Download or read book Advances in SiGe CMOS RFSOI and Phase Change Circuits for High Performance Phased Arrays written by Dimitrios Baltimas and published by . This book was released on 2022 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Although electronically steered arrays are a century old concept, the research and development interest was primarily driven by the defense industry and radio astronomy without any room for potential commercial applications due to the insurmountable cost. The insufficient beamformer chip performance made the implementation of large phased arrays with high effective isotropic radiated power (EIRP) and increased sensitivity prohibitive. Only with the recent advancements in silicon technologies was the cost barrier reduced to an extent that large phased array systems can be employed in a multitude of commercial applications. Particularly, developments in silicon beamformer chips have enabled the commercialization of phased arrays for 5G wireless communications, satellite communications (SATCOM) and > 100 GHz communication links. This dissertation focuses on the implementation of high performance beamformer chips in different technologies for low-cost and high performance phased array systems. It presents several implementations of ultra wideband switches along with a true-time delay unit from DC-67 GHz using a novel phase change material (PCM) switch that is utilized for the achievement of large instantaneous bandwidths. The presented TTD unit achieves a record 124 ps relative true time delay reported on an IC from DC-67 GHz. This dissertation also presents a K-Band 19-22 GHz Tx/Rx beamformer channel with a state of the art linearity and sensitivity performance. The chip can achieve a very competitive OP1dB / IIP3 (8 dBm / 0 dBm) while its NF is 7 dB leading to state-of-the-art sensitivity performance in K-Band. Finally, this dissertation presents a D-band full RF beamforming Rx channel at D-band. The full RF implementation of the phase shifter and the VGA is introduced at 140 GHz with a NF performance that substantiates this architecture as a potential candidate for D-band phased arrays along with its competitive phase, amplitude control and power dissipation. All presented beamformer chips, illustrate significant advancements in various performance aspects and can be utilized for the implementation of high performance phased arrays.
Download or read book Integrated 60ghz RF Beamforming in CMOS written by Yikun Yu and published by . This book was released on 2011-03-30 with total page 128 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Packaged X band Phased Arrays and High Data Rate Switching Matrices in Advanced CMOS Processes written by Donghyup Shin and published by . This book was released on 2013 with total page 123 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thesis explores two areas in RF integrated circuits. The first area of work is X-band phased-array design in CMOS technology. A receiver and a transmitter chip is designed, fabricated, measured on-wafer, and then packaged on printed-circuit boards using chip-on-board technique and in QFN modules to verify the reliable operation of silicon chip after packaging. The high-linearity four-element phased-array receiver for 9-10 GHz application is built using 0.13-[mu]m CMOS process with a single-ended design, and it results in a measured gain of 10 dB, an input P1dB 12.5 dBm, and a noise figure of 3.4 dB at 9.5 GHz. An rms gain error of 0.4 dB and phase error of 8° are obtained at 9-10 GHz using an integrated variable gain amplifier and an 11° phase trim bit. The 4-element X-band transmitter chip is also developed in 0.13-[mu]m CMOS technology. The design contains an active 1:4 power divider, active 5-bit phase shifters (lowest bit is used as a trim bit), 4-bit gain control (to reduce the rms gain error), and power amplifiers capable of delivering a PSAT of 13.5 dBm per channel at 8.5-10.5 GHz. The chip can be used in the linear mode for communication systems and in the saturated mode for FMCW radar systems. Packaging based on chip-on-board and QFN modules have been implemented, and both show a very small nearest neighbor coupling of ~-30 dB at 8-10 GHz, limited by bond-wire coupling. The second area of work is the switching matrices for high data-rate networking. Two generation of design is implemented and the first-generation is the 0.01-8-GHz 4×4 switch matrix in 0.13-[mu]m CMOS technology. A deep n-well series-shunt-series switch is chosen as the switching core, and the transistor sizes are optimized for low insertion loss and high isolation up to 8 GHz. A full electromagnetic analysis is performed on the switching core to result in a compact design with high isolation. The 4×4 switch matrix shows a measured insertion loss of 2.0-3.3 dB and an isolation of 50-44 dB at 2-8 GHz with near-zero power consumption. The measured input P1dB and IP3 are 8-10 and 26-30 dBm at 0.5-8 GHz. The switching matrix has very low dispersion with 6-ps group-delay variation and can switch a 12.5-Gb/s signal with a bit error rate of 10e-12. The second-generation switching matrix is implemented using IBM 45-nm SOI CMOS process, which offers advanced switch performance. The design is focused on the optical/digital wideband signal networking, and therefore optimization is done to maximize the bandwidth and minimize the added jitter after switching. A cross-point architecture with passive CMOS switch is used to achieve switching with near-zero power consumption. Scalability of all-passive design is maximized by introducing isolation switches placed after every 2×2 switching cells. An inductive-peaking buffers are used on passive-active design in order to further increase the bandwidth of the matrix. The measured 3-dB bandwidth of all-passive and passive-active design are 20-25 GHz and 26.5 GHz (measurement limit), with very low group delay variation of ±5 and ±2 psec, respectively. The eye-diagram measurement shows that all-passive design can transfer signals up to 30-Gbps and passive-active design can achieve up to 44-Gbps of data-rate. The scalability of passive-active design ensures constant 3-dB bandwidth up to more than 12×12 matrix.
Download or read book Millimeter wave Wafer Scale Phased Arrays and Wireless Communication Circuits and Systems in SiGe and CMOS Technology written by Woorim Shin and published by . This book was released on 2013 with total page 95 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thesis presents a W-band wafer-scale phased array transmitter with high efficiency on-chip antennas. The 4x4 phased array is based on an RF beamforming architecture with an equiphase distribution network and 2-bit phase shifters placed in every element. The differential on-chip antennas are implemented using a 100 um thick quartz superstrate and have an efficiency of ~45% at 110 GHz. The use of electromagnetically coupled antenna leads to wafer-scale phased array concept with simple integration method. The phased array transmitter is implemented in 0.18 [mu]m SiGe BiCMOS process, and the measurement shows an array gain of 26.5 dB, pattern directivity of 17.0 dBi, maximum EIRP of 23-25 dBm at 108-114 GHz. The direct pattern measurement from the phased array transmitter shows beam steering capabilities up to plus/minus ±30° in two orthogonal directions. This is the first demonstration of wafer-scale phased array in silicon technology. Millimeter-wave circuit components in 45nm SOI CMOS technology are also presented. Transmission-line based D-band common-source and cascode amplifers are designed with the peak gain of 8.7 dB at 147 GHz and 6.1 dB at 171 GHz, respectively. The experimental characterization of the technology shows that on-chip passive elements has low-quality factor, and it can offset performance advantage of the active devices. A 60 GHz active phased shifter with quadrature all-pass filter shows -4 dB insertion gain with
Download or read book Single Chip 64 and 256 Element Wafer Scale Phased Arrays and Communication Circuits in Advanced SiGe and CMOS Technologies written by Samet Zihir and published by . This book was released on 2015 with total page 106 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of millimeter-wave phased arrays has been mostly based on silicon RFIC chips containing 8-16 channels and connected to antennas on organic printed circuit boards, or on wafer-scale phased arrays with on-chip antennas. Extending the wafer-scale array to a large number of elements results in an un-surmountable challenge, mainly that the phased-array chip may be much larger than a full reticle (approximately 22x22 mm2), and this is not allowed using standard integrated circuit design and layout rules. This dissertation focuses on the implementation of wafer-scale phased array with 64- and 256-elements using sub-reticle stitching techniques. An implementation of the largest single-chip wafer-scale phased-array ever built is demonstrated. The measured EIRP is 38 dBm and 45 dBm, with measured half-power beamwidth of 12.5 and 6 at 61 GHz for the 64- and 256-element phased arrays, respectively. This work allows the construction of large-scale (1000+ elements) phased-array systems, either on a single wafer or by assembling several of these chips together on a low cost board.
Download or read book W band Phased Array Systems Using Silicon Integrated Circuits written by Sang Young Kim and published by . This book was released on 2012 with total page 102 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thesis demonstrates the silicon-based on-chip W-band phased array systems. An improved wideband I/Q network to minimize the capacitive loading problem is presented, and its implementation in a 60-80 GHz active phase shifter using 0.13 [mu]m SiGe BiCMOS process is demonstrated. In addition, a 67-78 GHz 4-bit passive phase shifter using low-pass pi-network and 0.13 [mu]m CMOS switches is demonstrated. By adding amplifiers to the passive phase shifter with the architecture of alternating amplifiers and phase shifter cells, a low-power BiCMOS 4-element phased array receiver for 76-84 GHz applications are presented. Lastly, a 76-84 GHz 16-element phased array receiver, designed differentially in order to reduce the sensitivity to packaging effect such as ground inductance, is presented. This thesis presents the silicon-based on-chip W-band phased array systems. An improved quadrature all-pass filter (QAF) and its implementation in 60-80 GHz active phase shifter using 0.13 [mu]m SiGe BiCMOS technology is presented. It is demonstrated that with the inclusion of an Rs/R in the high Q branches of C and L, the sensitivity to the loading capacitance, therefore the I/Q phase and amplitude errors are minimized. This technique is especially suited for wideband millimeter-wave circuits where the loading capacitance (CL) is comparable to the filter capacitance (C). A prototype 60-80 GHz active phased shifter using the improved QAF is demonstrated. The overall chip size is 1.15 x 0.92 mm2 with the power consumption of 108 mW. The measured S11 and S22 are -10 dB at 60-80 GHz and 60-73 GHz, respectively. The measured average power gain is 11.0-14.7 dB at 60-79 GHz with the rms gain error of 1.3 dB at 60-78 GHz for 4-bit phase states. And the rms phase error is 9.1° at 60-78.5 GHz showing wideband 4-bit performance. The measured NF is 9-11.6 dB at 63-75 GHz and the measured P1dB is -27 dBm at 70 GHz. In another project, a 67-78 GHz 4-bit passive phase shifter using 0.13 um CMOS switches is demonstrated. The phase shifter is based on a low-pass pi-network. The chip size is 0.45 x 0.3 mm2 without pads and consumes virtually no power. The measured S11 and S22 is -10 dB at 67-81 GHz for all 16 phase states. The measured gain of 4-bit phase shifter is -19.2 +/- 3.7 dB at 77 GHz with the rms gain error of
Download or read book SiGe Integrated Circuits for Millimeter wave Imaging and Phased Arrays written by Jason W. May and published by . This book was released on 2009 with total page 119 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2021 IEEE Radio Frequency Integrated Circuits Symposium RFIC written by IEEE Staff and published by . This book was released on 2021-06-07 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: RFIC is the premier IC Conference focused on the latest developments in RF Microwave, and Millimeter Wave Integrated Circuit Technology and Innovation
Download or read book Fabless written by Daniel Nenni and published by Createspace Independent Publishing Platform. This book was released on 2014 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: The purpose of this book is to illustrate the magnificence of the fabless semiconductor ecosystem, and to give credit where credit is due. We trace the history of the semiconductor industry from both a technical and business perspective. We argue that the development of the fabless business model was a key enabler of the growth in semiconductors since the mid-1980s. Because business models, as much as the technology, are what keep us thrilled with new gadgets year after year, we focus on the evolution of the electronics business. We also invited key players in the industry to contribute chapters. These "In Their Own Words" chapters allow the heavyweights of the industry to tell their corporate history for themselves, focusing on the industry developments (both in technology and business models) that made them successful, and how they in turn drive the further evolution of the semiconductor industry.
Download or read book NANO CHIPS 2030 written by Boris Murmann and published by Springer Nature. This book was released on 2020-06-08 with total page 597 pages. Available in PDF, EPUB and Kindle. Book excerpt: In this book, a global team of experts from academia, research institutes and industry presents their vision on how new nano-chip architectures will enable the performance and energy efficiency needed for AI-driven advancements in autonomous mobility, healthcare, and man-machine cooperation. Recent reviews of the status quo, as presented in CHIPS 2020 (Springer), have prompted the need for an urgent reassessment of opportunities in nanoelectronic information technology. As such, this book explores the foundations of a new era in nanoelectronics that will drive progress in intelligent chip systems for energy-efficient information technology, on-chip deep learning for data analytics, and quantum computing. Given its scope, this book provides a timely compendium that hopes to inspire and shape the future of nanoelectronics in the decades to come.
Download or read book Silicon Systems for Wireless LAN written by Zoran Stamenkovic and published by World Scientific Publishing (Uk)Limited. This book was released on 2020-09-14 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: Today's integrated silicon circuits and systems for wireless communications are of a huge complexity. This unique compendium covers all the steps (from the system-level to the transistor-level) necessary to design, model, verify, implement, and test a silicon system. It bridges the gap between the system-world and the transistor-world (between communication, system, circuit, device, and test engineers). It is extremely important nowadays (and will be more important in the future) for communication, system, and circuit engineers to understand the physical implications of system and circuit solutions based on hardware/software co-design as well as for device and test engineers to cope with the system and circuit requirements in terms of power, speed, and data throughput.
Download or read book 2020 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium BCICTS written by IEEE Staff and published by . This book was released on 2020-11-16 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The IEEE BiCMOS and Compound semiconductor Integrated Circuits and Technology Symposium (BCICTS) is the forum for developments in bipolar, BiCMOS, and compound semiconductor integrated circuits, devices, and technology Coverage includes all aspects of the technology, from materials, device fabrication, device phenomena, TCAD modeling, compact modeling, integrated circuit design, testing, and system applications A wide range of integrated circuit technologies are covered including bipolar, BiCMOS, SiGe, GaAs, GaN, InP, SiC, and CMOS The latest results in wireless, analog, RF, microwave, high speed digital, mixed signal, optoelectronic, millimeter wave, and THz integrated circuits are embraced
Download or read book Nanowire Electronics written by Guozhen Shen and published by Springer. This book was released on 2018-11-23 with total page 396 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gives a comprehensive overview of recent advances in developing nanowires for building various kinds of electronic devices. Specifically the applications of nanowires in detectors, sensors, circuits, energy storage and conversion, etc., are reviewed in detail by the experts in this field. Growth methods of different kinds of nanowires are also covered when discussing the electronic applications. Through discussing these cutting edge researches, the future directions of nanowire electronics are identified.
Download or read book Microelectronics Electromagnetics and Telecommunications written by Jaume Anguera and published by Springer. This book was released on 2018-01-25 with total page 892 pages. Available in PDF, EPUB and Kindle. Book excerpt: The volume contains 94 best selected research papers presented at the Third International Conference on Micro Electronics, Electromagnetics and Telecommunications (ICMEET 2017) The conference was held during 09-10, September, 2017 at Department of Electronics and Communication Engineering, BVRIT Hyderabad College of Engineering for Women, Hyderabad, Telangana, India. The volume includes original and application based research papers on microelectronics, electromagnetics, telecommunications, wireless communications, signal/speech/video processing and embedded systems.
Download or read book Advanced Techniques in RF Power Amplifier Design written by Steve C. Cripps and published by Artech House. This book was released on 2002 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt: This much-anticipated volume builds on the author's best selling and classic work, RF Power Amplifiers for Wireless Communications (Artech House, 1999), offering experienced engineers a more in-depth understanding of the theory and design of RF power amplifiers. An invaluable reference tool for RF, digital and system level designers, the book includes discussions on the most critical topics for professionals in the field, including envelope power management schemes and linearization.
Download or read book Sensor Technology Handbook written by Jon S. Wilson and published by Newnes. This book was released on 2005 with total page 706 pages. Available in PDF, EPUB and Kindle. Book excerpt: Sensor fundamentals -- Application considerations -- Measurement issues and criteria -- Sensor signal conditioning -- Acceleration, shock and vibration sensors -- Biosensors -- Chemical sensors -- Capacitive and inductive displacement sensors -- Electromagnetism in sensing -- Flow and level sensors -- Force, load and weight sensors -- Humidity sensors -- Machinery vibration monitoring sensors -- Optical and radiation sensors -- Position and motion sensors -- Pressure sensors -- Sensors for mechanical shock -- Test and measurement microphones -- Strain gages -- Temperature sensors -- Nanotechnology-enabled sensors -- Wireless sensor networks: principles and applications.
Download or read book Electronic Components and Systems written by W. H. Dennis and published by Elsevier. This book was released on 2013-10-22 with total page 273 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic Components and Systems focuses on the principles and processes in the field of electronics and the integrated circuit. Covered in the book are basic aspects and physical fundamentals; different types of materials involved in the field; and passive and active electronic components such as capacitors, inductors, diodes, and transistors. Also covered in the book are topics such as the fabrication of semiconductors and integrated circuits; analog circuitry; digital logic technology; and microprocessors. The monograph is recommended for beginning electrical engineers who would like to know the fundamental concepts, theories, and processes in the related fields.
