Download or read book Analysis and Solutions for Switching Noise Coupling in Mixed Signal ICs written by X. Aragones and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modern microelectronic design is characterized by the integration of full systems on a single die. These systems often include large high performance digital circuitry, high resolution analog parts, high driving I/O, and maybe RF sections. Designers of such systems are constantly faced with the challenge to achieve compatibility in electrical characteristics of every section: some circuitry presents fast transients and large consumption spikes, whereas others require quiet environments to achieve resolutions well beyond millivolts. Coupling between those sections is usually unavoidable, since the entire system shares the same silicon substrate bulk and the same package. Understanding the way coupling is produced, and knowing methods to isolate coupled circuitry, and how to apply every method, is then mandatory knowledge for every IC designer. Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs is an in-depth look at coupling through the common silicon substrate, and noise at the power supply lines. It explains the elementary knowledge needed to understand these phenomena and presents a review of previous works and new research results. The aim is to provide an understanding of the reasons for these particular ways of coupling, review and suggest solutions to noise coupling, and provide criteria to apply noise reduction. Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs is an ideal book, both as introductory material to noise-coupling problems in mixed-signal ICs, and for more advanced designers facing this problem.
Download or read book Analysis of Substrate Noise Coupling in Mixed Signal Integrated Circuits written by Cole Erwin Zemke and published by . This book was released on 2003 with total page 76 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Noise Coupling in System on Chip written by Thomas Noulis and published by CRC Press. This book was released on 2018-01-09 with total page 519 pages. Available in PDF, EPUB and Kindle. Book excerpt: Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.
Download or read book Substrate Noise written by Edoardo Charbon and published by Springer Science & Business Media. This book was released on 2007-05-08 with total page 178 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the past decade, substrate noise has had a constant and significant impact on the design of analog and mixed-signal integrated circuits. Only recently, with advances in chip miniaturization and innovative circuit design, has substrate noise begun to plague fully digital circuits as well. To combat the effects of substrate noise, heavily over-designed structures are generally adopted, thus seriously limiting the advantages of innovative technologies. Substrate Noise: Analysis and Optimization for IC Design addresses the main problems posed by substrate noise from both an IC and a CAD designer perspective. The effects of substrate noise on performance in digital, analog, and mixed-signal circuits are presented, along with the mechanisms underlying noise generation, injection, and transport. Popular solutions to the substrate noise problem and the trade-offs often debated by designers are extensively discussed. Non-traditional approaches as well as semi-automated techniques to combat substrate noise are also addressed. Substrate Noise: Analysis and Optimization for IC Design will be of interest to researchers and professionals interested in signal integrity, as well as to mixed signal and RF designers.
Download or read book Signal Integrity Effects in Custom IC and ASIC Designs written by Raminderpal Singh and published by John Wiley & Sons. This book was released on 2001-12-12 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt: "...offers a tutorial guide to IC designers who want to move to the next level of chip design by unlocking the secrets of signal integrity." —Jake Buurma, Senior Vice President, Worldwide Research & Development, Cadence Design Systems, Inc. Covers signal integrity effects in high performance Radio Frequency (RF) IC Brings together research papers from the past few years that address the broad range of issues faced by IC designers and CAD managers now and in the future A Wiley-IEEE Press publication
Download or read book Analyse Et Caract risation Des Couplages Substrat Et de la Connectique Dans Les Circuits 3D written by Fengyuan Sun and published by Editions Publibook. This book was released on 2016 with total page 178 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proposal of doubling the number of transistors on an IC chip (with minimum costs and subtle innovations) every 24 months by Gordon Moore in 1965 (the so-called called Moore's law) has been the most powerful driver for the emphasis of the microelectronics industry in the past 50 years. This law enhances lithography scaling and integration, in 2D, of all functions on a single chip, increasingly through system-on-chip (SOC). On the other hand, the integration of all these functions can be achieved through 3D integrations . Generally speaking, 3D integration consists of 3D IC packaging, 3D IC integration, and 3D Si integration. They are different and mostly the TSV (through-silicon via) separates 3D IC packaging from 3D IC/Si integrations since the latter two uses TSVs, but 3D IC packaging does not. TSV (with a new concept that every chip or interposer could have two surfaces with circuits) is the heart of 3D IC/Si integrations. Continued technology scaling together with the integration of disparate technologies in a single chip means that device performance continues to outstrip interconnect and packaging capabilities, and hence there exist many difficult engineering challenges, most notably in power management, noise isolation, and intra and inter-chip communication. 3D Si integration is the right way to go and compete with Moore's law (more than Moore versus more Moore). However, it is still a long way to go. In this book, Fengyuan SUN proposes new substrate network extraction techniques. Using this latter, the substrate coupling and loss in IC's can be analyzed. He implements some Green/TLM (Transmission Line Matrix) algorithms in MATLAB. It permits to extract impedances between any number of embedded contacts or/and TSVS. He does investigate models of high aspect ratio TSV, on both analytical and numerical methods electromagnetic simulations. This model enables to extract substrate and TSV impedance, S parameters and parasitic elements, considering the variable resistivity of the substrate. It is full compatible with SPICE-like solvers and should allow an investigation in depth of TSV impact on circuit performance.
Download or read book EDA for IC Implementation Circuit Design and Process Technology written by Luciano Lavagno and published by CRC Press. This book was released on 2018-10-03 with total page 608 pages. Available in PDF, EPUB and Kindle. Book excerpt: Presenting a comprehensive overview of the design automation algorithms, tools, and methodologies used to design integrated circuits, the Electronic Design Automation for Integrated Circuits Handbook is available in two volumes. The second volume, EDA for IC Implementation, Circuit Design, and Process Technology, thoroughly examines real-time logic to GDSII (a file format used to transfer data of semiconductor physical layout), analog/mixed signal design, physical verification, and technology CAD (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability at the nanoscale, power supply network design and analysis, design modeling, and much more. Save on the complete set.
Download or read book Substrate Noise Coupling in Analog RF Circuits written by Stephane Bronckers and published by Artech House. This book was released on 2010 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents case studies to illustrate that careful modeling of the assembly characteristics and layout details is required to bring simulations and measurements into agreement. Engineers learn how to use a proper combination of isolation structures and circuit techniques to make analog/RF circuits more immune to substrate noise. Topics include substrate noise propagation, passive isolation structures, noise couple in active devices, measuring the coupling mechanisms in analog/RF circuits, prediction of the impact of substrate noise on analog/RF circuits, and noise coupling in analog/RF systems.
Download or read book Integrated Circuit Design Power and Timing Modeling Optimization and Simulation written by Bertrand Hochet and published by Springer. This book was released on 2003-08-02 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: The International Workshop on Power and Timing Modeling, Optimization, and Simulation PATMOS 2002, was the 12th in a series of international workshops 1 previously held in several places in Europe. PATMOS has over the years evolved into a well-established and outstanding series of open European events on power and timing aspects of integrated circuit design. The increased interest, espe- ally in low-power design, has added further momentum to the interest in this workshop. Despite its growth, the workshop can still be considered as a very - cused conference, featuring high-level scienti?c presentations together with open discussions in a free and easy environment. This year, the workshop has been opened to both regular papers and poster presentations. The increasing number of worldwide high-quality submissions is a measure of the global interest of the international scienti?c community in the topics covered by PATMOS. The objective of this workshop is to provide a forum to discuss and inves- gate the emerging problems in the design methodologies and CAD-tools for the new generation of IC technologies. A major emphasis of the technical program is on speed and low-power aspects with particular regard to modeling, char- terization, design, and architectures. The technical program of PATMOS 2002 included nine sessions dedicated to most important and current topics on power and timing modeling, optimization, and simulation. The three invited talks try to give a global overview of the issues in low-power and/or high-performance circuit design.
Download or read book Modeling and Analysis of Thermally aware Substrate Noise Coupling in Nanometer scale Mixed signal ICs written by Injoon Jo and published by . This book was released on 2004 with total page 124 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Simulation Techniques and Solutions for Mixed Signal Coupling in Integrated Circuits written by Nishath K. Verghese and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 297 pages. Available in PDF, EPUB and Kindle. Book excerpt: The goal of putting `systems on a chip' has been a difficult challenge that is only recently being met. Since the world is `analog', putting systems on a chip requires putting analog interfaces on the same chip as digital processing functions. Since some processing functions are accomplished more efficiently in analog circuitry, chips with a large amount of analog and digital circuitry are being designed. Whether a small amount of analog circuitry is combined with varying amounts of digital circuitry or the other way around, the problem encountered in marrying analog and digital circuitry are the same but with different scope. Some of the most prevalent problems are chip/package capacitive and inductive coupling, ringing on the RLC tuned circuits that form the chip/package power supply rails and off-chip drivers and receivers, coupling between circuits through the chip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problems of designers who have to deal with the complexity of mixed-signal coupling there is a lack of verification techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuit designers must also model coupling through the common substrate when simulating ICs to obtain an accurate estimate of coupled noise in their designs. Unfortunately, accurate simulation of substrate coupling has only recently begun to receive attention, and techniques for the same are not widely known. Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits addresses two major issues of the mixed-signal coupling problem -- how to simulate it and how to overcome it. It identifies some of the problems that will be encountered, gives examples of actual hardware experiences, offers simulation techniques, and suggests possible solutions. Readers of this book should come away with a clear directive to simulate their design for interactions prior to building the design, versus a `build it and see' mentality.
Download or read book Substrate Noise Coupling in Mixed Signal ASICs written by Stéphane Donnay and published by Springer Science & Business Media. This book was released on 2006-05-31 with total page 311 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is the first in a series of three dedicated to advanced topics in Mixed-Signal IC design methodologies. It is one of the results achieved by the Mixed-Signal Design Cluster, an initiative launched in 1998 as part of the TARDIS project, funded by the European Commission within the ESPRIT-IV Framework. This initiative aims to promote the development of new design and test methodologies for Mixed-Signal ICs, and to accelerate their adoption by industrial users. As Microelectronics evolves, Mixed-Signal techniques are gaining a significant importance due to the wide spread of applications where an analog front-end is needed to drive a complex digital-processing subsystem. In this sense, Analog and Mixed-Signal circuits are recognized as a bottleneck for the market acceptance of Systems-On-Chip, because of the inherent difficulties involved in the design and test of these circuits. Specially, problems arising from the use of a common substrate for analog and digital components are a main limiting factor. The Mixed-Signal Cluster has been formed by a group of 11 Research and Development projects, plus a specific action to promote the dissemination of design methodologies, techniques, and supporting tools developed within the Cluster projects. The whole action, ending in July 2002, has been assigned an overall budget of more than 8 million EURO.
Download or read book Medical Imaging written by Krzysztof Iniewski and published by John Wiley & Sons. This book was released on 2009-03-23 with total page 324 pages. Available in PDF, EPUB and Kindle. Book excerpt: A must-read for anyone working in electronics in the healthcare sector This one-of-a-kind book addresses state-of-the-art integrated circuit design in the context of medical imaging of the human body. It explores new opportunities in ultrasound, computed tomography (CT), magnetic resonance imaging (MRI), nuclear medicine (PET, SPECT), emerging detector technologies, circuit design techniques, new materials, and innovative system approaches. Divided into four clear parts and with contributions from a panel of international experts, Medical Imaging systematically covers: X-ray imaging and computed tomography–X-ray and CT imaging principles; Active Matrix Flat Panel Imagers (AMFPI) for diagnostic medical imaging applications; photon counting and integrating readout circuits; noise coupling in digital X-ray imaging Nuclear medicine–SPECT and PET imaging principles; low-noise electronics for radiation sensors Ultrasound imaging–Electronics for diagnostic ultrasonic imaging Magnetic resonance imaging–Magnetic resonance imaging principles; MRI technology
Download or read book On Chip Current Sensors for Reliable Secure and Low Power Integrated Circuits written by Rodrigo Possamai Bastos and published by Springer Nature. This book was released on 2019-09-30 with total page 162 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with insight into an alternative approach for enhancing the reliability, security, and low power features of integrated circuit designs, related to transient faults, hardware Trojans, and power consumption. The authors explain how the addition of integrated sensors enables the detection of ionizing particles and how this information can be processed at a high layer. The discussion also includes a variety of applications, such as the detection of hardware Trojans and fault attacks, and how sensors can operate to provide different body bias levels and reduce power costs. Readers can benefit from these sensors-based approaches through designs with fast response time, non-intrusive integration on gate-level and reasonable design costs.
Download or read book Integrated Circuit and System Design Power and Timing Modeling Optimization and Simulation written by Johan Vounckx and published by Springer Science & Business Media. This book was released on 2006-09-08 with total page 691 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 16th International Workshop on Power and Timing Modeling, Optimization and Simulation, PATMOS 2006. The book presents 41 revised full papers and 23 revised poster papers together with 4 key notes and 3 industrial abstracts. Topical sections include high-level design, power estimation and modeling memory and register files, low-power digital circuits, busses and interconnects, low-power techniques, applications and SoC design, modeling, and more.
Download or read book Scientific Computing in Electrical Engineering written by Wilhelmus H. Schilders and published by Springer Science & Business Media. This book was released on 2004-08-11 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the proceedings of the 4th International Workshop "Scientific Computing in Electrical Engineering", held in Eindhoven, The Netherlands, from June 23-28, 2002. This workshop followed three earlier workshops held in 1997 at the Darmstadt University of Technology, in 1998 at the Weierstrass Institute for Applied Analysis and Stochastics, and in 2000 at the University of Rostock. The main topics of SCEE-2002 were computational electrodynamics, circuit simulation and coupled problems. The objective of the workshop, which was mainly directed at mathematicians and electrical engineers, was to bring together scientists from universities and industry with the goal of intensive discussions about modelling and numerical simulation of electronic circuits and electromagnetic fields. A special feature was the "Industry Day", where distinguished speakers discussed the needs of industry in the field of computational electromagnetics and circuit simulation. The book contains papers of invited and contributed talks, as well as from poster presentations.
Download or read book Simulation and Optimization of Digital Circuits written by Vazgen Melikyan and published by Springer. This book was released on 2018-04-12 with total page 365 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes new, fuzzy logic-based mathematical apparatus, which enable readers to work with continuous variables, while implementing whole circuit simulations with speed, similar to gate-level simulators and accuracy, similar to circuit-level simulators. The author demonstrates newly developed principles of digital integrated circuit simulation and optimization that take into consideration various external and internal destabilizing factors, influencing the operation of digital ICs. The discussion includes factors including radiation, ambient temperature, electromagnetic fields, and climatic conditions, as well as non-ideality of interconnects and power rails.
