Download or read book Application of Chemical mechanical Polishing to Planarization of Surface micromachined Devises written by and published by . This book was released on 1996 with total page 6 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical-Mechanical Polishing (CMP) has emerged as an enabling technology for manufacturing multi-level metal interconnects used in high-density Integrated Circuits (IC). In this work we present extension of CMP from sub-micron IC manufacturing to fabrication of complex surface-micromachined Micro-ElectroMechanical Systems (MEMS). This planarization technique alleviates processing problems associated with fabrication of multi-level polysilicon structures, eliminates design constraints linked with non-planar topography, and provides an avenue for integrating different process technologies. We discuss the CMP process and present examples of the use of CMP in fabricating MEMS devices such as microengines, pressures sensors, and proof masses for accelerometers along with its use for monolithically integrating MEMS devices with microelectronics.
Download or read book Application of Chemical mechanical Polishing to Planarization of Surface micromachined Devices written by and published by . This book was released on 1996 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Chemical Mechanical Polishing written by and published by . This book was released on 1998 with total page 11 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical-Mechanical-Polishing (CMP), first used as a planarization technology in the manufacture of multi-level metal interconnects for high-density Integrated Circuits (IC), is readily adapted as an enabling technology in MicroElectroMechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining. The authors have demonstrated that CMP enhances the design and manufacturability of MEMS devices by eliminating several photolithographic definition and film etch issues generated by severe topography. In addition, CMP planarization readily allows multi-level polysilicon structures comprised of 4- or more levels of polysilicon, eliminates design compromise generated by non-planar topography, and provides an avenue for integrating different process technologies. A recent investigation has also shown that CMP is a valuable tool for assuring acceptable optical flatness of micro-optical components such as micromirrors. Examples of these enhancements include: an extension of polysilicon surface-micromachining fabrication to a 5-level technology, a method of monolithic integration of electronics and MEMS, and optically flat micromirrors.
Download or read book Microelectronic Applications of Chemical Mechanical Planarization written by Yuzhuo Li and published by John Wiley & Sons. This book was released on 2007-12-04 with total page 760 pages. Available in PDF, EPUB and Kindle. Book excerpt: An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.
Download or read book Chemical Mechanical Planarization VI written by Sudipta Seal and published by The Electrochemical Society. This book was released on 2003 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of the Symposium on Microstructures and Microfabricated Systems IV written by Henry G. Hughes and published by The Electrochemical Society. This book was released on 1998 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Chemical Mechanical Polishing 14 written by R. Rhoades and published by The Electrochemical Society. This book was released on 2016-09-21 with total page 93 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Chemical Mechanical Polishing Fundamentals and Challenges Volume 566 written by S. V. Babu and published by . This book was released on 2000-02-10 with total page 304 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Download or read book Chemical mechanical Polishing written by Soon Kang Huang and published by . This book was released on 1996 with total page 172 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Chemical mechanical Polishing written by and published by . This book was released on 1996 with total page 13 pages. Available in PDF, EPUB and Kindle. Book excerpt: The planarization technology of Chemical-Mechanical-Polishing (CMP), used for the manufacturing of multi-level metal interconnects for high-density Integrated Circuits (IC), is also readily adaptable as an enabling technology in Micro Electro Mechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining. CMP not only eases the design and manufacturability of MEMS devices by eliminating several photolithographic and film issues generated by severe topography, but also enables far greater flexibility with process complexity and associated designs. Thus, the CMP planarization technique alleviates processing problems associated with fabrication of multi-level polysilicon structures, eliminates design constraints linked with non-planar topography, and provides an avenue for integrating different process technologies. Examples of these enhancements include: an simpler extension of surface micromachining fabrication to multiple mechanical layers, a novel method of monolithic integration of electronics and MEMS, and a novel combination of bulk and surface micromachining.
Download or read book Advances in CMP Polishing Technologies written by Toshiro Doi and published by William Andrew. This book was released on 2011-12-06 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt: CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan
Download or read book Chemical Mechanical Planarization IV written by R. L. Opila and published by The Electrochemical Society. This book was released on 2001 with total page 350 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of the First International Symposium on Chemical Mechanical Planarization written by Iqbal Ali and published by The Electrochemical Society. This book was released on 1997 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book MEMS and Microstructures in Aerospace Applications written by Robert Osiander and published by CRC Press. This book was released on 2018-10-03 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: The promise of MEMS for aerospace applications has been germinating for years, and current advances bring the field to the very cusp of fruition. Reliability is chief among the challenges limiting the deployment of MEMS technologies in space, as the requirement of zero failure during the mission is quite stringent for this burgeoning field. MEMS and Microstructures in Aerospace Applications provides all the necessary tools to overcome these obstacles and take MEMS from the lab bench to beyond the exosphere. The book begins with an overview of MEMS development and provides several demonstrations of past and current examples of MEMS in space. From this platform, the discussion builds to fabrication technologies; the effect of space environmental factors on MEMS devices; and micro technologies for space systems, instrumentation, communications, thermal control, guidance navigation and control, and propulsion. Subsequent chapters explore factors common to all of the described systems, such as MEMS packaging, handling and contamination control, material selection for specific applications, reliability practices for design and application, and assurance practices. Edited and contributed by an outstanding team of leading experts from industry, academia, and national laboratories, MEMS and Microstructures in Aerospace Applications illuminates the path toward qualifying and integrating MEMS devices and instruments into future space missions and developing innovative satellite systems.
Download or read book Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect written by Jie Cheng and published by Springer. This book was released on 2017-09-06 with total page 148 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research.
Download or read book Use of Chemical Mechanical Polishing in Micromachining written by and published by . This book was released on 1998 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: A process for removing topography effects during fabrication of micromachines. A sacrificial oxide layer is deposited over a level containing functional elements with etched valleys between the elements such that the sacrificial layer has sufficient thickness to fill the valleys and extend in thickness upwards to the extent that the lowest point on the upper surface of the oxide layer is at least as high as the top surface of the functional elements in the covered level. The sacrificial oxide layer is then polished down and planarized by chemical-mechanical polishing. Another layer of functional elements is then formed upon this new planarized surface.
Download or read book Chemical Mechanical Polishing 10 written by G. Banerjee and published by The Electrochemical Society. This book was released on 2009-05 with total page 145 pages. Available in PDF, EPUB and Kindle. Book excerpt: The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Chemical Mechanical Polishing 10¿, held during the 215th meeting of The Electrochemical Society, in San Francisco, California from May 24 to 29, 2009.
