Download or read book CAE CAD and Thermal Management Issues in Electronic Systems written by D. Agonafer and published by . This book was released on 1997 with total page 124 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of the November 1997 symposium. Twelve papers relate to the use of computer simulations to solve complex packaging problems related to thermo/mechanical problems. Topics include improving electronic packaging manufacturing through product and process-driven analysis; thermo-mechanical an

Download or read book Application of CAE CAD to Electronic Systems written by D. Agonafer and published by . This book was released on 1996 with total page 136 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of the November 1996 symposium sponsored by the Computer Aided Design for Electronic Packaging Committee of the Electrical and Electronic Packaging Division. Contains 15 papers, including several related to the use of computer simulations to solve complex packaging problems related to th

Download or read book Thermal and Power Management of Integrated Circuits written by Arman Vassighi and published by Springer Science & Business Media. This book was released on 2006-06-01 with total page 188 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.

Download or read book Area Array Interconnection Handbook written by Karl J. Puttlitz and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 1250 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.

Download or read book Electronics Manufacturing Issues written by Chittaranjan Sahay and published by . This book was released on 1999 with total page 188 pages. Available in PDF, EPUB and Kindle. Book excerpt: Contains papers from a November 1999 meeting on issues related to electronics packaging and manufacturing. Papers are grouped in sections on technologies in electronic manufacturing and packaging to increase productivity and quality; advanced electronic manufacturing, packaging, and process technolo

Download or read book Silicon Microchannel Heat Sinks written by Lian Zhang and published by Springer Science & Business Media. This book was released on 2013-03-14 with total page 148 pages. Available in PDF, EPUB and Kindle. Book excerpt: Two-phase microchannel cooling is one of the most promising thermal-management technologies for future high-power IC chips. Understanding the boiling process and the two-phase-flow behavior in microchannels is the key to successful implementation of a microchannel heat sink. This book focuses on the phase-change phenomena and the heat transfer in sub-150 nm diameter silicon microchannels, with emphasis on thermal measurement and modeling, and the impact of small dimensions on two-phase flow regimes.

Download or read book Advances in Numerical Heat Transfer Volume 2 written by W. Minkowycz and published by Routledge. This book was released on 2018-12-13 with total page 245 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume discusses the advances in numerical heat transfer modeling by applying high-performance computing resources, striking a balance between generic fundamentals, specific fundamentals, generic applications, and specific applications.

Download or read book Control and Dynamic Systems V59 Computer Aided Design Engineering Cad Cae Techniques And Their Applications Part 2 of 2 written by C.T. Leonides and published by Academic Press. This book was released on 2012-12-02 with total page 345 pages. Available in PDF, EPUB and Kindle. Book excerpt: Control and Dynamic Systems, Volume 59: Computer-Aided Design/Engineering (CAD/CAE) Techniques and Their Applications Part 2 of 2 is the second of a two-volume sequence that manifests the significance and the power of CAD/CAE techniques that are available and their further development for the essential role they play in the design of modern engineering systems. The volume contains 10 chapters and begins with an in-depth treatment of the essential integration that must exist between design and manufacturing systems. This is followed by separate chapters on object-oriented programming (OOP) and graphical user interface (GUI); technologies that support the CAD/CAE design process, in particular, by means of the PC and the workstation; and the role of a geometrically associative analysis modeler in the design optimization process. Subsequent chapters deal with finite analysis modeling for the integration of CAD/CAE technology and finite element method; the mechanical analysis of two large structures: the world's largest telescope the 8m ESO-VLT and a 3-D nuclear power plant heat exchanger; and techniques for CAD for electromagnetic systems and components. The final chapters cover aircraft structural design; techniques for determining the adequacy of the number of grids (i.e., grid quality control) in computational fluid dynamics (CFD); and techniques or the optimum design of control systems using system model variables and parameters. The contributions to this volume will provide a significant and, perhaps, unique reference source for students, research workers, practicing engineers, and others on the international scene for many years.

Download or read book Annual IEEE Semiconductor Thermal Measurement and Management Symposium written by and published by . This book was released on 1999 with total page 324 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Directory of Published Proceedings written by and published by . This book was released on 1998 with total page 424 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book CAE CAD Application to Electronic Packaging written by D. Agonafer and published by . This book was released on 1994 with total page 104 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Cooling and Thermal Design of Electronic Systems written by Cristina H. Amon and published by . This book was released on 1995 with total page 246 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book ITHERM written by and published by . This book was released on 2002 with total page 1150 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Journal of Electronic Packaging written by and published by . This book was released on 2003 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Thermal Management Handbook For Electronic Assemblies written by Jerry E. Sergent and published by McGraw Hill Professional. This book was released on 1998 with total page 386 pages. Available in PDF, EPUB and Kindle. Book excerpt: Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The "hands-on" guide to thermal management! In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.

Download or read book Proceedings written by and published by . This book was released on 2000 with total page 1796 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 1998 with total page 890 pages. Available in PDF, EPUB and Kindle. Book excerpt: