Download or read book Capacitance Inductance and Crosstalk Analysis written by Charles S. Walker and published by . This book was released on 1990 with total page 245 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Capacitance Inductance and Crosstalk Analysis written by Charles S. Walker and published by Artech House Publishers. This book was released on 1990 with total page 250 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is an applications-oriented text that describes the basics of EM fields and gives solutions to crosstalk problems using relevant formulas, experiments and analysis.

Download or read book Electromagnetic Compatibility written by David A. Weston and published by CRC Press. This book was released on 2016-11-03 with total page 1311 pages. Available in PDF, EPUB and Kindle. Book excerpt: Revised, updated, and expanded, Electromagnetic Compatibility: Methods, Analysis, Circuits, and Measurement, Third Edition provides comprehensive practical coverage of the design, problem solving, and testing of electromagnetic compatibility (EMC) in electrical and electronic equipment and systems. This new edition provides novel information on theory, applications, evaluations, electromagnetic computational programs, and prediction techniques available. With sixty-nine schematics providing examples for circuit level electromagnetic interference (EMI) hardening and cost effective EMI problem solving, this book also includes 1130 illustrations and tables. Including extensive data on components and their correct implementation, the myths, misapplication, misconceptions, and fallacies that are common when discussing EMC/EMI will also be addressed and corrected.

Download or read book Transmission Lines Matching and Crosstalk written by Kenneth L. Kaiser and published by CRC Press. This book was released on 2005-09-20 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt: In chapters culled from the popular and critically acclaimed Electromagnetic Compatibility Handbook, Transmission Lines, Matching, and Crosstalk provides a tightly focused, convenient, and affordable reference for those interested primarily in this subset of topics. Author Kenneth L. Kaiser demystifies transmission lines, matching, and crosstalk and explains the source and limitations of the approximations, guidelines, models, and rules-of-thumb used in this field. The material is presented in a unique question-and-answer format that gets straight to the heart of each topic. The book includes numerous examples and uses Mathcad to generate all of the figures and many solutions to equations. In many cases, the entire Mathcad program is provided.

Download or read book High Speed Circuit Board Signal Integrity Second Edition written by Stephen C. Thierauf and published by Artech House. This book was released on 2017-04-30 with total page 320 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thoroughly updated leading-edge circuit design resource offers the knowledge needed to quickly pinpoint transmission problems that can compromise the entire circuit design. This new edition demonstrates how to apply EM theory to solve signal integrity problems with a practical application-oriented approach. Discussing both design and debug issues at gigabit per second data rates, the book serves as a practical reference for projects involving high-speed serial signaling on printed wiring boards. Step-by-step, this book goes from reviewing the essentials of linear circuit theory, to examining practical issues of pulse propagation along lossless and lossy transmission lines. It provides detailed guidelines for crosstalk, attenuation, power supply decoupling, and layer stackup tradeoffs (including pad/antipad tradeoffs). Other key topics include the construction of etched conductors, analysis of return paths and split planes, microstrip and stripline characteristics, and SMT capacitors. Filled with on-the-job-proven examples, this hands-on reference is the book that engineers can turn to time and again to design out and troubleshoot circuit signal loss and impedance problems.

Download or read book EMC Analysis Methods and Computational Models written by Frederick M. Tesche and published by John Wiley & Sons. This book was released on 1996-12-26 with total page 656 pages. Available in PDF, EPUB and Kindle. Book excerpt: Describes and illustrates various modeling techniques which are applicable to the area of EMC and includes material previously available only in international reports or other hard-to-obtain references. Electromagnetic topology, lumped-parameter circuit models, the radiation process, scalar diffraction theory for apertures, transmission line modeling, and models for shielding are among the topics discussed. The accompanying disk contains four programs based on the models developed in the text and can be used to calculate diverse transmission line responses.

Download or read book Lumped Elements for RF and Microwave Circuits Second Edition written by Inder J. Bahl and published by Artech House. This book was released on 2022-12-31 with total page 593 pages. Available in PDF, EPUB and Kindle. Book excerpt: Fully updated and including entirely new chapters, this Second Edition provides in-depth coverage of the different types of RF and microwave circuit elements, including inductors, capacitors, resistors, transformers, via holes, airbridges, and crossovers. Featuring extensive formulas for lumped elements, design trade-offs, and an updated and current list of references, the book helps you understand the value and usefulness of lumped elements in the design of RF, microwave and millimeter wave components and circuits. You’ll find a balanced treatment between standalone lumped elements and their circuits using MICs, MMICs and RFICs technologies. You’ll also find detailed information on a broader range RFICs that was not available when the popular first edition was published. The book captures – in one consolidated volume -- the fundamentals, equations, modeling, examples, references and overall procedures to design, test and produce microwave components that are indispensable in industry and academia today. With its superb organization and expanded coverage of the subject, this is a must-have, go-to resource for practicing engineers and researchers in industry, government and university and microwave engineers working in the antenna area. Students will also find it a useful reference with its clear explanations, many examples and practical modeling guidelines.

Download or read book High speed Circuit Board Signal Integrity written by Stephen C. Thierauf and published by Artech House. This book was released on 2004 with total page 243 pages. Available in PDF, EPUB and Kindle. Book excerpt: As circuit boards are increasingly required to transmit signals at higher and higher speeds, signal and power integrity become increasingly crucial. Rules of thumb that you have used over and over again to prevent signal loss no longer apply to these new, high-speed, high-density circuit designs. This leading-edge circuit design resource offers you the knowledge needed to quickly pinpoint transmission problems that can compromise your entire circuit design. Discussing both design and debug issues at gigabit per second data rates, the book serves as a practical reference for your projects involving high-speed serial signaling on printed wiring boards.

Download or read book Thin Film Capacitors for Packaged Electronics written by Jain Pushkar and published by Springer Science & Business Media. This book was released on 2011-06-27 with total page 164 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials properties to limits of what's the best one can achieve in capacitor properties to process modeling to application examples. Some of the topics covered are the following: -Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structures, -Electrical characterization techniques for a wide range of frequencies (1 kHz to 20 GHz), -Process modeling to determine stable operating points, -Prevention of metal (Cu) diffusion into the dielectric, -Measurements and modeling of the dielectric micro-roughness.

Download or read book Interconnect Technology and Design for Gigascale Integration written by Jeffrey A. Davis and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 417 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.

Download or read book Electrical Connectors written by San Kyeong and published by John Wiley & Sons. This book was released on 2020-12-29 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discover the foundations and nuances of electrical connectors in this comprehensive and insightful resource Electrical Connectors: Design, Manufacture, Test, and Selection delivers a comprehensive discussion of electrical connectors, from the components and materials that comprise them to their classifications and underwater, power, and high-speed signal applications. Accomplished engineer and author Michael G. Pecht offers readers a thorough explanation of the key performance and reliability concerns and trade-offs involved in electrical connector selection. Readers, both at introductory and advanced levels, will discover the latest industry standards for performance, reliability, and safety assurance. The book discusses everything a student or practicing engineer might require to design, manufacture, or select a connector for any targeted application. The science of contact physics, contact finishes, housing materials, and the full connector assembly process are all discussed at length, as are test methods, performance, and guidelines for various applications. Electrical Connectors covers a wide variety of other relevant and current topics, like: A comprehensive description of all electrical connectors, including their materials, components, applications, and classifications A discussion of the design and manufacture of all parts of a connector Application-specific criteria for contact resistance, signal quality, and temperature rise An examination of key suppliers, materials used, and the different types of data provided A presentation of guidelines for end-users involved in connector selection and design Perfect for connector manufacturers who select, design, and assemble connectors for their products or the end users who concern themselves with operational reliability of the system in which they’re installed, Electrical Connectors also belongs on the bookshelves of students learning the basics of electrical contacts and those who seek a general reference with best-practice advice on how to choose and test connectors for targeted applications.

Download or read book Simulation Techniques and Solutions for Mixed Signal Coupling in Integrated Circuits written by Nishath K. Verghese and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 297 pages. Available in PDF, EPUB and Kindle. Book excerpt: The goal of putting `systems on a chip' has been a difficult challenge that is only recently being met. Since the world is `analog', putting systems on a chip requires putting analog interfaces on the same chip as digital processing functions. Since some processing functions are accomplished more efficiently in analog circuitry, chips with a large amount of analog and digital circuitry are being designed. Whether a small amount of analog circuitry is combined with varying amounts of digital circuitry or the other way around, the problem encountered in marrying analog and digital circuitry are the same but with different scope. Some of the most prevalent problems are chip/package capacitive and inductive coupling, ringing on the RLC tuned circuits that form the chip/package power supply rails and off-chip drivers and receivers, coupling between circuits through the chip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problems of designers who have to deal with the complexity of mixed-signal coupling there is a lack of verification techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuit designers must also model coupling through the common substrate when simulating ICs to obtain an accurate estimate of coupled noise in their designs. Unfortunately, accurate simulation of substrate coupling has only recently begun to receive attention, and techniques for the same are not widely known. Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits addresses two major issues of the mixed-signal coupling problem -- how to simulate it and how to overcome it. It identifies some of the problems that will be encountered, gives examples of actual hardware experiences, offers simulation techniques, and suggests possible solutions. Readers of this book should come away with a clear directive to simulate their design for interactions prior to building the design, versus a `build it and see' mentality.

Download or read book Power Distribution Network Design for VLSI written by Qing K. Zhu and published by John Wiley & Sons. This book was released on 2004-02-19 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt: A hands-on troubleshooting guide for VLSI network designers The primary goal in VLSI (very large scale integration) power network design is to provide enough power lines across a chip to reduce voltage drops from the power pads to the center of the chip. Voltage drops caused by the power network's metal lines coupled with transistor switching currents on the chip cause power supply noises that can affect circuit timing and performance, thus providing a constant challenge for designers of high-performance chips. Power Distribution Network Design for VLSI provides detailed information on this critical component of circuit design and physical integration for high-speed chips. A vital tool for professional engineers (especially those involved in the use of commercial tools), as well as graduate students of engineering, the text explains the design issues, guidelines, and CAD tools for the power distribution of the VLSI chip and package, and provides numerous examples for its effective application. Features of the text include: * An introduction to power distribution network design * Design perspectives, such as power network planning, layout specifications, decoupling capacitance insertion, modeling, and analysis * Electromigration phenomena * IR drop analysis methodology * Commands and user interfaces of the VoltageStorm(TM) CAD tool * Microprocessor design examples using on-chip power distribution * Flip-chip and package design issues * Power network measurement techniques from real silicon The author includes several case studies and a glossary of key words and basic terms to help readers understand and integrate basic concepts in VLSI design and power distribution.

Download or read book Advances in Electronic Engineering Communication and Management Vol 2 written by David Jin and published by Springer Science & Business Media. This book was released on 2012-01-18 with total page 687 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume presents the main results of 2011 International Conference on Electronic Engineering, Communication and Management (EECM2011) held December 24-25, 2011, Beijing China. The EECM2011 is an integrated conference providing a valuable opportunity for researchers, scholars and scientists to exchange their ideas face to face together. The main focus of the EECM 2011 and the present 2 volumes “Advances in Electronic Engineering, Communication and Management” is on Power Engineering, Electrical engineering applications, Electrical machines, as well as Communication and Information Systems Engineering. This volume presents the main results of 2011 International Conference on Electronic Engineering, Communication and Management (EECM2011) held December 24-25, 2011, Beijing China. The EECM2011 is an integrated conference providing a valuable opportunity for researchers, scholars and scientists to exchange their ideas face to face together. The main focus of the EECM 2011 and the present 2 volumes “Advances in Electronic Engineering, Communication and Management” is on Power Engineering, Electrical engineering applications, Electrical machines, as well as Communication and Information Systems Engineering.

Download or read book NMR Probeheads for Biophysical and Biomedical Experiments written by Joël Mispelter and published by World Scientific Publishing Company. This book was released on 2015-05-27 with total page 756 pages. Available in PDF, EPUB and Kindle. Book excerpt: NMR Probeheads for Biophysical and Biomedical Experiments 2nd Edition is essential reading for anyone in the field of NMR or MRI, from students to medical or biological scientists performing experiments under certain physical and/or geometrical conditions, unattainable by conventional or available probes. The material guides the reader through the most basic and comprehensive stages in accomplishing a correct probe design, from a very basic oscillating circuit to much more elaborate designs. This new edition has been revised and updated to include a chapter dedicated to RF components, which are commonly used for probes realization and their frequency-dependent characteristics. Another completely revised chapter concerns the multiple coil systems and discusses arrays coils, different decoupling methods, and some principles for interfacing coils with low-noise preamplifiers. The principles of linear circuit analysis are presented in a dedicated chapter. Last but not least, accompanying files containing updated software for probe design have been made available from the publisher's website. Request Inspection Copy

Download or read book The VLSI Handbook written by Wai-Kai Chen and published by CRC Press. This book was released on 2019-07-17 with total page 1788 pages. Available in PDF, EPUB and Kindle. Book excerpt: Over the years, the fundamentals of VLSI technology have evolved to include a wide range of topics and a broad range of practices. To encompass such a vast amount of knowledge, The VLSI Handbook focuses on the key concepts, models, and equations that enable the electrical engineer to analyze, design, and predict the behavior of very large-scale integrated circuits. It provides the most up-to-date information on IC technology you can find. Using frequent examples, the Handbook stresses the fundamental theory behind professional applications. Focusing not only on the traditional design methods, it contains all relevant sources of information and tools to assist you in performing your job. This includes software, databases, standards, seminars, conferences and more. The VLSI Handbook answers all your needs in one comprehensive volume at a level that will enlighten and refresh the knowledge of experienced engineers and educate the novice. This one-source reference keeps you current on new techniques and procedures and serves as a review for standard practice. It will be your first choice when looking for a solution.

Download or read book VLSI Technology written by Wai-Kai Chen and published by CRC Press. This book was released on 2003-03-19 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: As their name implies, VLSI systems involve the integration of various component systems. While all of these components systems are rooted in semiconductor manufacturing, they involve a broad range of technologies. This volume of the Principles and Applications of Engineering series examines the technologies associated with VLSI systems, including