIANT carbon fiber bicycles, Tencent Holdings, TSMC, Volkswagen and others.This book is based on the author's practice and observation in technology and economic development especially in the Asia Pacific region during the post-1990s period. It is intended to be a reference of best practices for entrepreneurs, corporations and countries striving to make its mark in the knowledge-based economy.
Download or read book Applied Fourier Transform written by Kiyoshi Morita and published by IOS Press. This book was released on 1995 with total page 450 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Challenges and Solutions for Large scale Integration of Emerging Technologies written by Md Arif Iqbal and published by . This book was released on 2021 with total page 89 pages. Available in PDF, EPUB and Kindle. Book excerpt: The semiconductor revolution so far has been primarily driven by the ability to shrink devices and interconnects proportionally (Moore's law) while achieving incremental benefits. In sub-10nm nodes, device scaling reaches its fundamental limits, and the interconnect bottleneck is dominating power and performance. As the traditional way of CMOS scaling comes to an end, it is essential to find an alternative to continue this progress. However, an alternative technology for general-purpose computing remains elusive; currently pursued research directions face adoption challenges in all aspects from materials, devices to architecture, thermal management, integration, and manufacturing. Crosstalk Computing, a novel emerging computing technique, addresses some of the challenges and proposes a new paradigm for circuit design, scaling, and security. However, like other emerging technologies, Crosstalk Computing also faces challenges like designing large-scale circuits using existing CAD tools, scalability, evaluation and benchmarking of large-scale designs, experimentation through commercial foundry processes to compete/co-exist with CMOS for digital logic implementations. This dissertation addresses these issues by providing a methodology for circuit synthesis customizing the existing EDA tool flow, evaluating and benchmarking against state-of-the-art CMOS for large-scale circuits designed at 7nm from MCNC benchmark suits. This research also presents a study on Crosstalk technology's scalability aspects and shows how the circuits' properties evolve from 180nm to 7nm technology nodes. Some significant results are for primitive Crosstalk gate, designed in 180nm, 65nm, 32nm, and 7nm technology nodes, the average reduction in power is 42.5%, and an average improvement in performance is 34.5% comparing to CMOS for all mentioned nodes. For benchmarking large-scale circuits designed at 7nm, there are 48%, 57%, and 10% improvements against CMOS designs in terms of density, power, and performance, respectively. An experimental demonstration of a proof-of-concept prototype chip for Crosstalk Computing at TSMC 65nm technology is also presented in this dissertation, showing the Crosstalk gates can be realized using the existing manufacturing process. Additionally, the dissertation also provides a fine-grained thermal management approach for emerging technologies like transistor-level 3-D integration (Monolithic 3-D, Skybridge, SN3D), which holds the most promise beyond 2-D CMOS technology. However, such 3-D architectures within small form factors increase hotspots and demand careful consideration of thermal management at all integration levels. This research proposes a new direction for fine-grained thermal management approach for transistor-level 3-D integrated circuits through the insertion of architected heat extraction features that can be part of circuit design, and an integrated methodology for thermal evaluation of 3-D circuits combining different simulation outcomes at advanced nodes, which can be integrated to traditional CAD flow. The results show that the proposed heat extraction features effectively reduce the temperature from a heated location. Thus, the dissertation provides a new perspective to overcome the challenges faced by emerging technologies where the device, circuit, connectivity, heat management, and manufacturing are addressed in an integrated manner.
Download or read book Proceedings of the Symposia on Patterning Science and Technology II and Interconnection and Contact Metallization for ULSI written by Wayne Greene and published by . This book was released on 1992 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Thin Film Materials Processes and Reliability written by G. S. Mathad and published by The Electrochemical Society. This book was released on 2003 with total page 438 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Semiconductor Device and Failure Analysis written by Wai Kin Chim and published by John Wiley & Sons. This book was released on 2000 with total page 298 pages. Available in PDF, EPUB and Kindle. Book excerpt: The diminishing size and greater complexity of modern semiconductor integrated circuits poses new challenges in fault detection. Photon Emission Microscopy (PEM) is a physical fault localisation technique used for analysing IC failures. Detailing the PEM technique and its application to semiconductor device analysis, this unique reference: * Illustrates the application of the PEM technique in various areas of device reliability, in particular hot-carrier, oxide and ESD reliability. * Presents the principles of design and calibration for a spectroscopic emission microscope system along with coverage of the three main operation modes: frontside, backside and spectroscopic PEM * Provides an analysis of light emission in semiconductors under hot-carrier and high-field impulse stressing in MOS transistors and photon emission from biased MOS capacitors. Not only an essential reference for researchers and students in the field, the numerous practical examples throughout the text also make this an indispensible guide for failure analysis engineers and microelectrics industry professionals.
Download or read book New industrial base initiative written by United States. Congress. House. Committee on Banking, Finance, and Urban Affairs. Subcommittee on Economic Stabilization and published by . This book was released on 1988 with total page 824 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Technology of Integrated Circuits written by D. Widmann and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 355 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the first book to comprehensively record the authors’ authoritative knowledge and practical experience of IC manufacturing, including the tremendous developments of recent years. With its strong application orientation, this is a must-have book for professionals in semiconductor industries.
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1992 with total page 1572 pages. Available in PDF, EPUB and Kindle. Book excerpt:
