Download or read book Benefiting from Thermal and Mechanical Simulation in Micro Electronics written by G.Q. Zhang and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 195 pages. Available in PDF, EPUB and Kindle. Book excerpt: Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are:- LIST type="5" The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.
Download or read book Benefiting from thermal and mechanical simulation in micro electronics written by GQ Zhang and published by . This book was released on 2001-04-01 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of the 2nd International Conference on Benefiting from Thermal and Mechanical Simulation in Micro Electronics written by Leo J. Ernst and published by . This book was released on 2001 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Mechanics of Microelectronics written by G.Q. Zhang and published by Springer Science & Business Media. This book was released on 2006-08-25 with total page 580 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.
Download or read book Micro and Opto Electronic Materials and Structures Physics Mechanics Design Reliability Packaging written by Ephraim Suhir and published by Springer Science & Business Media. This book was released on 2007-05-26 with total page 1471 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Download or read book Proceedings of the 8th International Conference on Thermal Mechanical and Multi physics Simulation and Experiments in Micro Electronics and Micro Systems written by and published by . This book was released on 2007 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microelectronics Technology and Devices SBMICRO 2002 written by Electrochemical Society. Electronics Division and published by The Electrochemical Society. This book was released on 2002 with total page 506 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Lead free Electronics written by Sanka Ganesan and published by John Wiley & Sons. This book was released on 2006-02-17 with total page 804 pages. Available in PDF, EPUB and Kindle. Book excerpt: Lead-free Electronics provides guidance on the design and use of lead-free electronics as well as technical and legislative perspectives. All the complex challenges confronting the elec-tronics industry are skillfully addressed: * Complying with state legislation * Implementing the transition to lead-free electronics, including anticipating associated costs and potential supply chain issues * Understanding intellectual property issues in lead-free alloys and their applications, including licensing and infringement * Implementing cost effective manufacturing and testing * Reducing risks due to tin whiskers * Finding lead-free solutions in harsh environments such as in the automotive and telecommunications industries * Understanding the capabilities and limitations of conductive adhesives in lead-free interconnects * Devising solutions for lead-free, flip-chip interconnects in high-performance integrated circuit products Each chapter is written by leading experts in the field and carefully edited to ensure a consistent approach. Readers will find all the latest information, including the most recent data on cyclic thermomechanical deformation properties of lead-free SnAgCu alloys and a comparison of the properties of standard Sn-Pb versus lead-free alloys, using the energy partitioning approach. With legislative and market pressure to eliminate the use of lead in electronics manufacturing, this timely publication is essential reading for all engineers and professionals in the electronics industry.
Download or read book 2016 17th International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE written by and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Structural Integrity and Reliability in Electronics written by W.J. Plumbridge and published by Springer Science & Business Media. This book was released on 2007-05-08 with total page 341 pages. Available in PDF, EPUB and Kindle. Book excerpt: Knowledge itself is soon obsolete; It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuing miniaturisation and the anticipated abolition of lead containing solders, represents a major engineering challenge. The involvement of numerous disciplines; such as electrical, electronic, mechanical, manufacturing, and materials engineering together with physicists and computer specialists, adds to the complexity of the situation. Nevertheless, with electronics being the World's largest industrial sector, the potential rewards to the winners are substantial. This book aims to provide the ingredients for understanding, together with knowledge of reliability in interconnection technology and of the implementation of lead free solders. It is strongly contended that such a combination forms the necessary basis for greater structural integrity and enhanced performance The text is essentially in three parts: The intentions of the Part I component {The Materials Perspective, Chapters 1 6) are to present a snapshot of the current, but rapidly changing, global scene and to establish a firm understanding of the fundamentals surrounding interconnection performance. With potential readers possessing a broad spectrum of knowledge and expertise, this is essential. It could be argued that the reason for the limited progress made in this field to date has been due to the difficulties encountered in communicating effectively across the discipline boundaries.
Download or read book Journal of Microelectronics and Electronic Packaging written by and published by . This book was released on 2004 with total page 690 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book The Piezojunction Effect in Silicon Integrated Circuits and Sensors written by Fabiano Fruett and published by Springer Science & Business Media. This book was released on 2006-04-18 with total page 174 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes techniques that can reduce mechanical-stress-induced inaccuracy and long-term instability in chips. The authors also show that the piezojunction effect can be applied for new types of mechanical-sensor structures. Thermo-mechanical stress is induced when packaged chips cool down to the temperature of application.
Download or read book Thermal Mechanical and Multi physics Simulation and Experiments in Micro electronics and Micro systems written by L. J. Ernst and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2005-01-01 with total page 706 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Adhesives in Electronics written by M O Alam and published by Elsevier. This book was released on 2011-05-25 with total page 279 pages. Available in PDF, EPUB and Kindle. Book excerpt: Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques
Download or read book Moisture Sensitivity of Plastic Packages of IC Devices written by X.J. Fan and published by Springer Science & Business Media. This book was released on 2010-07-23 with total page 573 pages. Available in PDF, EPUB and Kindle. Book excerpt: Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
Download or read book The International Journal of Microcircuits and Electronic Packaging written by and published by . This book was released on 2002 with total page 186 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2016 17th International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE written by and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
